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Vatnalmath M, Auradi V, J VKM, Murthy BV, Nagaral M, Pandian AA, Islam S, Khan MS, Anjinappa C, Razak A. Impact of Bonding Temperature on Microstructure, Mechanical, and Fracture Behaviors of TLP Bonded Joints of Al2219 with a Cu Interlayer. ACS OMEGA 2023; 8:26332-26339. [PMID: 37521657 PMCID: PMC10373175 DOI: 10.1021/acsomega.3c02838] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 04/25/2023] [Accepted: 06/30/2023] [Indexed: 08/01/2023]
Abstract
The present study aims at producing transient liquid phase (TLP) bonded Al2219 joints with pure Cu (copper) as an interlayer. The TLP bonding is carried out at the bonding temperatures in the range of 480 to 520 °C while keeping the bonding pressure (2 MPa) and time (30 min.) constant. Reaction layers are formed at the Al-Cu interface with a significant increase in diffusion depth with the increase in the bonding temperature. The microstructural investigations are carried out using scanning electron microscopy and energy-dispersive spectroscopy. X-ray diffraction study confirms the formation of CuAl2, CuAl, and Cu9Al4 intermetallic compounds across the interface of the bonded specimens. An increase in microhardness is observed across the bonding zone with the increase in the bonding temperature, and a maximum hardness value of 723 Hv is obtained on the diffusion zone of the specimen bonded at 520 °C. Furthermore, the fractography study of the bonded specimens is carried out, and a maximum shear strength of 18.75 MPa is observed on the joints produced at 520 °C.
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Affiliation(s)
- Manjunath Vatnalmath
- Department
of Mechanical Engineering, Siddaganga Institute of Technology, Visvesvaraya Technological University, Tumakuru, Karnataka 572103, India
| | - Virupaxi Auradi
- Department
of Mechanical Engineering, Siddaganga Institute of Technology, Visvesvaraya Technological University, Tumakuru, Karnataka 572103, India
| | - Varun Kumar M J
- Department
of Mechanical Engineering, RNS Institute of Technology, Visvesvaraya Technological University, Bangalore, Karnataka 560098, India
| | - Bharath Vedashantha Murthy
- Department
of Mechanical Engineering, RNS Institute of Technology, Visvesvaraya Technological University, Bangalore, Karnataka 560098, India
| | - Madeva Nagaral
- Aircraft
Research and Design Centre, HAL, Bangalore, Karnataka 560037, India
| | - A. Anbarasa Pandian
- Department
of Computer Science and Engineering, Panimalar
Engineering College, Chennai 602103, India
| | - Saiful Islam
- Civil
Engineering Department, College of Engineering, King Khalid University, Abha 61421, Saudi Arabia
| | - Mohammad Shahiq Khan
- Civil
Engineering
Department, College of Engineering & IT, Onaizah Colleges, Al Qassim University, Buraidah, Al-qassim 52571, Saudi Arabia
| | - Chandrashekar Anjinappa
- Department
of Robotics and Artificial Intelligence, Bangalore Institute of Technology, Visvesvaraya Technological University, Bengaluru, Karnataka 560004, India
| | - Abdul Razak
- Department
of Mechanical Engineering, P. A. College
of Engineering (Affiliated to Visvesvaraya Technological University,
Belagavi), Mangaluru 574153, India
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