Construction and Characterization of Polyolefin Elastomer Blends with Chemically Modified Hydrocarbon Resin as a Photovoltaic Module Encapsulant

A Polyolefin Elastomer Encapsulant Modified by an Ethylene-Propylene-Diene Terpolymer for Photovoltaic Applications

In this study, a newly designed adhesion promoter, a modified ethylene-propylene-diene terpolymer (m-EPDM), was constructed via a simple thiol-ene click reaction between the ethylene-propylene-diene terpolymer (EPDM) and 3-mercaptopropyltrimethoxysilane (MPTS) to employ polyolefin elastomer (POE) encapsulants in photovoltaic modules. The grafting reaction of MPTS on an EPDM backbone (thiol-ene click reaction) was verified using 1H NMR, 29Si NMR, and SEM/EDX. The thermal and mechanical characteristics of the POE compounds did not significantly change with an increasing m-EPDM content irrespective of the cross-linking state. Interestingly, the adhesion strength to the glass substrate increased linearly with an increasing m-EPDM content until 9 phr. Also, the POE compounds containing more than 12 phr m-EPDM showed cohesion failure of the encapsulant layer, remaining as a residue of the encapsulant layer on the glass surface after peel testing. The damp-heat test was conducted to evaluate the long-term durability of the photovoltaic module encapsulated with m-EPDM, and no significant power loss was found even after 1000 h under the test conditions.

Organosilicon Compounds in Hot-Melt Adhesive Technologies

Hot-melt adhesives (HMAs) are thermoplastic materials that can bond various substrates by solidifying rapidly upon cooling from the molten state, and their modification with organosilicon compounds can result in crosslinking behavior, characteristic of gels. Organosilicon compounds are hybrid molecules that have both inorganic and organic components and can enhance the properties and performance of HMAs. The gel aspect of HMA with and without organosilicon modifiers can be considered in organosilicon-modified systems, the modifiers are often either sol-gel condensation products or their mechanism of action on the adherent surface can be considered of sol-gel type. The purpose of this manuscript is to present the current state of the art on the formulation, characterization, and application of HMAs and optimize their performance with organosilicon compounds for application in various industries such as automotive, construction, and photovoltaics. This review covers articles published within the period of 2018-2022. The article is divided into sections, in which information about hot-melt adhesives is described at the beginning. The following part of the presented review focuses on the composition of hot-melt adhesives, which takes into account the use of organosilicon compounds. The last part of this review outlines the future trends in hot-melt adhesives.