Effect of Growth Temperature on the Structural and Electrical Properties of ZrO₂ Films Fabricated by Atomic Layer Deposition Using a CpZr[N(CH₃)₂]₃/C₇H₈ Cocktail Precursor

Controllable Oxidation of ZrS2 to Prepare High-κ, Single-Crystal m-ZrO2 for 2D Electronics

High-κ materials that exhibit large permittivity and band gaps are needed as gate dielectrics to enhance capacitance and prevent leakage current in downsized technology nodes. Among these, monoclinic ZrO₂ (m-ZrO₂ ) shows good potential because of its inertness and high-κ with respect to SiO₂ , but a method to produce ultrathin single crystal is lacking. Here, the controllable preparation of ultrathin m-ZrO₂ single crystals via the in situ thermal oxidation of ZrS₂ is achieved. As-grown m-ZrO₂ presents an equivalent oxide thickness of ≈0.29 nm, a high dielectric constant of ≈19, and a breakdown voltage (E_BD ) of ≈7.22 MV cm^-1 . MoS₂ field effect transistor (FET) by using m-ZrO₂ as a dielectric layer shows comparable mobility to that using SiO₂ dielectric. The ultraclean interface of m-ZrO₂ /MoS₂ and high crystalline quality of m-ZrO₂ lead to negligible hysteresis in transfer curves. Single crystal m-ZrO₂ dielectric shows potential application in digital complementary metal oxidesemiconductor (CMOS) logic FET.

High-Temperature Anomalous Hall Effect in a Transition Metal Dichalcogenide Ferromagnetic Insulator Heterostructure

Integration of transition metal dichalcogenides (TMDs) on ferromagnetic materials (FM) may yield fascinating physics and promise for electronics and spintronic applications. In this work, high-temperature anomalous Hall effect (AHE) in the TMD ZrTe₂ thin film using a heterostructure approach by depositing it on a ferrimagnetic insulator YIG (Y₃Fe₅O₁₂, yttrium iron garnet) is demonstrated. In this heterostructure, significant anomalous Hall effect can be observed at temperatures up to at least 400 K, which is a record high temperature for the observation of AHE in TMDs, and the large R_AHE is more than 1 order of magnitude larger than those previously reported values in topological insulators or TMD-based heterostructures. A complicated interface with additional ZrO₂ and amorphous YIG layers is actually observed between ZrTe₂ and YIG. The magnetization of interfacial reaction-induced ZrO₂ and YIG is believed to play a crucial role in the induced high-temperature AHE in the ZrTe₂. These results present a promising system for the spintronic device applications, and it may shed light on the designing approach to introduce magnetism to TMDs at room temperature.

Structural, Optical and Electrical Properties of HfO2 Thin Films Deposited at Low-Temperature Using Plasma-Enhanced Atomic Layer Deposition

HfO₂ was deposited at 80–250 °C by plasma-enhanced atomic layer deposition (PEALD), and properties were compared with those obtained by using thermal atomic layer deposition (thermal ALD). The ALD window, i.e., the region where the growth per cycle (GPC) is constant, shifted from high temperatures (150–200 °C) to lower temperatures (80–150 °C) in PEALD. HfO₂ deposited at 80 °C by PEALD showed higher density (8.1 g/cm³) than those deposited by thermal ALD (5.3 g/cm³) and a smooth surface (RMS Roughness: 0.2 nm). HfO₂ deposited at a low temperature by PEALD showed decreased contaminants compared to thermal ALD deposited HfO₂. Values of refractive indices and optical band gap of HfO₂ deposited at 80 °C by PEALD (1.9, 5.6 eV) were higher than those obtained by using thermal ALD (1.7, 5.1 eV). Transparency of HfO₂ deposited at 80 °C by PEALD on polyethylene terephthalate (PET) was high (> 84%). PET deposited above 80 °C was unable to withstand heat and showed deformation. HfO₂ deposited at 80 °C by PEALD showed decreased leakage current from 1.4 × 10⁻² to 2.5 × 10⁻⁵ A/cm² and increased capacitance of approximately 21% compared to HfO₂ using thermal ALD. Consequently, HfO₂ deposited at a low temperature by PEALD showed improved properties compared to HfO₂ deposited by thermal ALD.

New development of atomic layer deposition: processes, methods and applications

Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of electronic devices. This technology has attracted significant interest both for fundamental understanding how the new functional materials can be synthesized by ALD and for numerous practical applications, particularly in advanced nanopatterning for microelectronics, energy storage systems, desalinations, catalysis and medical fields. This review introduces the progress made in ALD, both for computational and experimental methodologies, and provides an outlook of this emerging technology in comparison with other film deposition methods. It discusses experimental approaches and factors that affect the deposition and presents simulation methods, such as molecular dynamics and computational fluid dynamics, which help determine and predict effective ways to optimize ALD processes, hence enabling the reduction in cost, energy waste and adverse environmental impacts. Specific examples are chosen to illustrate the progress in ALD processes and applications that showed a considerable impact on other technologies.