Open circuit stability of underpotentially deposited Pb monolayer on Cu(111)

Impact of Surface Composition Changes on the CO2-Reduction Performance of Au-Cu Aerogels

Over the past decades, the electrochemical CO2-reduction reaction (CO2RR) has emerged as a promising option for facilitating intermittent energy storage while generating industrial raw materials of economic relevance such as CO. Recent studies have reported that Au-Cu bimetallic nanocatalysts feature a superior CO2-to-CO conversion as compared with the monometallic components, thus improving the noble metal utilization. Under this premise and with the added advantage of a suppressed H2-evolution reaction due to absence of a carbon support, herein, we employ bimetallic Au3Cu and AuCu aerogels (with a web thickness ≈7 nm) as CO2-reduction electrocatalysts in 0.5 M KHCO3 and compare their performance with that of a monometallic Au aerogel. We supplement this by investigating how the CO2RR-performance of these materials is affected by their surface composition, which we modified by systematically dissolving a part of their Cu-content using cyclic voltammetry (CV). To this end, the effect of this CV-driven composition change on the electrochemical surface area is quantified via Pb underpotential deposition, and the local structural and compositional changes are visually assessed by employing identical-location transmission electron microscopy and energy-dispersive X-ray analyses. When compared to the pristine aerogels, the CV-treated samples displayed superior CO Faradaic efficiencies (≈68 vs ≈92% for Au3Cu and ≈34 vs ≈87% for AuCu) and CO partial currents, with the AuCu aerogel outperforming the Au3Cu and Au counterparts in terms of Au-mass normalized CO currents among the CV-treated samples.

Electroless Deposition of Pb Monolayer: A New Process and Application to Surface Selective Atomic Layer Deposition

The present work demonstrates an electroless (e-less) deposition of Pb monolayer on Au and Cu surface whose morphology and properties resemble its underpotentially deposited counterpart. Our results and analysis show that the e-less Pb monolayer deposition is a surface selective, surface controlled, self-terminating process. Results also show that the electroless Pb monolayer deposition is enabling a phenomenon for new deposition method called "electroless atomic layer deposition" (e-less ALD). Here, the e-less Pb monolayer serves as reducing agent and sacrificial material in surface limited redox replacement reaction with noble metal ions such as Pt ⁿ⁺, i.e., Pt deposition. The e-less ALD is highly selective to the metal substrates at which Pb forms the e-less monolayer. The full e-less ALD cycle leads to an overall deposition of a controlled amount of the noble metal. Repetition of the two-step e-less ALD cycle an arbitrary number of times leads to formation of a highly compact, smooth, and conformal noble metal thin film with applications spanning from catalyst synthesis to semiconductor technology. The process is designed for (but not limited to) aqueous solutions that can be easily scaled up to any size and shape of the substrate, deeming its wide applications.

Processing of nanoporous Ag layers by potential-controlled displacement (PCD) of Cu

A cementation-like process taking place under potential control and introduced in this work as a "potential-controlled displacement" (PCD) is developed as a new method for processing of nanoporous Ag structures with controlled roughness (porosity) length scales. Most of the development work is done in a deoxygenated electrolyte containing 1 x 10(-3) M AgClO(4 )+ 5 x 10(-2) M CuSO(4) + 1 x 10(-1) M HClO(4) using a copper rotating disk electrode at 50 rpm. At this electrolyte concentration, the Ag deposition is under diffusion limitations whereas the Cu dissolution displays a typical Butler-Volmer anodic behavior. Thus, a careful choice of the operational current density enables strict control of the ratio between the dissolving and depositing metals as ascertained independently by atomic absorption spectrometry (AAS). The roughness length scale of the resulting surfaces is controlled by a careful selection of the current density applied. The highest surface area and finest morphology is obtained when the atomic ratio of Ag deposition and Cu dissolution becomes 1:1. Preseeding of uniform Ag clusters on the Cu surface made by pulse plating of Ag along with complementary plating and stripping of Pb monolayer is found to yield finer length scale resulting in up to a 67% higher surface area. An electrochemical technique using as a reference value the charge of an underpotentially deposited Pb layer on a flat Ag surface is used for measuring the real surface area. Scanning electron microscopy (SEM) studies are conducted to examine and characterize the deposit morphology of Ag grown by PCD on Cu substrates.