Elements of a hybrid interconnection theory

Toward an optimal foundation architecture for optoelectronic computing. Part II. Physical construction and application platforms

Various issues pertaining to the physical construction of systems that are based on regularly interconnected device planes, such as heat removal and extensibility of the optical interconnections for larger systems, are discussed. Regularly interconnected device planes constitute a foundation architecture that is reasonably close to the best possible as defined by physical limitations. Three application platforms based on the foundation architecture described are offered.

Toward an optimal foundation architecture for optoelectronic computing. Part I. Regularly interconnected device planes

By systematically examining the tree of possibilities for optoelectronic computing architectures and offering arguments that allow one to prune suboptimal branches of this tree, I come to the conclusion that electronic circuit planes interconnected optically according to regular connection patterns represent an alternative that is reasonably close to the best possible, as defined by physical limitations. Thus I propose that this foundation architecture should provide a basis for future research and development in this area.

Digital Fourier optics

Analog Fourier optical processing systems can perform important classes of signal processing operations in parallel, but suffer from limited accuracy. Digital-optical equivalents of such systems could be built that share many features of the analog systems while allowing greater accuracy. We show that the digital equivalent of any system consisting of an arbitrary number of lenses, niters, spatial light modulators, and sections of free space can be constructed. There are many possible applications for such systems as well as many alternative technologies for constructing them; this paper stresses the potential of free-space interconnected active-device-plane-based optoelectronic architectures as a digital signal processing environment. Implementation of the active-device planes through hybridization of optoelectronic components with silicon electronics should allow the realization of systems whose performance exceeds that of purely electronic systems.

Design considerations and algorithms for partitioning optoelectronic multichip modules

There is considerable interest in the development of optical interconnects for multichip modules (MCM's) to improve their performance. For effective utilization of the optical and electronic technologies, a methodology for partitioning the system is required. The key question to be answered is which technology should be used for each interconnect in a given netlist: optical or electronic. We introduce the computer-aided design approach for partitioning optoelectronic systems into optoelectronic MCM's. We first discuss the design trade-off issues in an optoelectronic system design, including speed, power dissipation, area, and diffraction limits for free-space optics. We then define a formulation for optoelectronic MCM partitioning and describe new algorithms for optimizing this partitioning based on the minimization of the power dissipation. The models for the algorithms are discussed in detail, and an example of a multistage interconnect network is given. Different results, with the number and size of chips being variable, are presented in which improvement for the system packaging has been observed when the partitioning algorithms are applied.