Investigation of Solvent-Assisted In-Mold Bonding of Cyclic Olefin Copolymer (COC) Microfluidic Chips

The bonding of microfluidic chips is an essential process to enclose microchannels or microchambers in a lab-on-a-chip. In order to improve the bonding quality while reducing the fabrication time, a solvent-assisted bonding strategy was proposed to seal the microchannels immediately after the cover sheet and substrate chip was injection molded in a single mold. Proper organic solvents were selected and the influences of solvent ratios on the surface roughness, microchannel morphology, and contact angle of microfluidic chips were investigated. When the solvent bonding was integrated in the mold, the influences of solvent volume fraction, solvent dosage, bonding pressure, and bonding time on the bonding quality were analyzed. Results show that the solvent cyclohexane needs to be mixed with isopropanol to reduce the dissolution effect. Solvent treatment is suggested to be performed on the cover sheet with a cyclohexane volume fraction of 70% and a dose of 1.5 mL, a bonding pressure of 2 MPa, and a bonding time of 240 s. The bonding strength reaches 913 kPa with the optimized parameters, while the microchannel deformation was controlled below 8%.

Molecular Dynamics Simulation on the Effect of Bonding Pressure on Thermal Bonding of Polymer Microfluidic Chip

Thermal bonding technology is the most commonly used approach in bonding injection-molded microfluidic chips. Although the bonding mechanism is still under debate, the molecular dynamics (MD) method can provide insight into the bonding process on a macromolecular level. In this study, MD simulations for thermal bonding of PMMA substrate and cover sheet were performed. The molecule configuration and density distribution during the thermal bonding process were studied. The effects of bonding pressure on the equivalent strain, joining energy and diffusion coefficient were investigated. The debonding process was simulated to analyze the bonding strength and failure mechanism. Simulation results show that penetration mainly takes place near the interface area. Although the final density increases slightly with increasing pressure, the bonding interface is still insufficiently filled. The equivalent strain grows faster than that in the later stage because of the gap at the interface. The bonding pressure shows clear effects on the joining energy, diffusion coefficient and stress–strain behavior. Tensile failure occurs at the interface, with PMMA chains stretched between two layers. The majority of the change in potential energy is correlated with the change in non-bonded energy. At yield strain, the low-density defect at the interface weakens the tensile strength of bonded chip.

PMMA Micro-Pillar Forming in Micro Channel by Hot Embossing

Micro-pillars forming in micro channels have been implemented by hot embossing. With dry etching and chrome photo mask, the silicon mold was fabricated using lithography process for manufacturing micro-pillars in micro channels. The hot embossing experiments are executed on the embossing machine by embossing the PMMA substrate and the silicon mold. Making the polymer filling in the concave cavity of the silicon mold is a difficulty, so the laws of polymer filling in the concave cavity were researched. The effects of three key embossing parameters including pressure, temperature and time on the PMMA replication accuracy were studied, and the optimal molding parameters were obtained. This work is instructive to fabricate microfluidic chips with micro-pillars.