Direct optical wire bonding through open-to-air polymerization for silicon photonic chips

Fiber-to-Chip Three-Dimensional Silicon-on-Insulator Edge Couplers with High Efficiency and Tolerance

The edge coupler is an indispensable optical device for connecting an external fiber and on-chip waveguide. The coupling efficiency of the edge coupler affects the effective integration of optical circuits. In this study, three-dimensional (3D) edge couplers with high efficiency and tolerance are proposed. The high coupling efficiency of the 3D edge couplers is verified by theoretical calculations. Three couplers are fabricated on a thick-silicon platform via 3D grayscale lithography. At the 1550 nm band, the fiber-to-chip experimental data show that the maximum coupling efficiencies of the three edge couplers are 0.70 dB and 1.34 dB, 0.80 dB and 1.60 dB, and 1.00 dB and 1.14 dB for the TE and TM modes, respectively. At the 1550 nm band, misalignment tolerances measurement data reveal 0.8 dB/0.9 dB tolerance of ±5 μm in the horizontal direction, and 1.7 dB/1.0 dB tolerance of ±2 μm in the vertical direction for TE/TM mode. This study provides a new idea for the design of 3D edge couplers and demonstrates significant superiority in research and industrial applications.

Direct ink writing 3D-printed optical waveguides for multi-layer interconnect

Low-cost, short-range optical interconnect technology plays an indispensable role in high-speed board-level data communications. In general, 3D printing technology can easily and quickly produce optical components with free-form shapes, while the traditional manufacturing process is complicated and time-consuming. Here, we present a direct ink writing 3D-printing technology to fabricate optical waveguides for optical interconnects. The waveguide core is 3D printed optical polymethylmethacrylate (PMMA) polymer, with propagation loss of 0.21 dB/cm at 980 nm, 0.42 dB/cm at 1310 nm, and 1.08 dB/cm at 1550 nm, respectively. Furthermore, a high-density multilayer waveguide arrays, including a four-layer waveguide arrays with a total of 144 waveguide channels, is demonstrated. Error-free data transmission at 30 Gb/s is achieved for each waveguide channel, indicating that the printing method can produce optical waveguides with excellent optical transmission performance. We believe this simple, low-cost, highly flexible, and environmentally friendly method has great potential for high-speed short-range optical interconnects.

Topological inverse design of fabrication-constrained nanophotonic devices via an adaptive projection method

Topology optimization has been widely adopted in the inverse design of nanophotonic devices due to low computation cost, which unfortunately produces intermediate relative permittivity values that fail to meet fabrication constraints. Additionally, the postprocessing required inevitably increases the complexity of the inverse design. In this Letter, we propose an adaptive projection method for topology optimization, in which a two-level hierarchical hyperbolic tangent projection function with linear increment and differentiation is constructed and applied to eliminate inherent defects of conventional topology optimization. Two binarized nanophotonic devices have been designed by our adaptive projection method, among which one ultra-compact dual 90°-bend waveguide reduces the average insertion loss to 20.3% of its similar counterpart and shows an 8.1% reduction for the average crosstalk in the O band, the other ultralow-loss waveguide crossing features an average insertion loss as low as 0.09 dB. With the significant advantages of excellent performance guarantee and fabrication-friendly geometry control fully demonstrated, our inverse design solution shows potential to contribute to nanophotonic devices and integrated chips.

Direct optical wire bonding through open-to-air polymerization for silicon photonic chips: publisher's note

This publisher's note contains a correction to Opt. Lett. 47, 714 (2022).