Coherence scanning and phase imaging optical interference microscopy at the lateral resolution limit

Simulation-driven machine learning approach for high-speed correction of slope-dependent error in coherence scanning interferometry

Slope-dependent error often occurs in the coherence scanning interferometry (CSI) measurement of functional engineering surfaces with complex geometries. Previous studies have shown that these errors can be corrected through the characterization and phase inversion of the instrument's three-dimensional (3D) surface transfer function. However, since CSI instrument is usually not completely shift-invariant, the 3D surface transfer function characterization and correction must be repeated for different regions of the full field of view, resulting in a long computational process and a reduction of measurement efficiency. In this work, we introduce a machine learning approach based on a deep neural network that is trainable for slope-dependent error correction in CSI. Our method leverages a deep neural network to directly learn errors characteristics from simulated surface measurements provided by a previously validated physics-based virtual CSI method. The experimental results demonstrate that the trained network is capable of correcting the surface height map with 1024 × 1024 sampling points within 0.1 seconds, covering a 178 µm field of view. The accuracy is comparable to the previous phase inversion approach while the new method is two orders of magnitude faster under the same computational condition.

Three-dimensional transfer function of optical microscopes in reflection mode

Three-dimensional (3D) transfer functions build the basis for a comprehensive characterization of optical imaging systems in the spatial frequency domain. Utilizing the projection-slice theorem, the 2D modulation transfer function of an incoherent imaging system can be derived from a 3D transfer function by integration with respect to the axial spatial frequency. For a diffraction limited microscope with homogeneous incoherent pupil illumination, the modulation transfer function equals the 2D autocorrelation function of a circular disc. However, until now to the best of our knowledge no 3D transfer function has been published, which exactly leads to the 2D modulation transfer function of a diffraction limited microscope in reflection mode. In this article, we derive a formula, which after integration with respect to the axial spatial frequency coordinate perfectly fits to the diffraction limited 2D modulation transfer function. The inverse three-dimensional Fourier transform of the 3D transfer function results in a complex-valued 3D point spread function, from which the depth of field, the lateral resolution and, in addition, the corresponding 3D point spread function of both, a conventional and an interference microscope, can be obtained.

Scattering and three-dimensional imaging in surface topography measuring interference microscopy

Surface topography measuring interference microscopy is a three-dimensional (3D) imaging technique that provides quantitative analysis of industrial and biomedical specimens. Many different instrument modalities and configurations exist, but they all share the same theoretical foundation. In this paper, we discuss a unified theoretical framework for 3D image (interferogram) formation in interference microscopy. We show how the scattered amplitude is linearly related to the surface topography according to the Born and the Kirchhoff approximations and highlight the main differences and similarities of each. With reference to the Ewald and McCutchen spheres, the relationship between the spatial frequencies that characterize the illuminating and scattered waves, and those that characterize the object, are defined and formulated as a 3D linear filtering process. It is shown that for the case of near planar surfaces, the 3D filtering process can be reduced to two dimensions under the small height approximation. However, the unified 3D framework provides significant additional insight into the scanning methods used in interference microscopy, effects such as interferometric defocus and ways to mitigate errors introduced by aberrations of the optical system. Furthermore, it is possible to include the nonlinear effects of multiple scattering into the generalized framework. Finally, we consider the inherent nonlinearities introduced when estimating surface topography from the recorded interferogram.

3D modeling of coherence scanning interferometry on 2D surfaces using FEM

Despite the fact that optical profilers, such as coherence scanning interferometers, are frequently used for fast and contactless topography measurements in various fields of application, measured profiles still suffer from the wave characteristics of light, which leads to systematic deviations that are still not sufficiently investigated. In order to analyze these systematic deviations and their physical relations, we apply a rigorous simulation model considering both the transfer characteristics of the measurement instrument as well as the geometry and material of different measurement objects. Simulation results are compared to measurement results for different polarizations, wavelengths and interferometer types, considering surface structures including edges, slopes and different materials as the main reasons for those deviations. Compared to former publications, a full three-dimensional (3D) modeling of the image formation with regard to two-dimensional (2D) surface structures is provided. The advantages of 3D modeling in contrast to a time efficient 2D approach are discussed. Further, an extract of an atomic force microscope (AFM) measurement result is used as the basis for the FEM simulation in one example in order to achieve most realistic simulation results.

Gap-matching algorithm with the impCEEMDAN in scanning white-light interference microscopy

Coherence scanning interferometry (CSI) is a common optical measurement method for measuring three-dimensional surface profiles. However, batwings and ghost steps are common obstacles in CSI. In this paper, we proposed a gap-matching algorithm with the improved complete ensemble empirical mode decomposition with adaptive noise (impCEEMDAN) to solve the above two obstacles without any priori knowledge of the surface geometry from the tested sample. A micro-component with 500 nm and 1200 nm step heights and a 10 µm standard step of were used as test samples to evaluate the accuracy of the proposed method. Simulations and experimental results show that this approach can effectively suppress the batwings effect and eliminate the ghost steps. Experiments also confirm that the approach has good accuracy and repeatability.

Microsphere-assisted interferometry with high numerical apertures for 3D topography measurements

Improving the lateral resolution is a key focus of the research on optical measuring systems to expand the fields of application for optical metrology. By means of microspheres put on an object in a microscope, and therefore used as a near-field support, it has already been shown that a superresolution of structures below Abbe's diffraction limit is possible. The following investigations give more detailed theoretical and experimental insight into the physical mechanisms responsible for the transition of near-field information to the far field. In particular, the effects of microspheres as near-field support on the behavior of phase-evaluating interference microscopes close to the optical resolution limit are studied experimentally as well as with numerical simulations. Special attention is drawn to measured data taken with a Linnik microscope of high numerical aperture. Finally, the measurement results of grating structures with a period below Abbe's diffraction limit are presented.

A review of selected topics in interferometric optical metrology

This review gathers together 15 special topics in modern interferometric metrology representing a sampling of historical, current and future developments. The selected topics cover a wide range of applications, including distance and displacement measurement, the testing of optical components, interference microscopy for surface structure analysis, form and dimensional measurements of industrial parts, and recent applications in semiconductor manufacturing and consumer electronics. Techniques range from laser Fizeau systems to dynamic ellipsometry using polarized heterodyne interferometry.