Effect of Source/Drain Electrodes on the Electrical Properties of Silicon⁻Tin Oxide Thin-Film Transistors

Influence of NF3 Plasma-Treated HfO2 Gate Insulator Surface on Tin Oxide Thin-Film Transistors

We studied the impact of NF3 plasma treatment on the HfO2 gate insulator of amorphous tin oxide (a-SnOx) thin-film transistors (TFTs). The plasma treatment was for 0, 10, or 30 s. The HfO2 insulator demonstrated a slightly higher breakdown voltage, whereas the capacitance value remained almost constant (~150 nF/cm2). The linear mobility slightly increased from ~30 to ~35 cm2/Vs when the treatment time increased from 0 to 10 s, whereas a 30 s-treated TFT demonstrated a decreased mobility of ~15 cm2/Vs. The subthreshold swing and the threshold voltage remained in the 100-120 mV/dec. range and near 0 V, respectively. The hysteresis dramatically decreased from ~0.5 V to 0 V when a 10 s treatment was applied, and the 10 s-treated TFT demonstrated the best stability under high current stress (HCS) of 100 μA. The analysis of the tin oxide thin film crystallinity and oxygen environment demonstrated that the a-SnOx remained amorphous, whereas more metal-oxygen bonds were formed with a 10 s NF3 plasma treatment. We also demonstrate that the density of states (DOS) significantly decreased in the 10 s-treated TFT compared to the other conditions. The stability under HCS was attributed to the HfO2/a-SnOx interface quality.

Effects of Source/Drain Electrodes on the Performance of InSnO Thin-Film Transistors

Oxide thin-film transistors (TFTs) are of increasing interest in the field of advanced displays. In this work, we explore Al, InSnO (ITO), Ti, and Mo as source/drain electrodes of ITO TFTs. A comparison study is conducted on the electrical properties of ITO TFTs with the four categories of source/drain electrodes. Interestingly, the ITO TFT with an Al source/drain electrode exhibits better device performance, such as a field-effect mobility (μFE) of 26.45 cm2/Vs, a reasonable turn-on voltage (VON) of 2.7 V, and a steep subthreshold swing (SS) of 201.50 mV/decade. The contact properties of ITO TFTs are further analyzed, and the results show that the device with an Al electrode exhibits lower contact resistance than the other devices. However, the devices with the four electrode materials all reveal excellent stability under negative bias illumination stress (NBIS) with |ΔVTH| < 1 V. This work paves the way for the practical applications of ITO TFTs in next-generation displays.

Effects of Bottom Layer Sputtering Pressures and Annealing Temperatures on the Microstructures, Electrical and Optical Properties of Mo Bilayer Films Deposited by RF/DC Magnetron Sputtering

Most of the molybdenum (Mo) bilayer films are deposited by direct current (DC) magnetron sputtering at the bottom and the top layer (DC/DC). However, the deposition of Mo bilayer film by radio frequency (RF) Mo bottom layer and DC Mo top layer magnetron sputtering has been less studied by researchers. In this paper, the bottom layer of Mo bilayer film was deposited by RF magnetron sputtering to maintain its good adhesion and high reflectance, and the top layer was deposited by DC magnetron sputtering to obtain good conductivity (RF/DC). Generally, the bottom layer sputtering pressure is relatively random, in this paper, the effects of the bottom layer RF sputtering pressures on the microstructures and properties of Mo bilayer films were first studied in detail. Next, in order to further improve their properties, the as-prepared Mo bilayer films at 0.4 Pa bottom layer RF sputtering pressure were annealed at different temperatures and then investigated. Specifically, Mo bilayer films were deposited on soda-lime glass substrates by RF/DC magnetron sputtering at different bottom layer RF sputtering pressures in the range of 0.4–1.2 Pa, the powers of bottom layer RF sputtering and top layer DC sputtering were 120 W and 100 W, respectively. Then, Mo bilayer films, prepared at a bottom layer sputtering pressure of 0.4 Pa and top layer sputtering pressure of 0.3 Pa, were annealed for 30 min at various temperatures in the range of 100–400 °C. The effects of bottom layer sputtering pressures and the annealing temperatures on the microstructures, electrical and optical properties of Mo bilayer films were clarified by X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM), atomic-force microscopy (AFM), and ultraviolet (UV)-visible spectra, respectively. It is shown that with decreasing bottom layer sputtering pressure from 1.2 to 0.4 Pa and increasing annealing temperature from 100 to 400 °C, the crystallinity, electrical and optical properties of Mo bilayer films were improved correspondingly. The optimized Mo bilayer film was prepared at the top layer sputtering pressure of 0.3 Pa, the bottom layer sputtering pressure of 0.4 Pa and the annealing temperature of 400 °C. The extremely low resistivity of 0.92 × 10−5 Ω.cm was obtained. The photo-conversion efficiency of copper indium gallium selenium (CIGS) solar cell with the optimized Mo bilayer film as electrode was up to as high as 13.5%.