Design of H-Shape Chamber in Thermal Bubble Printer

Additive Manufacturing Applications in Biosensors Technologies

Three-dimensional (3D) printing technology, also known as additive manufacturing (AM), has emerged as an attractive state-of-the-art tool for precisely fabricating functional materials with complex geometries, championing several advancements in tissue engineering, regenerative medicine, and therapeutics. However, this technology has an untapped potential for biotechnological applications, such as sensor and biosensor development. By exploring these avenues, the scope of 3D printing technology can be expanded and pave the way for groundbreaking innovations in the biotechnology field. Indeed, new printing materials and printers would offer new possibilities for seamlessly incorporating biological functionalities within the growing 3D scaffolds. Herein, we review the additive manufacturing applications in biosensor technologies with a particular emphasis on extrusion-based 3D printing modalities. We highlight the application of natural, synthetic, and composite biomaterials as 3D-printed soft hydrogels. Emphasis is placed on the approach by which the sensing molecules are introduced during the fabrication process. Finally, future perspectives are provided.

Recent advances in inkjet-printing technologies for flexible/wearable electronics

The rapid development of flexible/wearable electronics requires novel fabricating strategies. Among the state-of-the-art techniques, inkjet printing has aroused considerable interest due to the possibility of large-scale fabricating flexible electronic devices with good reliability, high time efficiency, a low manufacturing cost, and so on. In this review, based on the working principle, recent advances in the inkjet printing technology in the field of flexible/wearable electronics are summarized, including flexible supercapacitors, transistors, sensors, thermoelectric generators, wearable fabric, and for radio frequency identification. In addition, some current challenges and future opportunities in this area are also addressed. We hope this review article can give positive suggestions to the researchers in the area of flexible electronics.

Simulation of a Hemispherical Chamber for Thermal Inkjet Printing

It is crucial to improve printing frequency and ink droplet quality in thermal inkjet printing. This paper proposed a hemispherical chamber, and we used the CFD (computational fluid dynamics model) to simulate the inkjet process. During the whole simulation process, we first researched the hemispherical chamber's inkjet state equipped with straight, conical shrinkage, and conical diffusion nozzles. Based on the broken time and volume of the liquid column, the nozzle geometry of the hemispherical chamber was determined to be a conical shrinkage nozzle with a specific size of 15 µm in height and 15 µm in diameter at the top, and 20 µm in diameter at the bottom. Next, we researched the inkjet performance of the square chamber, the round chamber, and the trapezoidal chamber. The round chamber showed the best inkjet performance using 1.8 µs as the driving time and 10 MPa as the maximum bubble pressure. After that, we compared the existing thermal inkjet printing heads. The results showed that the hemispherical chamber inkjet head had the best performance, achieving 30 KHz high-frequency printing and having the most significant volume ratio of droplet to the chamber, reaching 14.9%. As opposed to the current 15 KHz printing frequency of the thermal inkjet heads, the hemispherical chamber inkjet head has higher inkjet performance, and the volume ratio between the droplet and the chamber meets the range standard of 10-15%. The hemispherical chamber structure can be applied to thermal inkjet printing, office printing, 3D printing, and bio-printing.

Design of Chopsticks-Shaped Heating Resistors for a Thermal Inkjet: Based on TaN Film

Efficient printing frequency is critical for thermal bubble inkjet printing, while the difficulty lies in the structural design and material selection of the heating resistors. In this paper, a TaN film was used as the main material of the heating resistors, and two TaN films were placed in parallel to form the chopsticks-shaped structure. The heating time was divided into two sections, in which 0–0.1 μs was the preheating and 1.2–1.8 μs was the primary heating. At 1.8 μs, the maximum temperature of the Si₃N₄ film could reach about 1100 °C. At the same time, the SiO₂ film was added between the TaN film and Si₃N₄ film as a buffer layer, which effectively avoided the rupture of the Si₃N₄ film due to excessive thermal stress. Inside the inkjet print head, the maximum temperature of the chamber reached about 680 °C at 2.5 μs. Due to the high power of the heating resistors, the working time was greatly reduced and the frequency of the inkjet printing was effectively increased. At the interface between the back of the chip and the cartridge, the SiO₂ film was used to connect to ensure a timely ink supply. Under the condition of 12 V at 40 kHz, the inkjet chip could print efficiently with 10 nozzles at the same time. The inkjet chip proposed in this paper is not limited to only office printing, but also provides a new reference for 3D printing, cell printing, and vegetable and fruit printing.