Manufacture and characterization of high Q-factor inductors based on CMOS-MEMS techniques

Fabrication and Characterization of Photovoltaic Microgenerators Using the Complementary Metal Oxide Semiconductor Process

This study develops a photovoltaic microgenerator based on the complementary metal oxide semiconductor (CMOS) process. The photovoltaic microgenerator converts the absorbed light energy into electrical energy using the photovoltaic effect. The material for the photovoltaic microgenerator is silicon, and its structure consists of patterned p-n junctions. The design of the photovoltaic microgenerator utilizes a grid-like shape, forming a large-area p-n junction with a patterned p-doping and N-well structure to enhance the photocurrent and improve the device's performance. The photovoltaic microgenerator is fabricated employing the CMOS process with post-processing step. Post-processing is applied to enhance the microgenerator's light absorption and energy-conversion efficiency. This involves using wet etching with buffered-oxide etch (BOE) to remove the silicon dioxide layer above the p-n junctions, allowing direct illumination of the p-n junctions. The area of the photovoltaic microgenerator is 0.79 mm2. The experimental results show that under an illumination intensity of 1000 W/m2, the photovoltaic microgenerator exhibits an open-circuit voltage of 0.53 V, a short-circuit current of 233 µA, a maximum output power of 99 µW, a fill factor of 0.8, and an energy-conversion efficiency of 12.5%.

Analytic Design of on-Chip Spiral Inductor with Variable Line Width

On-chip spiral inductors with variable line width layouts are known for their high quality factor (Q-factor). In this paper, we present an analytical approach to facilitate the design of such inductors. Based on an analysis of ohmic and eddy-current losses, we first derive an analytical formula for the metal resistance calculation of a spiral inductor. By minimizing the metal resistance, a simple design equation for finding the proper line width of each coil is then presented. Several 0.18 μm CMOS spiral inductors are investigated, via electromagnetic simulations and experimental studies, to test the proposed resistance calculation, as well as the variable line width design method. It is found that the developed resistance calculation can effectively model the metal-line resistance of a spiral inductor. Moreover, the inductor with a variable line width obtained using the proposed method can significantly improve the Q-factor with little compromise to inductance, which validates the capacity of the developed variable line width design technique. Since the proposed approach can be carried out using analytical calculations, it may be a more efficient design method than those previously reported in the literature.

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

MEMS inductors are used in a wide range of applications in micro- and nanotechnology, including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies set the boundary conditions for inductor design and their electrical and mechanical performance. This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication, presents recent advances in 3D additive fabrication technologies, and discusses the challenges and opportunities of MEMS inductors for two emerging applications, namely, integrated power electronics and neurotechnologies. Among the four top-down MEMS fabrication approaches, 3D surface micromachining and through-substrate-via (TSV) fabrication technology have been intensively studied to fabricate 3D inductors such as solenoid and toroid in-substrate TSV inductors. While 3D inductors are preferred for their high-quality factor, high power density, and low parasitic capacitance, in-substrate TSV inductors offer an additional unique advantage for 3D system integration and efficient thermal dissipation. These features make in-substrate TSV inductors promising to achieve the ultimate goal of monolithically integrated power converters. From another perspective, 3D bottom-up additive techniques such as ice lithography have great potential for fabricating inductors with geometries and specifications that are very challenging to achieve with established MEMS technologies. Finally, we discuss inspiring and emerging research opportunities for MEMS inductors.

Effect of Uneven Electrostatic Forces on the Dynamic Characteristics of Capacitive Hemispherical Resonator Gyroscopes

The hemispherical resonator gyroscope (HRG) is a typical capacitive Coriolis vibratory gyroscope whose performance is inevitably influenced by the uneven electrostatic forces caused by the uneven excitation capacitance gap between the resonator and outer base. First, the mechanism of uneven electrostatic forces due to the significantly uneven capacitance gap in that the non-uniformity of the electrostatic forces can cause irregular deformation of the resonator and further affect the performance and precision of the HRG, was analyzed. According to the analyzed influence mechanism, the dynamic output error model of the HRG was established. In this work, the effect of the first four harmonics of the uneven capacitance gap on the HRG was investigated. It turns out that the zero bias and output error, caused by the first harmonic that dominates mainly the amplitude of the uneven capacitance gap, increase approximately linearly with the increase of the amplitude, and periodically vary with the increase of the phase. The effect of the other three harmonics follows the same law, but their amplitudes are one order of magnitude smaller than that of the first one, thus their effects on the HRG can be neglected. The effect of uneven electrostatic forces caused by the first harmonic on the scale factor is that its nonlinearity increases approximately linearly with the increase of the harmonic amplitude, which was analyzed in depth. Considering comprehensively the zero bias, the modification rate of output error, and scale factor nonlinearity, the tolerance towards the uneven excitation capacitance gap was obtained.

Analysis of the Damping Characteristics of Cylindrical Resonators Influenced by Piezoelectric Electrodes

The cylindrical resonator gyroscope (CRG) is a typical Coriolis vibratory gyroscope whose performance is mostly influenced by the damping characteristic of the cylindrical resonator. However, the tremendous damping influences caused by pasting piezoelectric electrodes on the gyroscope, which degrades the performance to a large extent, have rarely been studied. In this paper, the dynamical model is established to analyze various forms of energy consumption. In addition, a FE COMSOL model is also created to discuss the damping influences of several significant parameters of the adhesive layer and piezoelectric electrodes, respectively, and then explicit influence laws are obtained. Simulation results demonstrate that the adhesive layer has some impact on the damping characteristic, but it not significant. The Q factor decreases about 30.31% in total as a result of pasting piezoelectric electrodes. What is more, it is discovered that piezoelectric electrodes with short length, locations away from the outside edges, proper width and well-chosen thickness are able to reduce the damping influences to a large extent. Afterwards, experiments of testing the Q factor are set up to validate the simulation values.