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For: Bouchard H, Azelmad A, Currie J, Meunier M, Blain S, Darwall T. Thermal Stress in Doped Silicate Glasses (B,P) Deposited by PECVD and LPCVD. ACTA ACUST UNITED AC 2011. [DOI: 10.1557/proc-308-63] [Citation(s) in RCA: 6] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/13/2022]
Number Cited by Other Article(s)
1
Influence of underlying interlevel dielectric films on extrusion formation in aluminum interconnects. ACTA ACUST UNITED AC 2000. [DOI: 10.1116/1.1319691] [Citation(s) in RCA: 18] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
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