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Citation(s) in
RCA
4
(from Reference Citation Analysis)
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For:
Kluge-Weiss P
, Gobrecht J.
Directly Bonded Copper Metallization of AℓN Substrates for Power Hybrids.
ACTA ACUST UNITED AC
2011. [DOI:
10.1557/proc-40-399
]
[
Citation(s) in
RCA
: 22
]
[
Impact Index Per Article: 1.7
]
[
Reference Citation Analysis
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[Indexed: 11/13/2022]
Number
Cited by Other Article(s)
1
Eutectic bonding of copper to ceramics for thermal dissipation applications – A review.
Ann Ital Chir
2014. [DOI:
10.1016/j.jeurceramsoc.2014.07.011
]
[
Citation(s) in
RCA
: 32
]
[
Impact Index Per Article: 3.2
]
[
Reference Citation Analysis
]
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[Indexed: 11/19/2022]
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2
Susnitzky D
, Summerfelt S, Carter C. Metal-Ceramic Interphase Interfaces: Preparation and Structural Characterization.
ACTA ACUST UNITED AC
2011. [DOI:
10.1557/proc-122-541
]
[
Citation(s) in
RCA
: 5
]
[
Impact Index Per Article: 0.4
]
[
Reference Citation Analysis
]
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[Indexed: 11/13/2022]
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3
Chung-Daw Young
, Jenq-Gong Duh. Bonding mechanism of electroless Ni-P film with AlN substrate and Cu foil.
ACTA ACUST UNITED AC
1998. [DOI:
10.1109/95.705482
]
[
Citation(s) in
RCA
: 5
]
[
Impact Index Per Article: 0.2
]
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[Indexed: 11/08/2022]
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4
Suryanarayana D
, Matienzo L, Spencer D. Behavior of aluminum nitride ceramic surfaces under hydrothermal oxidation treatments.
ACTA ACUST UNITED AC
1989. [DOI:
10.1109/33.49017
]
[
Citation(s) in
RCA
: 6
]
[
Impact Index Per Article: 0.2
]
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[Indexed: 11/08/2022]
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