Nanomembrane transfer process for intricate photonic device applications

Mechanically-flexible wafer-scale integrated-photonics fabrication platform

The field of integrated photonics has advanced rapidly due to wafer-scale fabrication, with integrated-photonics platforms and fabrication processes being demonstrated at both infrared and visible wavelengths. However, these demonstrations have primarily focused on fabrication processes on silicon substrates that result in rigid photonic wafers and chips, which limit the potential application spaces. There are many application areas that would benefit from mechanically-flexible integrated-photonics wafers, such as wearable healthcare monitors and pliable displays. Although there have been demonstrations of mechanically-flexible photonics fabrication, they have been limited to fabrication processes on the individual device or chip scale, which limits scalability. In this paper, we propose, develop, and experimentally characterize the first 300-mm wafer-scale platform and fabrication process that results in mechanically-flexible photonic wafers and chips. First, we develop and describe the 300-mm wafer-scale CMOS-compatible flexible platform and fabrication process. Next, we experimentally demonstrate key optical functionality at visible wavelengths, including chip coupling, waveguide routing, and passive devices. Then, we perform a bend-durability study to characterize the mechanical flexibility of the photonic chips, demonstrating bending a single chip 2000 times down to a bend diameter of 0.5 inch with no degradation in the optical performance. Finally, we experimentally characterize polarization-rotation effects induced by bending the flexible photonic chips. This work will enable the field of integrated photonics to advance into new application areas that require flexible photonic chips.

Full-colour nanoprint-hologram synchronous metasurface with arbitrary hue-saturation-brightness control

The colour gamut, a two-dimensional (2D) colour space primarily comprising hue and saturation (HS), lays the most important foundation for the colour display and printing industries. Recently, the metasurface has been considered a promising paradigm for nanoprinting and holographic imaging, demonstrating a subwavelength image resolution, a flat profile, high durability, and multi-functionalities. Much effort has been devoted to broaden the 2D HS plane, also known as the CIE map. However, the brightness (B), as the carrier of chiaroscuro information, has long been neglected in metasurface-based nanoprinting or holograms due to the challenge in realising arbitrary and simultaneous control of full-colour HSB tuning in a passive device. Here, we report a dielectric metasurface made of crystal silicon nanoblocks, which achieves not only tailorable coverage of the primary colours red, green and blue (RGB) but also intensity control of the individual colours. The colour gamut is hence extruded from the 2D CIE to a complete 3D HSB space. Moreover, thanks to the independent control of the RGB intensity and phase, we further show that a single-layer silicon metasurface could simultaneously exhibit arbitrary HSB colour nanoprinting and a full-colour hologram image. Our findings open up possibilities for high-resolution and high-fidelity optical security devices as well as advanced cryptographic approaches.

Foldable and Cytocompatible Sol-gel TiO2 Photonics

Integrated photonics provides a miniaturized and potentially implantable platform to manipulate and enhance the interactions between light and biological molecules or tissues in in-vitro and in-vivo settings, and is thus being increasingly adopted in a wide cross-section of biomedical applications ranging from disease diagnosis to optogenetic neuromodulation. However, the mechanical rigidity of substrates traditionally used for photonic integration is fundamentally incompatible with soft biological tissues. Cytotoxicity of materials and chemicals used in photonic device processing imposes another constraint towards these biophotonic applications. Here we present thin film TiO2 as a viable material for biocompatible and flexible integrated photonics. Amorphous TiO2 films were deposited using a low temperature (<250 °C) sol-gel process fully compatible with monolithic integration on plastic substrates. High-index-contrast flexible optical waveguides and resonators were fabricated using the sol-gel TiO2 material, and resonator quality factors up to 20,000 were measured. Following a multi-neutral-axis mechanical design, these devices exhibit remarkable mechanical flexibility, and can sustain repeated folding without compromising their optical performance. Finally, we validated the low cytotoxicity of the sol-gel TiO2 devices through in-vitro cell culture tests. These results demonstrate the potential of sol-gel TiO2 as a promising material platform for novel biophotonic devices.

Heterogeneously integrated silicon photonics for the mid-infrared and spectroscopic sensing

Besides being the foundational material for microelectronics, crystalline silicon has long been used for the production of infrared lenses and mirrors. More recently, silicon has become the key material to achieve large-scale integration of photonic devices for on-chip optical interconnect and signal processing. For optics, silicon has significant advantages: it offers a very high refractive index and is highly transparent in the spectral range from 1.2 to 8 μm. To fully exploit silicon’s superior performance in a remarkably broad range and to enable new optoelectronic functionalities, here we describe a general method to integrate silicon photonic devices on arbitrary foreign substrates. In particular, we apply the technique to integrate silicon microring resonators on mid-infrared compatible substrates for operation in the mid-infrared. These high-performance mid-infrared optical resonators are utilized to demonstrate, for the first time, on-chip cavity-enhanced mid-infrared spectroscopic analysis of organic chemicals with a limit of detection of less than 0.1 ng.

Integrated silicon and silicon nitride photonic circuits on flexible substrates

Flexible integrated photonic devices based on crystalline materials on plastic substrates have a promising potential in many unconventional applications. In this Letter, we demonstrate a fully integrated photonic system including ring resonators and grating couplers, based on both crystalline silicon and silicon nitride, on flexible plastic substrate by using the stamping-transfer method. A high yield has been achieved by a simple, yet reliable transfer method without significant performance degradation.

Efficient light coupling into in-plane semiconductor nanomembrane photonic devices utilizing a sub-wavelength grating coupler

We report a subwavelength grating (SWG) coupler for coupling light efficiently into in-plane semiconductor nanomembrane photonic devices for the first time. The SWG coupler consists of a periodic array of rectangular trenches fabricated on a silicon nanomembrane (SiNM) transferred onto a glass substrate. At a wavelength of 1555.56 nm, the coupling efficiency of the fabricated 10 µm wide, 17.1 µm long SWG is 39.17% (-4.07 dB), with 1 dB and 3 dB bandwidths of 29 nm and 57 nm, respectively. Peak efficiency varies by 0.26 dB when measuring 5 fabricated grating pairs. Coupling efficiency can further be improved with an improved SiNM transfer process. Such high efficiency couplers allow for the successful realization of a plethora of hybrid photonic devices utilizing nanomembrane technology.

Stamp printing of silicon-nanomembrane-based photonic devices onto flexible substrates with a suspended configuration

In this Letter, we demonstrate for the first time (to our best knowledge) stamp printing of silicon nanomembrane (SiNM)-based in-plane photonic devices onto a flexible substrate using a modified transfer printing method that utilizes a suspended configuration, which can adjust the adhesion between the released SiNM and the "handle" silicon wafer. With this method, 230 nm thick, 30 μm wide, and up to 5.7 cm long SiNM-based waveguides are transferred to flexible Kapton films with >90% transfer yield. The propagation loss of the transferred waveguides is measured to be ~1.1 dB/cm. Scalability of this approach to transfer intricate structures, such as photonic crystal waveguides and multimode interference couplers with a minimum feature size of 200 nm and 2 μm, respectively, is also demonstrated.