Porous silicon antireflection coating by electrochemical and chemical etching for silicon solar cell manufacturing

Autogenic single p/n-junction solar cells from black-Si nano-grass structures of p-to-n type self-converted electronic configuration

Photovoltaic performance of solar cells automatically improves when the absorber layer itself simultaneously acts as the anti-reflection nanostructure with an enhanced active absorber area on the front surface. Combined physical and chemical etching of p-c-Si wafers by (Ar + H2) plasma in inductively coupled low-pressure plasma CVD produces various nanostructures with subsequent minimization of reflectance. At a reduced temperature, the rate constant of thermal diffusion of atomic-H in the Si-network becomes smaller, leading to enhanced chemical etching reactions that further increase at an elevated RF power. Regrowth of the SiHn precursors produced by etching and subsequent hydrogenation in the plasma develops a high density of elongated nano-grass structures, which further align with sharp tips via Ar+ ion bombardment and elimination of loosely bound amorphous over-layers, on application of negative dc substrate bias during real-time etching and regrowth. A significantly reduced reflectance (∼0.5%) via coherent light trapping within the uniformly distributed vertically aligned nano-grass surfaces evolves truly black-silicon (b-Si) nanostructures, which further self-convert from the p-type to n-type electronic configuration via etching-mediated modification of B-H bonds from BH1 to BH2 and/or BH3 states, producing autogenic p/n junctions. Using (Ar + H2) plasma etched b-Si nano-grass structures at low temperature (∼200 °C), one-step fabrication of autogenic single p/n-junction proof-of-concept solar cells is accomplished. There is plenty of room for further progress in device performance.

Fabrication of porous silicon by metal-assisted etching using highly ordered gold nanoparticle arrays

A simple method for the fabrication of porous silicon (Si) by metal-assisted etching was developed using gold nanoparticles as catalytic sites. The etching masks were prepared by spin-coating of colloidal gold nanoparticles onto Si. An appropriate functionalization of the gold nanoparticle surface prior to the deposition step enabled the formation of quasi-hexagonally ordered arrays by self-assembly which were translated into an array of pores by subsequent etching in HF solution containing H2O2. The quality of the pattern transfer depended on the chosen preparation conditions for the gold nanoparticle etching mask. The influence of the Si surface properties was investigated by using either hydrophilic or hydrophobic Si substrates resulting from piranha solution or HF treatment, respectively. The polymer-coated gold nanoparticles had to be thermally treated in order to provide a direct contact at the metal/Si interface which is required for the following metal-assisted etching. Plasma treatment as well as flame annealing was successfully applied. The best results were obtained for Si substrates which were flame annealed in order to remove the polymer matrix - independent of the substrate surface properties prior to spin-coating (hydrophilic or hydrophobic). The presented method opens up new resources for the fabrication of porous silicon by metal-assisted etching. Here, a vast variety of metal nanoparticles accessible by well-established wet-chemical synthesis can be employed for the fabrication of the etching masks.

High surface area silicon materials: fundamentals and new technology

Crystalline silicon forms the basis of just about all computing technologies on the planet, in the form of microelectronics. An enormous amount of research infrastructure and knowledge has been developed over the past half-century to construct complex functional microelectronic structures in silicon. As a result, it is highly probable that silicon will remain central to computing and related technologies as a platform for integration of, for instance, molecular electronics, sensing elements and micro- and nanoelectromechanical systems. Porous nanocrystalline silicon is a fascinating variant of the same single crystal silicon wafers used to make computer chips. Its synthesis, a straightforward electrochemical, chemical or photochemical etch, is compatible with existing silicon-based fabrication techniques. Porous silicon literally adds an entirely new dimension to the realm of silicon-based technologies as it has a complex, three-dimensional architecture made up of silicon nanoparticles, nanowires, and channel structures. The intrinsic material is photoluminescent at room temperature in the visible region due to quantum confinement effects, and thus provides an optical element to electronic applications. Our group has been developing new organic surface reactions on porous and nanocrystalline silicon to tailor it for a myriad of applications, including molecular electronics and sensing. Integration of organic and biological molecules with porous silicon is critical to harness the properties of this material. The construction and use of complex, hierarchical molecular synthetic strategies on porous silicon will be described.