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You J, Lu M, Dazhen L, Gao M, Zhang R, Li W, Lei F, Ren W, Li G, Yang J. Anti-Motion Artifacts Iontronic Sensor for Long-Term Accurate Fingertip Pulse Monitoring. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2025; 12:e2414425. [PMID: 39985252 PMCID: PMC12005763 DOI: 10.1002/advs.202414425] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/06/2024] [Revised: 02/08/2025] [Indexed: 02/24/2025]
Abstract
Flexible pressure sensors have gained attention for their comfort, portability, and potential in long-term pulse monitoring and early cardiovascular disease diagnosis. However, stretching stress during daily activities affects sensor accuracy, causing motion artifacts (MAs) that hinder precise pulse signal detection. To address this challenge, the anti-motion artifact iontronic pressure sensor (S-smooth sensor), featuring a soft-hard stretchable interface with energy dissipation properties is developed. By regulating the local modulus of the encapsulation layer, this structure dissipates stretching stress, achieving an MAs suppression rate of up to 90%, significantly improving pulse signal accuracy and reliability. Additionally, the sensor incorporates a dielectric layer and double electrode layer (EDL) sensing interface, with a low-friction design that ensures high sensitivity (92.76 kPa-¹) and stability, maintaining performance over millions of cycles. The sensor accurately captures heart rate (HR) and pulse peak time differences (Δt) under various finger-bending conditions. When integrated into a portable wireless pulse monitoring system, it shows a heart rate loss rate of only 2.9% during intense physical activity. This approach avoids complex chemical processes and material restrictions, offering a novel solution for motion artifact suppression in sensors, with significant potential for real-time health monitoring and assisted diagnosis.
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Affiliation(s)
- Jia You
- College of Polymer Science and EngineeringNational Key Laboratory of Advanced Polymer MaterialsSichuan UniversityChengduSichuan610065China
| | - Mingyang Lu
- College of Polymer Science and EngineeringNational Key Laboratory of Advanced Polymer MaterialsSichuan UniversityChengduSichuan610065China
| | - Lamu Dazhen
- College of Polymer Science and EngineeringNational Key Laboratory of Advanced Polymer MaterialsSichuan UniversityChengduSichuan610065China
| | - Mengjie Gao
- College of Polymer Science and EngineeringNational Key Laboratory of Advanced Polymer MaterialsSichuan UniversityChengduSichuan610065China
| | - Ruiyan Zhang
- Key Laboratory of Photovoltaic MaterialsSchool of Materials and New EnergyNingxia UniversityYinchuanNingxia750021China
| | - Wendong Li
- School of Aeronautics and AstronauticsState Key Laboratory of Polymer Materials Engineering of ChinaRobotic Satellite Key Laboratory of Sichuan ProvinceSichuan UniversityChengduSichuan610065China
| | - Fan Lei
- School of Mechanical EngineeringChengdu UniversityChengduSichuan610106China
| | - Wei Ren
- College of Polymer Science and EngineeringNational Key Laboratory of Advanced Polymer MaterialsSichuan UniversityChengduSichuan610065China
| | - Guangxian Li
- College of Polymer Science and EngineeringNational Key Laboratory of Advanced Polymer MaterialsSichuan UniversityChengduSichuan610065China
| | - Junlong Yang
- College of Polymer Science and EngineeringNational Key Laboratory of Advanced Polymer MaterialsSichuan UniversityChengduSichuan610065China
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2
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Zhang X, Wang C, Pi X, Li B, Ding Y, Yu H, Sun J, Wang P, Chen Y, Wang Q, Zhang C, Meng X, Chen G, Wang D, Wang Z, Mu Z, Song H, Zhang J, Niu S, Han Z, Ren L. Bionic Recognition Technologies Inspired by Biological Mechanosensory Systems. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2025:e2418108. [PMID: 39838736 DOI: 10.1002/adma.202418108] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/21/2024] [Revised: 12/23/2024] [Indexed: 01/23/2025]
Abstract
Mechanical information is a medium for perceptual interaction and health monitoring of organisms or intelligent mechanical equipment, including force, vibration, sound, and flow. Researchers are increasingly deploying mechanical information recognition technologies (MIRT) that integrate information acquisition, pre-processing, and processing functions and are expected to enable advanced applications. However, this also poses significant challenges to information acquisition performance and information processing efficiency. The novel and exciting mechanosensory systems of organisms in nature have inspired us to develop superior mechanical information bionic recognition technologies (MIBRT) based on novel bionic materials, structures, and devices to address these challenges. Herein, first bionic strategies for information pre-processing are presented and their importance for high-performance information acquisition is highlighted. Subsequently, design strategies and considerations for high-performance sensors inspired by mechanoreceptors of organisms are described. Then, the design concepts of the neuromorphic devices are summarized in order to replicate the information processing functions of a biological nervous system. Additionally, the ability of MIBRT is investigated to recognize basic mechanical information. Furthermore, further potential applications of MIBRT in intelligent robots, healthcare, and virtual reality are explored with a view to solve a range of complex tasks. Finally, potential future challenges and opportunities for MIBRT are identified from multiple perspectives.
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Affiliation(s)
- Xiangxiang Zhang
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Changguang Wang
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Xiang Pi
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Bo Li
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
- The National Key Laboratory of Automotive Chassis Integration and Bionics (ACIB), College of Biological and Agricultural Engineering, Jilin University, Changchun, 130022, China
| | - Yuechun Ding
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Hexuan Yu
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Jialue Sun
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Pinkun Wang
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - You Chen
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Qun Wang
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Changchao Zhang
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Xiancun Meng
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Guangjun Chen
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Dakai Wang
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Ze Wang
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Zhengzhi Mu
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Honglie Song
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
| | - Junqiu Zhang
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
- The National Key Laboratory of Automotive Chassis Integration and Bionics (ACIB), College of Biological and Agricultural Engineering, Jilin University, Changchun, 130022, China
- Institute of Structured and Architected Materials, Liaoning Academy of Materials, Shenyang, 110167, China
| | - Shichao Niu
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
- The National Key Laboratory of Automotive Chassis Integration and Bionics (ACIB), College of Biological and Agricultural Engineering, Jilin University, Changchun, 130022, China
- Institute of Structured and Architected Materials, Liaoning Academy of Materials, Shenyang, 110167, China
| | - Zhiwu Han
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
- The National Key Laboratory of Automotive Chassis Integration and Bionics (ACIB), College of Biological and Agricultural Engineering, Jilin University, Changchun, 130022, China
- Institute of Structured and Architected Materials, Liaoning Academy of Materials, Shenyang, 110167, China
| | - Luquan Ren
- Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin, 130022, China
- The National Key Laboratory of Automotive Chassis Integration and Bionics (ACIB), College of Biological and Agricultural Engineering, Jilin University, Changchun, 130022, China
- Institute of Structured and Architected Materials, Liaoning Academy of Materials, Shenyang, 110167, China
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Sun X, Guo X, Gao J, Wu J, Huang F, Zhang JH, Huang F, Lu X, Shi Y, Pan L. E-Skin and Its Advanced Applications in Ubiquitous Health Monitoring. Biomedicines 2024; 12:2307. [PMID: 39457619 PMCID: PMC11505155 DOI: 10.3390/biomedicines12102307] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/30/2024] [Revised: 09/29/2024] [Accepted: 10/05/2024] [Indexed: 10/28/2024] Open
Abstract
E-skin is a bionic device with flexible and intelligent sensing ability that can mimic the touch, temperature, pressure, and other sensing functions of human skin. Because of its flexibility, breathability, biocompatibility, and other characteristics, it is widely used in health management, personalized medicine, disease prevention, and other pan-health fields. With the proposal of new sensing principles, the development of advanced functional materials, the development of microfabrication technology, and the integration of artificial intelligence and algorithms, e-skin has developed rapidly. This paper focuses on the characteristics, fundamentals, new principles, key technologies, and their specific applications in health management, exercise monitoring, emotion and heart monitoring, etc. that advanced e-skin needs to have in the healthcare field. In addition, its significance in infant and child care, elderly care, and assistive devices for the disabled is analyzed. Finally, the current challenges and future directions of the field are discussed. It is expected that this review will generate great interest and inspiration for the development and improvement of novel e-skins and advanced health monitoring systems.
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Affiliation(s)
- Xidi Sun
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China; (X.S.); (X.G.); (J.G.); (J.W.); (F.H.)
| | - Xin Guo
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China; (X.S.); (X.G.); (J.G.); (J.W.); (F.H.)
| | - Jiansong Gao
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China; (X.S.); (X.G.); (J.G.); (J.W.); (F.H.)
| | - Jing Wu
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China; (X.S.); (X.G.); (J.G.); (J.W.); (F.H.)
| | - Fengchang Huang
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China; (X.S.); (X.G.); (J.G.); (J.W.); (F.H.)
| | - Jia-Han Zhang
- School of Electronic Information Engineering, Inner Mongolia University, Hohhot 010021, China;
| | - Fuhua Huang
- Department of Thoracic and Cardiovascular Surgery, Nanjing First Hospital, Nanjing Medical University, Nanjing 210006, China;
| | - Xiao Lu
- The First Affiliated Hospital of Nanjing Medical University, Jiangsu Province Hospital, Nanjing 210093, China;
| | - Yi Shi
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China; (X.S.); (X.G.); (J.G.); (J.W.); (F.H.)
| | - Lijia Pan
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China; (X.S.); (X.G.); (J.G.); (J.W.); (F.H.)
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Jung D, Lee T, Cho S, Yoo H, Lee S, Hong C, Lee J. 3D Stretchable Electronics with Stretchable Interlayer Connectors. ACS APPLIED MATERIALS & INTERFACES 2024; 16:54224-54232. [PMID: 39331813 DOI: 10.1021/acsami.4c12505] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 09/29/2024]
Abstract
The unique mechanical characteristics of stretchable electronics has significantly expanded applications by overcoming the limitations (rigid, planar) of conventional electronics. However, most reported stretchable electronics are two dimensionally stretchable (laterally stretchable in the xy-axis) in a single layer or even in multiple layers. In this report, we present three dimensionally (3D) stretchable electronics (laterally and vertically stretchable in the xyz-axes) in multilayered 3D electronic circuits. Computational and experimental studies indicate that the approach is reliable in three-dimensional deformations. The base units, stretchable interlayer connectors, can be applied to form various electronic circuit designs in 3D stretchable forms. We demonstrated the efficacy of the approach by designing and fabricating a 3D stretchable light emitting diode (LED) matrix display (125 LEDs).
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Affiliation(s)
- Dongwuk Jung
- School of Mechanical and Robotics Engineering, Gwangju Institute of Science and Technology (GIST), 123 Cheomdan-gwagiro, Buk-gu, Gwangju 61005, Republic of Korea
| | - Taeyeon Lee
- School of Mechanical and Robotics Engineering, Gwangju Institute of Science and Technology (GIST), 123 Cheomdan-gwagiro, Buk-gu, Gwangju 61005, Republic of Korea
| | - Sungbum Cho
- School of Mechanical and Robotics Engineering, Gwangju Institute of Science and Technology (GIST), 123 Cheomdan-gwagiro, Buk-gu, Gwangju 61005, Republic of Korea
| | - Hyungwook Yoo
- School of Mechanical and Robotics Engineering, Gwangju Institute of Science and Technology (GIST), 123 Cheomdan-gwagiro, Buk-gu, Gwangju 61005, Republic of Korea
| | - Seungchan Lee
- School of Mechanical and Robotics Engineering, Gwangju Institute of Science and Technology (GIST), 123 Cheomdan-gwagiro, Buk-gu, Gwangju 61005, Republic of Korea
| | - Changeui Hong
- School of Mechanical and Robotics Engineering, Gwangju Institute of Science and Technology (GIST), 123 Cheomdan-gwagiro, Buk-gu, Gwangju 61005, Republic of Korea
| | - Jongho Lee
- School of Mechanical and Robotics Engineering, Gwangju Institute of Science and Technology (GIST), 123 Cheomdan-gwagiro, Buk-gu, Gwangju 61005, Republic of Korea
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Cao B, Huang Y, Chen L, Jia W, Li D, Jiang Y. Soft bioelectronics for diagnostic and therapeutic applications in neurological diseases. Biosens Bioelectron 2024; 259:116378. [PMID: 38759308 DOI: 10.1016/j.bios.2024.116378] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/18/2024] [Revised: 04/13/2024] [Accepted: 05/09/2024] [Indexed: 05/19/2024]
Abstract
Physical and chemical signals in the central nervous system yield crucial information that is clinically relevant under both physiological and pathological conditions. The emerging field of bioelectronics focuses on the monitoring and manipulation of neurophysiological signals with high spatiotemporal resolution and minimal invasiveness. Significant advances have been realized through innovations in materials and structural design, which have markedly enhanced mechanical and electrical properties, biocompatibility, and overall device performance. The diagnostic and therapeutic potential of soft bioelectronics has been corroborated across a diverse array of pre-clinical settings. This review summarizes recent studies that underscore the developments and applications of soft bioelectronics in neurological disorders, including neuromonitoring, neuromodulation, tumor treatment, and biosensing. Limitations and outlooks of soft devices are also discussed in terms of power supply, wireless control, biocompatibility, and the integration of artificial intelligence. This review highlights the potential of soft bioelectronics as a future platform to promote deciphering brain functions and clinical outcomes of neurological diseases.
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Affiliation(s)
- Bowen Cao
- Department of Neurosurgery, Beijing Tiantan Hospital, National Center for Neurological Disorders, Capital Medical University, Beijing, China; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, United States
| | - Yewei Huang
- Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, United States
| | - Liangpeng Chen
- Department of Neurosurgery, Beijing Tiantan Hospital, National Center for Neurological Disorders, Capital Medical University, Beijing, China
| | - Wang Jia
- Department of Neurosurgery, Beijing Tiantan Hospital, National Center for Neurological Disorders, Capital Medical University, Beijing, China; Beijing Neurosurgical Institute, Capital Medical University, Beijing, China; China National Clinical Research Center for Neurological Diseases (NCRC-ND), Beijing, China.
| | - Deling Li
- Department of Neurosurgery, Beijing Tiantan Hospital, National Center for Neurological Disorders, Capital Medical University, Beijing, China; Beijing Neurosurgical Institute, Capital Medical University, Beijing, China; China National Clinical Research Center for Neurological Diseases (NCRC-ND), Beijing, China.
| | - Yuanwen Jiang
- Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, United States.
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Yang X, Chen W, Fan Q, Chen J, Chen Y, Lai F, Liu H. Electronic Skin for Health Monitoring Systems: Properties, Functions, and Applications. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2402542. [PMID: 38754914 DOI: 10.1002/adma.202402542] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/19/2024] [Revised: 04/22/2024] [Indexed: 05/18/2024]
Abstract
Electronic skin (e-skin), a skin-like wearable electronic device, holds great promise in the fields of telemedicine and personalized healthcare because of its good flexibility, biocompatibility, skin conformability, and sensing performance. E-skin can monitor various health indicators of the human body in real time and over the long term, including physical indicators (exercise, respiration, blood pressure, etc.) and chemical indicators (saliva, sweat, urine, etc.). In recent years, the development of various materials, analysis, and manufacturing technologies has promoted significant development of e-skin, laying the foundation for the application of next-generation wearable medical technologies and devices. Herein, the properties required for e-skin health monitoring devices to achieve long-term and precise monitoring and summarize several detectable indicators in the health monitoring field are discussed. Subsequently, the applications of integrated e-skin health monitoring systems are reviewed. Finally, current challenges and future development directions in this field are discussed. This review is expected to generate great interest and inspiration for the development and improvement of e-skin and health monitoring systems.
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Affiliation(s)
- Xichen Yang
- State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai, 00240, P. R. China
| | - Wenzheng Chen
- State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai, 00240, P. R. China
| | - Qunfu Fan
- State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai, 00240, P. R. China
| | - Jing Chen
- State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai, 00240, P. R. China
| | - Yujie Chen
- State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai, 00240, P. R. China
| | - Feili Lai
- State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai, 00240, P. R. China
| | - Hezhou Liu
- State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai, 00240, P. R. China
- Collaborative Innovation Center for Advanced Ship and Dee-Sea Exploration, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai, 200240, P. R. China
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7
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Jiang C, Sheng B. Linear Capacitive Pressure Sensor with Gradient Architecture through Laser Ablation on MWCNT/Ecoflex Film. Polymers (Basel) 2024; 16:962. [PMID: 38611220 PMCID: PMC11013779 DOI: 10.3390/polym16070962] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/19/2024] [Revised: 03/27/2024] [Accepted: 03/30/2024] [Indexed: 04/14/2024] Open
Abstract
The practical application of flexible pressure sensors, including electronic skins, wearable devices, human-machine interaction, etc., has attracted widespread attention. However, the linear response range of pressure sensors remains an issue. Ecoflex, as a silicone rubber, is a common material for flexible pressure sensors. Herein, we have innovatively designed and fabricated a pressure sensor with a gradient micro-cone architecture generated by CO2 laser ablation of MWCNT/Ecoflex dielectric layer film. In cooperation with the gradient micro-cone architecture and a dielectric layer of MWCNT/Ecoflex with a variable high dielectric constant under pressure, the pressure sensor exhibits linearity (R2 = 0.990) within the pressure range of 0-60 kPa, boasting a sensitivity of 0.75 kPa-1. Secondly, the sensor exhibits a rapid response time of 95 ms, a recovery time of 129 ms, hysteresis of 6.6%, and stability over 500 cycles. Moreover, the sensor effectively exhibited comprehensive detection of physiological signals, airflow detection, and Morse code communication, thereby demonstrating the potential for various applications.
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Affiliation(s)
- Chenkai Jiang
- School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China;
- Shanghai Key Laboratory of Modern Optical Systems, Engineering Research Center of Optical Instruments and Systems, Shanghai 200093, China
| | - Bin Sheng
- School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China;
- Shanghai Key Laboratory of Modern Optical Systems, Engineering Research Center of Optical Instruments and Systems, Shanghai 200093, China
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Ma J, Huo X, Yin J, Cai S, Pang K, Liu Y, Gao C, Xu Z. Axially Encoded Mechano-Metafiber Electronics by Local Strain Engineering. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2305615. [PMID: 37821206 DOI: 10.1002/adma.202305615] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/12/2023] [Revised: 09/20/2023] [Indexed: 10/13/2023]
Abstract
Multimaterial integration, such as soft elastic and stiff components, exhibits rich deformation and functional behaviors to meet complex needs. Integrating multimaterials in the level of individual fiber is poised to maximize the functional design capacity of smart wearable electronic textiles, but remains unfulfilled. Here, this work continuously integrates stiff and soft elastic components into single fiber to fabricate encoded mechano-metafiber by programmable microfluidic sequence spinning (MSS). The sequences with programmable modulus feature the controllable localization of strain along metafiber length. The mechano-metafibers feature two essential nonlinear deformation modes, which are local strain amplification and retardation. This work extends the sequence-encoded metafiber into fiber networks to exhibit greatly enhanced strain amplification and retardation capability in cascades. Local strain engineering enables the design of highly sensitive strain sensors, stretchable fiber devices to protect brittle components and the fabrication of high-voltage supercapacitors as well as axial electroluminescent arrays. The approach allows the scalably design of multimaterial metafibers with programmable localized mechanical properties for woven metamaterials, smart textiles, and wearable electronics.
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Affiliation(s)
- Jingyu Ma
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou, 310027, China
| | - Xiaodan Huo
- The State Key Laboratory of Fluid Power and Mechatronic Systems, Key Laboratory of 3D Printing Process and Equipment of Zhejiang Province, School of Mechanical Engineering, Zhejiang University, Hangzhou, 310028, China
| | - Jun Yin
- The State Key Laboratory of Fluid Power and Mechatronic Systems, Key Laboratory of 3D Printing Process and Equipment of Zhejiang Province, School of Mechanical Engineering, Zhejiang University, Hangzhou, 310028, China
| | - Shengying Cai
- Center for Healthcare Materials, Shaoxing Institute, Zhejiang University, Shaoxing, 312000, China
| | - Kai Pang
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou, 310027, China
| | - Yingjun Liu
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou, 310027, China
- Shanxi-Zheda Institute of Advanced Materials and Chemical Engineering, Taiyuan, 030032, P. R. China
| | - Chao Gao
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou, 310027, China
- Shanxi-Zheda Institute of Advanced Materials and Chemical Engineering, Taiyuan, 030032, P. R. China
| | - Zhen Xu
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou, 310027, China
- Shanxi-Zheda Institute of Advanced Materials and Chemical Engineering, Taiyuan, 030032, P. R. China
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