UV-Vis Sintering Process for Fabrication of Conductive Coatings Based on Ni-Ag Core-Shell Nanoparticles

The UV-Vis sintering process was applied for the fabrication of conductive coatings composed of low-cost nickel-silver (Ni@Ag) nanoparticles (NPs) with core-shell structures. The metallic films were formed on a plastic substrate (polyethylene napthalate, PEN), which required their sintering at low temperatures to prevent the heat-sensitive polymer from destroying them. The UV-Vis sintering method, as a non-invasive method, allowed us to obtain metallic coatings with good conductivity at room temperature. In optimal sintering conditions, i.e., irradiation with a wavelength of 350-400 nm and time of 90 min, conductivity corresponding to about 30% of that of bulk nickel was obtained for the coatings based on Ni@Ag NPs.

Effect of Oxalic Acid Treatment on Conductive Coatings Formed by Ni@Ag Core-Shell Nanoparticles

Low-cost metallic nanoink based on nickel-silver core-shell nanoparticles (Ni@Ag NPs) was used for the formation of conductive metallic coatings with low sintering temperature, which can be successfully applied for replacement of currently used silver-based nanoinks in printed electronics. The effect of oxalic acid (OA) on the sintering temperature and conductivity of coatings formed by Ni@Ag NPs was evaluated. It was found that the addition of OA to the ink formulation and post-printing treatment of deposited films with this acid provided a noticeable decrease in the sintering temperature required for obtaining conductive patterns that is especially important for utilizing the polymeric substrates. The obtained resistivity of metallic coatings after sintering at temperature as low as 100 °C was found to be 30 µΩ·cm, only ~4 times higher compared to the resistivity of bulk Ni that is promising for future application of such materials for fabrication of low-cost flexible printed patterns.