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Citation(s) in RCA

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For: Cui Y, Jeong JY, Gao Y, Pyo SG. Effect of Contact Plug Deposition Conditions on Junction Leakage and Contact Resistance in Multilevel CMOS Logic Interconnection Device. Micromachines (Basel) 2020;11:mi11020170. [PMID: 32041270 PMCID: PMC7074618 DOI: 10.3390/mi11020170] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 11/29/2019] [Revised: 01/24/2020] [Accepted: 02/06/2020] [Indexed: 11/16/2022]
Number Cited by Other Article(s)
1
Editorial for the Special Issue on the ICAE 2019. MICROMACHINES 2020;11:mi11090874. [PMID: 32962209 PMCID: PMC7570300 DOI: 10.3390/mi11090874] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Download PDF] [Subscribe] [Scholar Register] [Received: 09/10/2020] [Accepted: 09/18/2020] [Indexed: 11/23/2022]
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