The mechanical and magnetic alignment of liquid crystalline epoxy thermosets

Advances on Thermally Conductive Epoxy-Based Composites as Electronic Packaging Underfill Materials-A Review

The integrated circuits industry has been continuously producing microelectronic components with ever higher integration level, packaging density, and power density, which demand more stringent requirements for heat dissipation. Electronic packaging materials are used to pack these microelectronic components together, help to dissipate heat, redistribute stresses, and protect the whole system from the environment. They serve an important role in ensuring the performance and reliability of the electronic devices. Among various packaging materials, epoxy-based underfills are often employed in flip-chip packaging. However, widely used capillary underfill materials suffer from their low thermal conductivity, unable to meet the growing heat dissipation required of next-generation IC chips with much higher power density. Many strategies have been proposed to improve the thermal conductivity of epoxy, but its application as underfill materials with complex performance requirements is still difficult. In fact, optimizing the combined thermal-electrical-mechanical-processing properties of underfill materials for flip-chip packaging remains a great challenge. Herein, state-of-the-art advances that have been made to satisfy the key requirements of capillary underfill materials are reviewed. Based on these studies, the perspectives for designing high-performance underfill materials with novel microstructures in electronic packaging for high-power density electronic devices are provided.

Advances in Liquid Crystalline Epoxy Resins for High Thermal Conductivity

Epoxy resin (EP) is one of the most famous thermoset materials. In general, because EP has a three-dimensional random network, it possesses thermal properties similar to those of a typical heat insulator. Recently, there has been substantial interest in controlling the network structure of EP to create new functionalities. Indeed, the modified EP, represented as liquid crystalline epoxy (LCE), is considered promising for producing novel functionalities, which cannot be obtained from conventional EPs, by replacing the random network structure with an oriented one. In this paper, we review the current progress in the field of LCEs and their application to highly thermally conductive composite materials.

Liquid crystalline networks based on photo-initiated thiol-ene click chemistry

Photo-initiated thiol-ene click chemistry is used to develop shape memory liquid crystalline networks (LCNs). A biphenyl-based di-vinyl monomer is synthesized and cured with a di-thiol chain extender and a tetra-thiol crosslinker using UV light. The effects of photo-initiator concentration and UV light intensity on the curing behavior and liquid crystalline (LC) properties of the LCNs are investigated. The chemical composition is found to significantly influence the microstructure and the related thermomechanical properties of the LCNs. The structure-property relationship is further explored using molecular dynamics simulations, revealing that the introduction of the chain extender promotes the formation of an ordered smectic LC phase instead of agglomerated structures. The concentration of the chain extender affects the liquid crystallinity of the LCNs, resulting in distinct thermomechanical and shape memory properties. This class of LCNs exhibits fast curing rates, high conversion levels, and tailorable liquid crystallinity, making it a promising material system for advanced manufacturing, where complex and highly ordered structures can be produced with fast reaction kinetics and low energy consumption.

Thermally Functional Liquid Crystal Networks by Magnetic Field Driven Molecular Orientation

Aligned liquid crystal networks were synthesized by photopolymerization of liquid crystal monomers in the presence of magnetic fields. Grazing incident wide-angle X-ray scattering was used to characterize the degree of molecular alignment of mesogen chains and time-domain thermoreflectance was used to measure thermal conductivity. Liquid crystal networks with mesogenic units aligned perpendicular and parallel to the substrate exhibit thermal conductivity of 0.34 W m^-1 K^-1 and 0.22 W m^-1 K^-1, respectively. The thermal conductivity and orientational order of liquid crystal networks vary as a function of temperature. The thermal conductivity of liquid crystal networks can be manipulated by a magnetic field at above the glass transition temperature (65 °C) where the reduced viscosity enables molecular reorientation on the time scale of 10 min.

Aligning self-assembled gelators by drying under shear

We show how drying under shear can be used to prepare aligned fibres and worm-like micelles from low molecular weight gelators. Shearing followed by drying leads to the dealignment before the water can be removed; continuous shear whilst drying is required to maintain the alignment. Combining a slow pH change with continuous shear allows alignment of the gelling fibres, which can then be dried.

Thermomagnetic processing of liquid-crystalline epoxy resins and their mechanical characterization using nanoindentation

A thermomagnetic processing method was used to produce a biphenyl-based liquid-crystalline epoxy resin (LCER) with oriented liquid-crystalline (LC) domains. The orientation of the LCER was confirmed and quantified using two-dimensional X-ray diffraction. The effect of molecular alignment on the mechanical and thermomechanical properties of the LCER was investigated using nanoindentation and thermomechanical analysis, respectively. The effect of the orientation on the fracture behavior was also examined. The results showed that macroscopic orientation of the LC domains was achieved, resulting in an epoxy network with an anisotropic modulus, hardness, creep behavior, and thermal expansion.