Junction Welding Techniques for Metal Nanowire Network Electrodes

Extracting the Temperature Dependence of Both Nanowire Resistivity and Junction Resistance from Electrical Measurements on Printed Silver Nanowire Networks

Printed networks of nanoparticles (e.g., nanodots, nanowires, nanosheets) are important for a range of electronic, sensing and energy storage applications. Characterizing the temperature dependence of both the nanoparticle resistivity (ρNW) and interparticle junction resistance (R J) in such networks is crucial for understanding the conduction mechanism and so for optimizing network properties. However, it is challenging to extract both ρNW and R J from standard electrical measurements. Here, using silver nanowires (AgNWs) as a model system, we describe a broadly applicable method to extract both parameters from resistivity measurements on nanowire networks. We achieve this by combining a simple theoretical model with temperature-dependent resistivity measurements on sets of networks fabricated from nanowires of different lengths. As expected, our results demonstrate that R J is the predominant bottleneck for charge transport within these networks, with R NW/R J in the range 0.03-0.7. We demonstrate that the temperature dependence of ρNW exhibits characteristic Bloch-Grüneisen behavior, yielding a Debye temperature between 133-181 K, which aligns with reported values for individual nanowires. Likewise, our findings for residual resistivity and electron-phonon coupling constants closely match published values measured on individual nanowires. The junction resistance also follows Bloch-Grüneisen behavior with similar parameters, indicating the junctions consist of metallic silver. These findings confirm the validity of our method and provide a deeper insight into the conduction mechanisms in AgNW networks. They also pave the way toward simultaneous measurement of ρNW and R J in other important systems, notably carbon nanotube networks.

Fabrication of Flexible Transparent Conductive Films via an Energy-Efficient In Situ Chemical Welding and Reinforcement Strategy

Recently, flexible transparent conductive films composed of metal nanowires have received significant interest, particularly for flexible electronics. However, the high contact resistance among metal nanowires and the weak bonding effect between metal nanowires and substrates often result in films whose conductivity, adhesion, and flexibility fall short of the stringent requirements demanded by real-world uses. We developed a simple method to fabricate high-performance flexible transparent conductive films via successively spin-coating silver nanowires (AgNWs) and acidic silica sol onto the surface of the substrate. Under the capillary force of ethanol and the etching effect of hydrochloric acid, the adjacent AgNWs are induced to chemically weld in situ to form a stable network. The resulting composite film exhibits a sheet resistance of only 8.5 Ω/sq, marking an impressive 80% decrease compared with the pristine AgNW film. Meanwhile, the silica sol acts as a filler, improving light transmittance while further reinforcing the network structure and firmly bonding it to the substrate. Thus, the delamination of the nanowires under bending motion is effectively inhibited, and the resulting film was endowed with resistance remaining below 15 Ω/sq after 3000 bending and 200 tape peeling. The energy-efficient in situ chemical welding and reinforcement method for nanowires provides an innovative strategy for the batch preparation of flexible transparent conductive films.

Flexible Nanocomposite Conductors for Electromagnetic Interference Shielding

HIGHLIGHTS

Convincing candidates of flexible (stretchable/compressible) electromagnetic interference shielding nanocomposites are discussed in detail from the views of fabrication, mechanical elasticity and shielding performance. Detailed summary of the relationship between deformation of materials and electromagnetic shielding performance. The future directions and challenges in developing flexible (particularly elastic) shielding nanocomposites are highlighted. With the extensive use of electronic communication technology in integrated circuit systems and wearable devices, electromagnetic interference (EMI) has increased dramatically. The shortcomings of conventional rigid EMI shielding materials include high brittleness, poor comfort, and unsuitability for conforming and deformable applications. Hitherto, flexible (particularly elastic) nanocomposites have attracted enormous interest due to their excellent deformability. However, the current flexible shielding nanocomposites present low mechanical stability and resilience, relatively poor EMI shielding performance, and limited multifunctionality. Herein, the advances in low-dimensional EMI shielding nanomaterials-based elastomers are outlined and a selection of the most remarkable examples is discussed. And the corresponding modification strategies and deformability performance are summarized. Finally, expectations for this quickly increasing sector are discussed, as well as future challenges.

Direct Writing of Silver Nanowire Patterns with Line Width down to 50 μm and Ultrahigh Conductivity

Direct writing of one-dimensional nanomaterials with large aspect ratios into customized, highly conductive, and high-resolution patterns is a challenging task. In this work, thin silver nanowires (AgNWs) with a length-to-diameter ratio of 730 are employed as a representative example to demonstrate a potent direct ink writing (DIW) strategy, in which aqueous inks using a natural polymer, sodium alginate, as the thickening agent can be easily patterned with arbitrary geometries and controllable structural features on a variety of planar substrates. With the aid of a quick spray-and-dry postprinting treatment at room temperature, the electrical conductivity and substrate adhesion of the written AgNWs-patterns improve simultaneously. This simple, environment benign, and low-temperature DIW strategy is effective for depositing AgNWs into patterns that are high-resolution (with line width down to 50 μm), highly conductive (up to 1.26 × 105 S/cm), and mechanically robust and have a large alignment order of NWs, regardless of the substrate's hardness, smoothness, and hydrophilicity. Soft electroadhesion grippers utilizing as-manufactured interdigitated AgNWs-electrodes exhibit an increased shear adhesion force of up to 15.5 kPa at a driving voltage of 3 kV, indicating the strategy is very promising for the decentralized and customized manufacturing of soft electrodes for future soft electronics and robotics.

Origin of Capillary-Force-Induced Welding in Ag Nanowires and Ag Nanowire/Carbon Nanotube Conductive Networks

Capillary-force-induced welding can effectively reduce the contact resistance between two silver nanowires (AgNWs) by merging the NW-NW junctions. Herein, we report a model for quantifying the capillary force between two nano-objects. The model can be used to calculate the capillary force generated between AgNWs and carbon nanotubes (CNTs) during water evaporation. The results indicate that the radius of one-dimensional nano-objects is crucial for capillary-force-induced welding. AgNWs with larger radii can generate a greater capillary force (F_AgNW-AgNW) at NW-NW junctions. In addition, for AgNW/CNT hybrid films, the use of CNTs with a radius close to that of AgNWs can result in a larger capillary force (F_AgNW-CNT) at NW-CNT junctions. The reliability of the model is verified by measuring the change in sheet resistance before and after capillary-force-induced welding of a series of AgNW and AgNW/CNT conductive films with varying radii.

Electrical conductivity of random metallic nanowire networks: an analytical consideration along with computer simulation

The current interest in the study of the 2D systems of randomly deposited metallic nanowires is inspired by a combination of their high electrical conductivity with excellent optical transparency. Metallic nanowire networks show great potential for use in numerous technological applications. Although there are models that describe the electrical conductivity of the random nanowire networks through wire resistance, junction resistance, and number density of nanowires, they are either not rigorously justified or contain fitting parameters. We have proposed a model for the electrical conductivity in random metallic nanowire networks. We have mimicked such random nanowire networks as random resistor networks (RRN) produced by the homogeneous, isotropic, and random deposition of conductive zero-width sticks onto an insulating substrate. We studied the electrical conductivity of these RRNs using a mean-field approximation. An analytical dependency of the electrical conductivity on the main physical parameters (the number density and electrical resistances of these wires and of the junctions between them) has been derived. Computer simulations have been performed to validate our theoretical predictions. We computed the electrical conductivity of the RRNs against the number density of the conductive fillers for the junction-resistance-dominated case and for the case where the wire resistance and the junction resistance were equal. The results of the computations were compared with this mean-field approximation. Our computations demonstrated that our analytical expression correctly predicts the electrical conductivity across a wide range of number densities.

Electroplated core-shell nanowire network electrodes for highly efficient organic light-emitting diodes

In this study, we performed metal (Ag, Ni, Cu, or Pd) electroplating of core-shell metallic Ag nanowire (AgNW) networks intended for use as the anode electrode in organic light-emitting diodes (OLEDs) to modify the work function (WF) and conductivity of the AgNW networks. This low-cost and facile electroplating method enabled the precise deposition of metal onto the AgNW surface and at the nanowire (NW) junctions. AgNWs coated onto a transparent glass substrate were immersed in four different metal electroplating baths: those containing AgNO₃ for Ag electroplating, NiSO₄ for Ni electroplating, Cu₂P₂O₇ for Cu electroplating, and PdCl₂ for Pd electroplating. The solvated metal ions (Ag⁺, Ni²⁺, Cu²⁺, and Pd²⁺) in the respective electroplating baths were reduced to the corresponding metals on the AgNW surface in the galvanostatic mode under a constant electric current achieved by linear sweep voltammetry via an external circuit between the AgNW networks (cathode) and a Pt mesh (anode). The amount of electroplated metal was systematically controlled by varying the electroplating time. Scanning electron microscopy images showed that the four different metals (shells) were successfully electroplated on the AgNWs (core), and the nanosize-controlled electroplating process produced metal NWs with varying diameters, conductivities, optical transmittances, and WFs. The metal-electroplated AgNWs were successfully employed as the anode electrodes of the OLEDs. This facile and low-cost method of metal electroplating of AgNWs to increase their WFs and conductivities is a promising development for the fabrication of next-generation OLEDs.

Fabrication of junction-free Cu nanowire networks via Ru-catalyzed electroless deposition and their application to transparent conducting electrodes

Over the past few years, metal nanowire networks have attracted attention as an alternative to transparent conducting oxide materials such as indium tin oxide for transparent conducting electrode applications. Recently, electrodeposition of metal on nanoscale template is widely used for formation of metal network. In the present work, junctionless Cu nanowire networks were simply fabricated on a substrate by forming a nanostructured Ru with 80 nm width as a seed layer, followed by direct electroless deposition of Cu. By controlling the density of Ru nanowires or the electroless deposition time, we readily achieve desired transmittance and sheet resistance values ranging from ∼1 kΩ sq^-1at 99% to 9 Ω sq^-1at 89%. After being transferred to flexible substrates, the nanowire networks exhibited no obvious increase in resistance during 8000 cycles of a bending test to a radius of 2.5 mm. The durability was verified by evaluation of its heating performance. The maximum temperature was greater than 180 °C at 3 V and remained constant after three repeated cycles and for 10 min. Transmission electron microscopy and x-ray diffraction studies revealed that the adhesion between the electrolessly deposited Cu and the seed Ru nanowires strongly influenced the durability of the core-shell structured nanowire-based heaters.

Radio Frequency Induction Welding of Silver Nanowire Networks for Transparent Heat Films

Transparent heat films (THFs) are attracting increasing attention for their usefulness in various applications, such as vehicle windows, outdoor displays, and biosensors. In this study, the effects of induction power and radio frequency on the welding characteristics of silver nanowires (Ag NWs) and Ag NW-based THFs were investigated. The results showed that higher induction frequency and higher power increased the welding of the Ag NWs through the nano-welding at the junctions of the Ag NWs, which produced lower sheet resistance, and improved the adhesion of the Ag NWs. Using the inductive welding condition of 800 kHz and 6 kW for 60 s, 100 ohm/sq of Ag NW thin film with 95% transmittance at 550 nm after induction heating could be decreased to 56.13 ohm/sq, without decreasing the optical transmittance. In addition, induction welding of the Ag NW-based THFs improved haziness, increased bending resistance, enabled higher operating temperature at a given voltage, and improved stability.

Electroplated Silver-Nickel Core-Shell Nanowire Network Electrodes for Highly Efficient Perovskite Nanoparticle Light-Emitting Diodes

The low sheet resistance and high optical transparency of silver nanowires (AgNWs) make them a promising candidate for use as the flexible transparent electrode of light-emitting diodes (LEDs). In a perovskite LED (PeLED), however, the AgNW electrode can react with the overlying perovskite material by redox reactions, which limit the electroluminescence efficiency of the PeLED by causing the degradation of and generating defect states in the perovskite material. In this study, we prepared Ag-Ni core-shell NW electrodes using the solution-electroplating technique to realize highly efficient PeLEDs based on colloidal formamidinium lead bromide (FAPbBr₃) nanoparticles (NPs). Solvated Ni ions from the NiSO₄ source were deposited onto the surface of AgNW networks in three steps: (i) cathodic cleaning, (ii) adsorption of the Ni-ion complex onto the AgNW surface, and (iii) uniform electrodeposition of Ni. An ultrathin (∼3.5 nm) Ni layer was uniformly deposited onto the AgNW surface, which exhibited a sheet resistance of 16.7 Ω/sq and an optical transmittance of 90.2%. The Ag-Ni core-shell NWs not only increased the work function of the AgNW electrode, which facilitated hole injection into the emitting layer, but also suppressed the redox reaction between Ag and FAPbBr₃ NPs, which prevented the degradation of the emitting layer and the generation of defect states in it. The resulting PeLEDs based on FAPbBr₃ NPs with the Ag-Ni core-shell NWs showed high current efficiency of 44.01 cd/A, power efficiency of 35.45 lm/W, and external quantum efficiency of 9.67%.