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For: Zhang X, Zhou Y, Chen Y, Li M, Yu H, Li X. Advanced In Situ TEM Microchip with Excellent Temperature Uniformity and High Spatial Resolution. Sensors (Basel) 2023;23:s23094470. [PMID: 37177673 PMCID: PMC10181734 DOI: 10.3390/s23094470] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/18/2023] [Revised: 04/22/2023] [Accepted: 04/29/2023] [Indexed: 05/15/2023]
Number Cited by Other Article(s)
1
Lu X, Lu P, Wei Y, Zhu C, Su H, Qiu X, Feng S, Qiu P, Shi X, Chen L, Xu F. Micromechanism for Copper-Deficiency Enhanced Stability: A Quasi In Situ TEM Study of Electric-Induced Structural Evolution in Cu2-x(S, Se) Liquid-Like Thermoelectric Materials. NANO LETTERS 2024;24:2853-2860. [PMID: 38407019 DOI: 10.1021/acs.nanolett.3c05087] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 02/27/2024]
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