High-Hole-Mobility Fiber Organic Electrochemical Transistors for Next-Generation Adaptive Neuromorphic Bio-Hybrid Technologies

The latest developments in fiber design and materials science are paving the way for fibers to evolve from parts in passive components to functional parts in active fabrics. Designing conformable, organic electrochemical transistor (OECT) structures using poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) fibers has excellent potential for low-cost wearable bioelectronics, bio-hybrid devices, and adaptive neuromorphic technologies. However, to achieve high-performance, stable devices from PEDOT:PSS fibers, approaches are required to form electrodes on fibers with small diameters and poor wettability, that leads to irregular coatings. Additionally, PEDOT:PSS-fiber fabrication needs to move away from small batch processing to roll-to-roll or continuous processing. Here, it is shown that synergistic effects from a superior electrode/organic interface, and exceptional fiber alignment from continuous processing, enable PEDOT:PSS fiber-OECTs with stable contacts, high µC* product (1570.5 F cm-1 V-1 s-1 ), and high hole mobility over 45 cm2 V-1 s-1 . Fiber-electrochemical neuromorphic organic devices (fiber-ENODes) are developed to demonstrate that the high mobility fibers are promising building blocks for future bio-hybrid technologies. The fiber-ENODes demonstrate synaptic weight update in response to dopamine, as well as a form factor closely matching the neuronal axon terminal.

Synthesis of Catalytic Nanoporous Metallic Thin Films on Polymer Membranes

Composite membranes were produced with a metallic thin film forming the upper layer of the composite on a porous polymer support. Commercially available membranes were used as supports with both micron and nanometer scale pores. Alloy films of ~110 nm thickness were deposited via magnetron sputtering to produce the top layer of the composite. Dealloying the film with sulfuric acid allowed the creation of a nanoporous film structure with a ligament size of 7.7 ± 2.5 nm. Resulting composite membranes were permeable to water at all stages of production, and a UF PSf membrane with 90 nm of nanoporous Fe/Pd on top showed a flux of 183 LHM/bar. The films were evaluated for dechlorination of toxic polychlorinated biphenyls from water. At a loading of 6.6 mg/L of Pd attached to 13.2 cm² support in a 2.5 ppm PCB-1 solution with 1.5 ppm dissolved H₂, over 90% of PCB-1 was removed from solution in 30 minutes, which produced the expected product biphenyl from the dechlorination reaction.

A New Type of Dislocation Mechanism in Ultrathin Copper Films

In this study of thin film plasticity, the relationship between thermomechanical behavior and dislocation motion has been investigated in copper constrained by a silicon substrate. The stress-temperature behavior as determined from wafer curvature experiments has been directly compared to deformation microstructures observed during in situ thermal cycling of plan-view specimens in the transmission electron microscope. The flow stress of copper films with thicknesses ranging from 100 nm to 400 nm was found to be constant, indicating that strengthening mechanisms may be saturated in this thickness regime. Moreover, unexpected dislocation glide on a plane parallel to the film surface, which should experience no resolved shear stress, provides potential evidence for the occurrence of constrained diffusional creep in a 270 nm film.

Observations of Dislocation Motion and Stress Inhomogeneities in a Thin Copper Film

In situ transmission electron microscopy has been utilized to study dislocation plasticity in a 200 nm thick copper film. The behavior of dislocations in a [111]-oriented grain was recorded during a thermal cycle. During cooling, it was observed that dislocations were emitted from a grain boundary triple junction in regular intervals of 30°C to 40°C. Subsequent glide occurred on a (111) plane parallel to the film surface, despite the expectation of zero resolved shear stress on such planes. The initial emitted dislocations remained close to the triple junction, avoiding contact with another [111] grain rotated by 17°. Glide into the opposite end of the grain was initiated only after the injection of several additional dislocations, which induced strong curvature in all dislocations near the active triple junction. Post mortem examination of dislocation curvature revealed that an inhomogeneous stress state existed within the grain.

In-Situ TEM Study of Plastic Stress Relaxation Mechanisms and Interface Effects in Metallic Films

To investigate the origin of the high strength of thin films, in-situ cross-sectional TEM deformation experiments have been performed on several metallic films attached to rigid substrates. Thermal cycles, comparable to those performed using laser reflectometry, were applied to thin foils inside the TEM and dislocation motion was recorded dynamically on video. These observations can be directly compared to the current models of dislocation hardening in thin films. As expected, the role of interfaces is crucial, but, depending on their nature, they can attract or repel dislocations. When the film/interface holds off dislocations, experimental values of film stress match those predicted by the Nix-Freund model. In contrast, the attracting case leads to higher stresses that are not explained by this model. Two possible hardening scenarios are explored here. The first one assumes that the dislocation/interface attraction reduces dislocation mobility and thus increases the yield stress of the film. The second one focuses on the lack of dislocation nucleation processes in the case of attracting interfaces, even though a few sources have been observed in-situ.