Wrap-like transfer printing for three-dimensional curvy electronics

3D Conformal Curvy Electronics: Design, Fabrication, and Application

Owing to their excellent conformability and functional advantages derived from spatially induced structures, 3D conformal curvy electronics have garnered attention for their emerging applications in biomedical healthcare, soft machines, curvy imagers, etc. In this perspective, the historical evolution of 3D conformal curvy electronics is summarized, with representative examples highlighted and developmental trends outlined. The design strategies of 3D conformal curvy electronics are discussed across materials, structures, interfaces, and conformability assessment. Subsequently, diverse fabrication technologies are reviewed, including direct fabrication, conformal transfer printing, and conformal shape reconfiguration. Afterward, the typical applications of 3D conformal curvy electronics are presented, classified by integration with biological tissues, machines, and function-engineered curvy surfaces. Finally, the existing challenges and potential research directions are provided for further exploration.

Three-Dimensionally Architected Tactile Electronic Skins

Tactile electronic skins (e-skins) are flexible electronic devices that aim to replicate tactile sensing capabilities of the human skin, while possessing skin-like geometric features and materials properties. Since the human skin is composed of complex 3D constructions, where the various types of mechanoreceptors are distributed in a spatial layout, an important trend of tactile e-skin development involves introduction of 3D device architectures that can replicate certain structural features of human skins. The resulting 3D architected e-skins have demonstrated advantages in the detection of shear forces and the decoupled perception of multiple mechanical stimuli, which are of pivotal importance in many application scenarios. In this perspective, we summarize the main biological prototypes of existing 3D architected e-skins, and focus on the key 3D architectures related to tactile sensing capabilities. Then we highlight the enhanced tactile perception of 3D architected e-skins in terms of the super-resolution tactile sensing and predictions of diverse physical properties and surface features of an object, which allow for a broad spectrum of practical applications, such as object recognition, human-machine interactions, dexterous manipulation, and health monitoring. Finally, we discuss scientific challenges and opportunities for future developments of 3D architected tactile e-skins.

Soft Materials and Devices Enabling Sensorimotor Functions in Soft Robots

Sensorimotor functions, the seamless integration of sensing, decision-making, and actuation, are fundamental for robots to interact with their environments. Inspired by biological systems, the incorporation of soft materials and devices into robotics holds significant promise for enhancing these functions. However, current robotics systems often lack the autonomy and intelligence observed in nature due to limited sensorimotor integration, particularly in flexible sensing and actuation. As the field progresses toward soft, flexible, and stretchable materials, developing such materials and devices becomes increasingly critical for advanced robotics. Despite rapid advancements individually in soft materials and flexible devices, their combined applications to enable sensorimotor capabilities in robots are emerging. This review addresses this emerging field by providing a comprehensive overview of soft materials and devices that enable sensorimotor functions in robots. We delve into the latest development in soft sensing technologies, actuation mechanism, structural designs, and fabrication techniques. Additionally, we explore strategies for sensorimotor control, the integration of artificial intelligence (AI), and practical application across various domains such as healthcare, augmented and virtual reality, and exploration. By drawing parallels with biological systems, this review aims to guide future research and development in soft robots, ultimately enhancing the autonomy and adaptability of robots in unstructured environments.

Velocity-Adaptive Electrohydrodynamic Printing for Microscale Conformal Circuits on Freeform Curved Surfaces

High-resolution printing of conformal circuits on curved surfaces is critical to achieving structure-function integration in electromechanically coupled components like antennas. However, existing printing techniques such as inkjet or extrusion-based printing fail to conformally deposit microscale conductive circuits on freeform curved surfaces with curvature variations. Herein, we propose an innovative electrohydrodynamic (EHD) printing strategy that can adaptively adjust the nozzle-to-substrate distance and printing velocity according to surface curvature, enabling the direct printing of conductive circuits on diverse curved surfaces with microscale resolution and high uniformity. A path-planning algorithm is developed based on the target surface morphology captured from the scanned 3D point cloud data. The printing velocity at each point along the printing trajectory can be adaptively calculated according to the Gaussian curvature and mapping angle. This strategy makes the deposition rate well match the stage's moving speed, facilitating the uniform EHD printing of conductive patterns with a line width of 39.31 ± 4.06 μm on different surfaces with curvatures ranging from 10 to 2000 m-1. As a proof of concept, a uniform snowflake pattern with good conductivity is EHD printing on a naturally insulated conch with the smallest line width of 35.74 ± 4.24 μm. A metasurface with microscale conductive feature arrays is specially printed on a radome-shaped polymeric surface, exhibiting dual-band cloaking and reduced scattering characteristics compared to conventional metal substrates. We envision that the proposed velocity-adaptive EHD printing technique would mature into a promising and versatile tool to fabricate microscale conductive circuits on diverse curved surfaces for potential applications in conformal antennas and functional sensing or electromagnetic surfaces.

Bioinspired balloon catheter integrated with stretchable "flounder" electrodes under high voltage for uniform pulsed field ablation

Atrial fibrillation leads to severe diseases such as heart failure and strokes. While catheter ablation is prevalent for the treatment, existing techniques hardly can achieve both tissue selectivity and ablation uniformity. Here, we propose a bioinspired strategy for balloon-based pulsed field ablation (PFA) systems based on "flounder" electrodes. Inspired by a flounder skeleton and citrus peels, the microfabricated electrodes are ultrathin, stretchable, and have a scattered configuration, withstanding large balloon deformation (87% compression), high voltage (1200 volts), and owning exceptional tissue conformability (720° twists). Mechanical-electrical coupled stimulation optimizes balloon electrodes with hemispherical electric field uniformity. A water lily-inspired transfer printing method enables one-step integration of multielectrodes with the balloon. A comprehensive PFA system is complemented, achieving ablation depths of 3.8 millimeters (potato), 3.1 millimeters (rabbit), and 2.3 millimeters (swine) with good uniformity and electrophysiological isolation. These results shed light on the quantitative design of PFA systems, with high potential for more precise, safe, and effective catheter ablation therapies.

Precision-induced localized molten liquid metal stamps for damage-free transfer printing of ultrathin membranes and 3D objects

Transfer printing, a crucial technique for heterogeneous integration, has gained attention for enabling unconventional layouts and high-performance electronic systems. Elastomer stamps are typically used for transfer printing, where localized heating for elastomer stamp can effectively control the transfer process. A key challenge is the potential damage to ultrathin membranes from the contact force of elastic stamps, especially with fragile inorganic nanomembranes. Herein, we present a precision-induced localized molten technique that employs either laser-induced transient heating or hotplate-induced directional heating to precisely melt solid gallium (Ga). By leveraging the fluidity of localized molten Ga, which provides gentle contact force and exceptional conformal adaptability, this technique avoids damage to fragile thin films and improves operational reliability compared to fully liquefied Ga stamps. Furthermore, the phase transition of Ga provides a reversible adhesion with high adhesion switchability. Once solidified, the Ga stamp hardens and securely adheres to the micro/nano-membrane during the pick-up process. The solidified stamp also exhibits the capability to maneuver arbitrarily shaped objects by generating a substantial grip force through the interlocking effects. Such a robust, damage-free, simply operable protocol illustrates its promising capabilities in transfer printing diverse ultrathin membranes and objects on complex surfaces for developing high-performance unconventional electronics.

Phase-Change Stamp with Highly Switchable Adhesion and Stiffness for Damage-Free Multiscale Transfer Printing

Transfer printing is a technology widely used in the production of flexible electronics and vertically stacked devices, which involves the transfer of predefined electronic components from a rigid donor substrate to a receiver substrate with a stamp, potentially avoiding the limitations associated with lithographic processes. However, the stamps typically used in transfer printing have several limitations related to unwanted organic solvents, substantial loading, film damage, and inadequate adhesion switching ratios. This study introduces a thermally responsive phase-change stamp for efficient and damage-free transfer printing inspired by the adhesion properties observed during water freezing and ice melting. The stamp employs phase-change composites and simple fabrication protocols, providing robust initial adhesion strength and switchability. The underlying mechanism of switchable adhesion is investigated through experimental and numerical studies. Notably, the stamp eliminates the need for extra preload by spontaneously interlocking with the ink through in situ melting and crystallization. This minimizes ink damage and wrinkle formation during pickup while maintaining strong initial adhesion. During printing, the stamp exhibits a sufficiently weak adhesion state for reliable and consistent release, enabling multiscale, conformal, and damage-free transfer printing, ranging from nano- to wafer-scale. The fabrication of nanoscale short-channel transistors, epidermal electrodes, and human-machine interfaces highlights the potential of this technique in various emerging applications of nanoelectronics, nano optoelectronics, and soft bioelectronics.

Scalable Fabrication of Large-Scale, 3D, and Stretchable Circuits

Stretchable electronics have demonstrated excellent potential in wearable healthcare and conformal integration. Achieving the scalable fabrication of stretchable devices with high functional density is the cornerstone to enable the practical applications of stretchable electronics. Here, a comprehensive methodology for realizing large-scale, 3D, and stretchable circuits (3D-LSC) is reported. The soft copper-clad laminate (S-CCL) based on the "cast and cure" process facilitates patterning the planar interconnects with the scale beyond 1 m. With the ability to form through, buried and blind VIAs in the multilayer stack of S-CCLs, high functional density can be achieved by further creating vertical interconnects in stacked S-CCLs. The application of temporary bonding substrate effectively minimizes the misalignments caused by residual strain and thermal strain. 3D-LSC enables the batch production of stretchable skin patches based on five-layer stretchable circuits, which can serve as a miniaturized system for physiological signals monitoring with wireless power delivery. The fabrications of conformal antenna and stretchable light-emitting diode display further illustrate the potential of 3D-LSC in realizing large-scale stretchable devices.

Designs and Applications for the Multimodal Flexible Hybrid Epidermal Electronic Systems

Research on the flexible hybrid epidermal electronic system (FHEES) has attracted considerable attention due to its potential applications in human-machine interaction and healthcare. Through material and structural innovations, FHEES combines the advantages of traditional stiff electronic devices and flexible electronic technology, enabling it to be worn conformally on the skin while retaining complex system functionality. FHEESs use multimodal sensing to enhance the identification accuracy of the wearer's motion modes, intentions, or health status, thus realizing more comprehensive physiological signal acquisition. However, the heterogeneous integration of soft and stiff components makes balancing comfort and performance in designing and implementing multimodal FHEESs challenging. Herein, multimodal FHEESs are first introduced in 2 types based on their different system structure: all-in-one and assembled, reflecting totally different heterogeneous integration strategies. Characteristics and the key design issues (such as interconnect design, interface strategy, substrate selection, etc.) of the 2 multimodal FHEESs are emphasized. Besides, the applications and advantages of the 2 multimodal FHEESs in recent research have been presented, with a focus on the control and medical fields. Finally, the prospects and challenges of the multimodal FHEES are discussed.

Flexible Organic Photovoltaic-Powered Hydrogel Bioelectronic Dressing With Biomimetic Electrical Stimulation for Healing Infected Diabetic Wounds

Electrical stimulation (ES) is proposed as a therapeutic solution for managing chronic wounds. However, its widespread clinical adoption is limited by the requirement of additional extracorporeal devices to power ES-based wound dressings. In this study, a novel sandwich-structured photovoltaic microcurrent hydrogel dressing (PMH dressing) is designed for treating diabetic wounds. This innovative dressing comprises flexible organic photovoltaic (OPV) cells, a flexible micro-electro-mechanical systems (MEMS) electrode, and a multifunctional hydrogel serving as an electrode-tissue interface. The PMH dressing is engineered to administer ES, mimicking the physiological injury current occurring naturally in wounds when exposed to light; thus, facilitating wound healing. In vitro experiments are performed to validate the PMH dressing's exceptional biocompatibility and robust antibacterial properties. In vivo experiments and proteomic analysis reveal that the proposed PMH dressing significantly accelerates the healing of infected diabetic wounds by enhancing extracellular matrix regeneration, eliminating bacteria, regulating inflammatory responses, and modulating vascular functions. Therefore, the PMH dressing is a potent, versatile, and effective solution for diabetic wound care, paving the way for advancements in wireless ES wound dressings.

Switchable Adhesive Based on Shape Memory Polymer with Micropillars of Different Heights for Laser-Driven Noncontact Transfer Printing

Switchable adhesive is essential to develop transfer printing, which is an advanced heterogeneous material integration technique for developing electronic systems. Designing a switchable adhesive with strong adhesion strength that can also be easily eliminated to enable noncontact transfer printing still remains a challenge. Here, we report a simple yet robust design of switchable adhesive based on a thermally responsive shape memory polymer with micropillars of different heights. The adhesive takes advantage of the shape-fixing property of shape memory polymer to provide strong adhesion for a reliable pick-up and the various levels of shape recovery of micropillars under laser heating to eliminate the adhesion for robust printing in a noncontact way. Systematic experimental and numerical studies reveal the adhesion switch mechanism and provide insights into the design of switchable adhesives. This switchable adhesive design provides a good solution to develop laser-driven noncontact transfer printing with the capability of eliminating the influence of receivers on the performance of transfer printing. Demonstrations of transfer printing of silicon wafers, microscale Si platelets, and micro light emitting diode (μ-LED) chips onto various challenging nonadhesive receivers (e.g., sandpaper, stainless steel bead, leaf, or glass) to form desired two-dimensional or three-dimensional layouts illustrate its great potential in deterministic assembly.

Laser-driven noncontact bubble transfer printing via a hydrogel composite stamp

Transfer printing that enables heterogeneous integration of materials into spatially organized, functional arrangements is essential for developing unconventional electronic systems. Here, we report a laser-driven noncontact bubble transfer printing via a hydrogel composite stamp, which features a circular reservoir filled with hydrogel inside a stamp body and encapsulated by a laser absorption layer and an adhesion layer. This composite structure of stamp provides a reversible thermal controlled adhesion in a rapid manner through the liquid-gas phase transition of water in the hydrogel. The ultrasoft nature of hydrogel minimizes the influence of preload on the pick-up performance, which offers a strong interfacial adhesion under a small preload for a reliable damage-free pick-up. The strong light-matter interaction at the interface induces a liquid-gas phase transition to form a bulge on the stamp surface, which eliminates the interfacial adhesion for a successful noncontact printing. Demonstrations of noncontact transfer printing of microscale Si platelets onto various challenging nonadhesive surfaces (e.g., glass, key, wrench, steel sphere, dry petal, droplet) in two-dimensional or three-dimensional layouts illustrate the unusual capabilities for deterministic assembly to develop unconventional electronic systems such as flexible inorganic electronics, curved electronics, and micro-LED display.

Mechanically-Guided 3D Assembly for Architected Flexible Electronics

Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.