Shao R, Gao P, Zheng K. The effect of tensile and bending strain on the electrical properties of p-type 〈110〉 silicon nanowires.
NANOTECHNOLOGY 2015;
26:265703. [PMID:
26059313 DOI:
10.1088/0957-4484/26/26/265703]
[Citation(s) in RCA: 2] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/04/2023]
Abstract
In this study, electromechanical responses induced by uniaxial tensile and bending deformation were obtained for p-type 〈110〉-oriented Si whiskers by in situ transmission electron microscopy (TEM). Ohmic contacts between the nanowires (NWs) and electrodes were achieved using electron-beam-induced carbon deposition. Results show that enhancements in the carrier transport properties were achieved under both uniaxial tensile and bending strains. With the strain increased to 1.5% before fracture, the improvement in the conductance reached a maximum, which was as large as 24.2%, without any sign of saturation. On the other hand, under 5.8% bending strain, a 67% conductivity enhancement could be achieved. This study should provide important insight into the performance of nanoscale-strained Si.
Collapse