Mechanical Performances of Phenolic Modified Epoxy Resins at Room and High Temperatures

Novel Reactive Polyhedral Oligomeric Silsesquioxane-Reinforced and Toughened Epoxy Resins for Advanced Composites

Most toughening methods for epoxy resins are usually used at the expense of other properties. Some polyhedral oligomeric silsesquioxanes (POSSs) with both a rigid Si-O-Si structure and flexible organic chain segments could be expected to be effective toughening agents. In this study, three reactive polyhedral oligomeric silsesquioxanes with a thiol group (OMPPS), a carboxyl group (OCOPS), and an epoxy group (OGCPS) were synthesized and characterized. They were utilized as modifiers to toughen 3-(oxiran-2-ylmethoxy)-N,N-bis(oxiran-2-ylmethyl)aniline (AFG-90MH)/4,4'-methylenebis(2-ethylaniline) (MOEA) (epoxy resin) with different molar ratios to obtain hybrid resins named OMPPS-EP-i, OCOPS-EP-j, and OGCPS-EP-k. The effects of the amount of modifier added and the length of the organic chain on the cage structure on various properties of the hybrid resins were investigated. The results show that all three modifiers show good compatibility with the epoxy resin. The hybrid resins have a low viscosity at 45~85 °C and can be cured at a low temperature (110 °C). The cured hybrid resins display improved toughness. Typically, the critical stress intensity factor (KIC) and impact strength of OGCPS-EP-0.6-C are 2.54 MPa∙m-1/2 and 19.33 kJ∙m-2, respectively, which increased by 58.75% and 22.48% compared with the pristine epoxy resin, respectively. In addition, the glass transition temperature and flexural strength of the hybrid resins are basically unchanged.

Molecular dynamics study on the influence of thermal aging on the mechanical properties of epoxy resins for high voltage bushing

CONTEXT

Thermal aging significantly deteriorates the mechanical properties and service performance of epoxy resins used for the high-voltage bushing. Current studies on the thermal aging behavior of epoxy resins mainly focus on experimental observations. However, an in-depth understanding of the mechanism of thermal aging of epoxy resins requires the monitoring of structural evolution of epoxy resins during thermal aging at the molecular level. To thoroughly analyze the intrinsic factors affecting structural evolution and the effect of thermal aging on the mechanical properties of epoxy resin for high-voltage bushing, epoxy resin models with different crosslinking degrees were established and thermal aging treatments at various temperatures and time periods were carried out by molecular dynamics simulation. It was found that the tensile strength of the epoxy resin was enhanced with the increase of the crosslinking degree, which was related to the elevation of the proportion of C-N and O-H bonds in its structure. With the increase of thermal aging temperature, the tensile strength of the epoxy resin decreased, which was related to the formation of weak bonds. At the early stage of thermal aging and after a period of high-temperature thermal aging, the strength of epoxy resin significantly decreases. The thermal aging of the epoxy resin is accelerated under external loading. In addition, the crosslinking degree and curing agent also affect the thermal aging resistance of epoxy resins. The results of this study can provide guidance for predicting and improving the thermal aging resistance of epoxy resins.

METHODS

Materials Studio was used to construct molecular models and complete crosslinking reactions. DGEBA and 44DDS (or 33DDS) were mixed at a ratio of 2:1, followed by crosslinking reaction. During this process, the Nose method was used to control temperature, the Berendsen method was used to control pressure, and the polymer consistent force field (PCFF) was used to control the motion and force of atoms. Isobaric-isothermal ensemble (NPT ensemble) was used to heat up epoxy resin models to various thermal aging temperatures of 400 K, 500 K, 600 K and 700 K. The models were maintained at these temperatures for different thermal aging times of 100 ps, 200 ps, 300 ps, 400 ps, 500 ps, 600 ps, 700 ps and 800 ps. Afterwards, the models were cooled down to 300 K and subjected to uniaxial tensile testing at this temperature with a strain rate of 1 × 109 s-1. The structural configurations and stress-strain data during the tensile process were recorded. The flow stress of the material was derived by counting the average stress in the 20-50% strain interval.

Determination of the Composite Panel Moulding Pressure Value

Currently, prefabricated panel structures are typical products made of polymeric composite materials. The integrity of the composite panels, their structure and accuracy of making a contour are largely associated with the manifestation of residual technological stresses. The above phenomena and associated stress-strain behaviour inevitably occur in the process of moulding of the composite products. However, their value, nature, time of occurrence and dynamics of growth can be fully controlled and regulated. The paper deals with the study of the effect of moulding pressure on the quality of a composite product. A dependence is presented that allows us to determine the time for the degassing of the polymeric composite material package at the given temperature and pressure to obtain a monolithic and nonporous structure. It is shown that the peak of the maximum volatile-matter yield for the considered binder types lies in the temperature range where the degree of curing does not exceed 10%; that is, the viscosity values do not prevent the removal of volatile fractions. The effect of moulding pressure on the values of the volume content of the reinforcing material has been studied, and the dependence of the required thickness of the absorbent layer on the parameters of the package of polymer composite material and pressure has been obtained. The dependence of the required thickness of absorbent layer on the parameters of the package of polymeric composite material and pressure has been obtained. The mathematical model developed by us provides an opportunity to predict the stress-strain behaviour of a composite structure at any time during the moulding process. The model is closely related to chemo-viscous and thermal models. It allowed us to synthetize a method for choosing the rational parameters of the moulding process (temperature, pressure, and time), materials of additional layers and equipment. The experiments proved the presence of several defects, such as de-lamination of edges, waviness, swelling and poor adhesion of upper layers in the specimen of the composite panel cooled stepwise in the absence of the vacuum pressure. The surface quality of the specimen of the panel cooled stepwise under vacuum pressure was significantly better, and no visible defects were observed. The obtained theoretical values of deflections, considering the change in physic-mechanical characteristics that depend on the temperature and rheonomic properties of the material, showed an error that did not exceed 7%, compared to the experimental data. Our results can be applied at the enterprises engaged in designing and manufacturing panel structures of polymeric composite materials.