Effect of Isothermal Aging and Copper Substrate Roughness on the SAC305 Solder Joint Intermetallic Layer Growth of High Temperature Storage (HTS)

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to the long-term performance of electronic products. One of the most important factors which are known to influence solder joint reliability is the intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is due to its brittle nature. This paper reviews the formation and growth of IMCs in lead-free solder joints detailing the effect of alloying additions, surface finishes, aging time, aging temperature and solder volume. The formation and growth of the brittle IMCs were significantly affected by these factors and could be possibly controlled. This review may be used as a basis in understanding the major factors effecting the IMC formation and growth and relating it to the reliability of solder joints.