Hole Formation Process in Ultrashort Pulse Laser Percussion Drilling

Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials

We report on a comprehensive study of laser percussion microvia drilling of FR-4 printed circuit board material using ultrashort pulse lasers with emission in the green spectral region. Laser pulse durations in the pico- and femtosecond regime, laser pulse repetition rates up to 400 kHz and laser fluences up to 11.5 J/cm2 are applied to optimize the quality of microvias, as being evaluated by the generated taper, the extension of glass fiber protrusions and damage of inner lying copper layers using materialography. The results are discussed in terms of the ablation threshold for FR-4 and copper, heat accumulation and pulse shielding effects as a result of pulse to pulse interactions. As a specific result, using a laser pulse duration of 2 ps appears beneficial, resulting in small glass fiber protrusions and high precision in the stopping process at inner copper layer. If laser pulse repetition rates larger than 100 kHz are applied, we find that the processing quality can be increased by heat accumulation effects.

Experimental investigation of femtosecond laser through-hole drilling of stainless steel with and without transverse magnetic assistance

An experimental investigation of femtosecond laser through-hole drilling of stainless-steel 304 with and without transverse magnetic assistance was conducted. The characteristics of the through-hole geometry and sidewall as well as the chemical composition of the through-hole sidewall surface were analyzed. In addition, a theoretical analysis of magnetic-field-assisted femtosecond laser through-hole drilling is proposed. The results showed that transverse magnetic assistance could improve both the femtosecond laser through-hole drilling quality (through-hole geometry and sidewall characteristics) and efficiency. The primary reason is that transverse magnetic assistance changes the distribution of plasma and reduces the plasma density, which weakens the shielding effect of the plasma. However, compared with nanosecond laser drilling, the effect of the magnetic field on the femtosecond laser through-hole drilling was not obvious. A noticeable thermal effect appeared near the through-hole entrance at a pulse repetition rate of 500 kHz, and a heat affected zone and oxidation zone were produced, which is disadvantageous to laser drilling. This research has good prospects for industrial applications.

In vitro evaluation of ultrafast laser drilling large-size holes on sheepshank bone

Bone drilling has been widely used in medical surgeries such as repair and fixation in orthopedics. Traditional drilling method using drill-bits inevitably causes significant thermal and mechanical trauma in the adjacent bone tissues. This paper demonstrates the feasibility of femtosecond laser drilling in vitro large-size holes on the sheepshank bone with high efficiency and minimal collateral damage. A Yb:KGW femtosecond laser was utilized to drill millimeter-scale holes on the bone under different cooling conditions including gas- and water-assisted processes. Scanning electron microscopy, confocal laser scanning microscopy and infrared thermographic imaging system were used to investigate the residual debris, removal rate, bone temperature variation and hole morphology. Histological examination, Fourier transform infrared spectroscopy and Raman spectroscopy were employed to study thermal damage. Results show that a 4 mm hole with smooth and clean surface was successfully drilled on the bone, and the highest removal rate of 0.99 mm³/s was achieved, which was twenty times higher than the previous study of 0.05 mm³/s. Moreover, bone and bone marrow were distinguished by real-time monitoring system during laser drilling. This work demonstrates the potential for clinical applications using an ultrafast laser to produce crack-free large-size bone holes.

Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses

Holes through silicon substrates are used in silicon microsystems, for example in vertical electrical interconnects. In comparison to deep reactive ion etching, laser drilling is a versatile method for forming these holes, but laser drilling suffers from poor hole quality. In this article, water is used in the silicon drilling process to remove debris and the shape deformations of the holes. Water is introduced into the drilling process through the backside of the substrate to minimize negative effects to the drilling process. Drilling of inclined holes is also demonstrated. The inclined holes could find applications in radio frequency devices.

Mechanism and elimination of bending effect in femtosecond laser deep-hole drilling

In this work, a comprehensive study of the bending effect, which remains one of the most critical challenges during deep-hole drilling, was conducted. The experimental statistics indicate that polarization is not the main factor in bending, but the deviation of the hole tends to be perpendicular to the polarization direction. Also, the dynamic ablated material/plasma was studied. Straight microholes were obtained by extending the interval between laser pulses to avoid dynamic ablated material existing in the millisecond time domain. Therefore, we speculated that the disturbance of the laser beam at the dynamic ablated aerosol, which have not sufficiently dispersed in the millisecond domain, is the main mechanism of bending. However, to more efficiently reduce the disturbance factor, a rough vacuum environment was applied; and the bending effect was also eliminated. The critical pressure for eliminating bending was about 2 × 10(4) Pa that is about one order of magnitude lower than the atmosphere. The fabricated high-quality microhole arrays without bending show that the proposed drilling method is convenient and efficient with high repeatability and controllability.

Influence of ambient pressure on the ablation hole in femtosecond laser drilling Cu

The holes were drilled by femtosecond laser pulse (800 nm, 100 fs) on Cu sheets at different ambient pressures. The pressure range was from 1 Pa to atmospheric pressure. The number of pulses to drill through the target, the stable photodiode signal, and the hole diameter were obtained as functions of ambient pressure. The morphology of the hole was observed by a scanning electron microscope (SEM). The result showed that the ambient pressure had significant influence on the morphology of the hole.

Burst train generator of high energy femtosecond laser pulses for driving heat accumulation effect during micromachining

A new method for generating high-repetition-rate (12.7-38.2 MHz) burst trains of femtosecond laser pulses has been demonstrated for the purpose of tailoring ultrashort laser interactions in material processing that can harness the heat accumulation effect among pulses separated by a short interval (i.e., 26 ns). Computer-controlled time delays were applied to synchronously trigger the high frequency switching of a high voltage Pockels cell to specify distinctive values of polarization rotation for each round-trip of a laser pulse cycling within a passive resonator. Polarization dependent output coupling facilitated the flexible shaping of the burst envelope profile to provide burst trains of up to ∼1  mJ of burst energy divided over a selectable number (1 to 25) of pulses. Individual pulses of variable energy up to 150 μJ and with pulse duration tunable over 70 fs to 2 ps, were applied in burst trains to generate deep and high aspect ratio holes that could not form with low-repetition-rate laser pulses.