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Cheng C, Shi WH, Teng TP, Yang CR. Evaluation of Surfactants on Graphene Dispersion and Thermal Performance for Heat Dissipation Coating. Polymers (Basel) 2022; 14:polym14050952. [PMID: 35267775 PMCID: PMC8912673 DOI: 10.3390/polym14050952] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/06/2022] [Revised: 02/24/2022] [Accepted: 02/25/2022] [Indexed: 02/04/2023] Open
Abstract
With the development of thin and high-power electronic devices, heat dissipation has become an important and urgent issue in thermal management. In this study, a water-based epoxy was used as a polymer matrix to prepare heat dissipation coatings utilizing low volatile organic compounds, which were environmentally friendly and had a high heat-dissipating performance. Graphene flakes, multi-walled carbon nanotubes and aluminum oxide particles were used as fillers for preparing the heat dissipation coating. The graphene flakes and multi-walled carbon nanotubes were dispersed in a water-based epoxy by adding sodium dihexyl sulfosuccinate and poly (dimethyldiallylammonium chloride). These two surfactants were combined as a dispersant to improve the dispersibility of the carbon nanomaterials in the water-based epoxy. The synergistic effect of the well-dispersed fillers improved the heat-dissipating performance. The experimental results show that the infrared emissivity of the heat dissipation film was 0.96 after filling 30 wt% aluminum oxide particles, 2 wt% graphene flakes and 2 wt% multi-walled carbon nanotubes into a water-based epoxy. The heat dissipation film reduced the thermal equilibrium temperature of the bare copper panel by 17.8 °C under a heating power of 10 W. The film was applied in a heat dissipation test on a 15 W LED bulb, and the thermal equilibrium temperature was reduced by 21.3 °C. The results demonstrate that the carbon nanomaterial-based heat dissipation coating with a water-based epoxy could significantly reduce the thermal equilibrium temperature, giving a high potential for the application of thermal management.
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Affiliation(s)
- Chia Cheng
- Department of Mechatronic Engineering, National Taiwan Normal University, No. 162, Sec. 1, He-ping E. Road, Da-an District, Taipei City 10610, Taiwan; (C.C.); (W.-H.S.)
| | - Wen-Hao Shi
- Department of Mechatronic Engineering, National Taiwan Normal University, No. 162, Sec. 1, He-ping E. Road, Da-an District, Taipei City 10610, Taiwan; (C.C.); (W.-H.S.)
| | - Tun-Ping Teng
- Undergraduate Program of Vehicle and Energy Engineering, National Taiwan Normal University, No. 162, Sec. 1, He-ping E. Road, Da-an District, Taipei City 10610, Taiwan
- Correspondence: (T.-P.T.); (C.-R.Y.); Tel.: +886-2-77493358 (T.-P.T.); +886-2-77493506 (C.-R.Y.)
| | - Chii-Rong Yang
- Department of Mechatronic Engineering, National Taiwan Normal University, No. 162, Sec. 1, He-ping E. Road, Da-an District, Taipei City 10610, Taiwan; (C.C.); (W.-H.S.)
- Correspondence: (T.-P.T.); (C.-R.Y.); Tel.: +886-2-77493358 (T.-P.T.); +886-2-77493506 (C.-R.Y.)
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