Improving dimensional stability at high temperature and toughness of polyimide films via adjustable entanglement density

Lightweight Copolymerized Polyimide Foams Containing Trifluoromethyl and Siloxane Moieties for Thermal Insulation and Hydrophobic Applications

Lightweight porous materials with integrated cushioning and shock absorption, excellent thermal insulation, and hydrophobicity demonstrate a broad application prospect in high-end engineering sectors. Herein, the fabrication of lightweight polyimide foams (PIFs) containing trifluoromethyl and siloxane moieties was proposed by adopting copolymerization and microwave-assisted foaming processes. The synthesis and preparation of fluorine- and silicon-containing polyester ammonium salt (PEAS) precursor powders and subsequent PIFs, as well as the relationship and mechanism between structure and properties, were systematically explored. The construction of the anisotropic pore structure was attributed to the "bottom-up" directional foaming behavior of the microwave-assisted foaming process, which endowed PIFs with different traits with respect to the pore growth direction. The resulting copolymerized PIFs displayed low density (18.3-27.7 kg/m3), enhanced mechanical flexibility (compressive strength improvement of 26.2%, compression response rate between 97.5 and 99.1%), excellent thermal stability (T5% > 485.2 °C), and thermal insulation performance. Combining the micro/nano pore structure with the presence of hydrophobic trifluoromethyl and siloxane moieties, PIFs exhibited exceptional hydrophobicity with the water contact angle, reaching as high as 145.9° in the vertical direction (parallel to pore growth direction) and 136.3° in the horizontal direction (perpendicular to pore growth direction). Therefore, lightweight, mechanically flexible, thermally insulating, and hydrophobic PIFs were successfully prepared by the proposed approach, which demonstrate potential applications in the aerospace, transportation, microelectronics, and nuclear energy sectors, among others.

Ultrastrong, Ductile, Tear- and Folding-Resistant Polyimide Film Doubly Reinforced by an Aminated Rigid-Rod Macromolecule and Graphene Oxide

As a high-performance polymer with exceptional mechanical, thermal, and insulating properties, polyimide (PI) has been widely used as flexible circuit substrates for microelectronics, portable electronics, and wearable devices. Due to the growing demand for further thinning and lightweighting of electronic products, PI films need to have further enhanced mechanical properties. Traditional nanofiller-reinforced PI films often exhibit reduced ductility and limited improvements in strength. Therefore, it remains a challenge to simultaneously improve the strength and toughness of PI films while preserving their ductility. In this study, we report an exceptionally strong and ductile PI doubly reinforced by one-dimensional rigid-rod para-aramid, poly(p-aminophenylene aminoterephthalamide ((NH2)2-PPTA), and two-dimensional graphene oxide (GO) nanosheets. The amino side groups of (NH2)2-PPTA react with the anhydride end groups of PI, forming covalent bonds. At a (NH2)2-PPTA content of only 0.4 wt %, the (NH2)2-PPTA/PI film displays significantly enhanced mechanical properties. When 0.4 wt % of GO is added together with (NH2)2-PPTA, the tensile strength, tensile toughness, and strain at break reach 284.8 ± 5.3 MPa, 277.9 ± 7.6 MJ/m3, and 132.6 ± 3.8%, which are ∼178, ∼312, and ∼51% higher, respectively, than those of pure PI. Moreover, the doubly reinforced PI film also exhibits a 206% increase in tear strength and significantly enhanced folding resistance. The dual reinforcement of PI with (NH2)2-PPTA and GO improves the mechanical properties more efficiently than any single reinforcing agents previously reported and overcomes the disadvantage of most inorganic nanofillers that reduce ductility.

Revealing Hydrogen Bond Effect in Rechargeable Aqueous Zinc-Organic Batteries

The surrounding hydrogen bond (H-bond) interaction around the active sites plays indispensable functions in enabling the organic electrode materials (OEMs) to fulfill their roles as ion reservoirs in aqueous zinc-organic batteries (ZOBs). Despite important, there are still no works could fully shed its real effects light on. Herein, quinone-based small molecules with a H-bond evolution model has been rationally selected to disclose the regulation and equilibration of H-bond interaction between OEMs, and OEM and the electrolyte. It has been found that only a suitable H-bond interaction could make the OEMs fully liberate their potential performance. Accordingly, the 2,5-diaminocyclohexa-2,5-diene-1,4-dione (DABQ) with elaborately designed H-bond structure exhibits a capacity of 193.3 mAh g-1 at a record-high mass loading of 66.2 mg cm-2 and 100 % capacity retention after 1500 cycles at 5 A g-1. In addition, the DABQ//Zn battery also possesses air-rechargeable ability by utilizing the chemistry redox of proton. Our results put forward a specific pathway to precise utilization of H-bond to liberate the performance of OEMs.

Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes

High-quality and free-standing polyimide (PI) film with desirable mechanical properties and uniformity is in high demand due to its widespread applications in highly precise flexible and chip-integrated sensors. In this study, a free-standing PI film with high toughness was successfully prepared using a diamine monomer with ether linkages. The prepared PI films exhibited significantly superior mechanical properties compared to PI films of the same molecular structure, which can be attributed to the systematic exploration of the film-forming process. The exploration of the film-forming process includes the curing procedures, film-forming substrates, and annealing treatments. Additionally, the thickness uniformity and surface homogeneity of free-standing films were crucial for toughness. Increasing the crystallinity of the PI films by eliminating residual stress also contributed to their high strength. The results demonstrate that by adjusting the above-mentioned factors, the prepared PI films possess excellent mechanical properties, with tensile strength and elongation at break of 194.71 MPa and 130.13%, respectively.

Superior Strong and Tough Nacre-Inspired Materials by Interlayer Entanglement

Natural materials teach that mechanical dissipative interactions relieve the conflict between strength and toughness and enable fabrication of strong yet tough artificial materials. Replicating natural nacre structure has yielded rich biomimetic materials; however, stronger interlayer dissipation still waits to be exploited to extend the performance limits of artificial nacre materials. Here, we introduce strong entanglement as a new artificial interlayer dissipative mechanism and fabricate entangled nacre materials with superior strength and toughness, across molecular to nanoscale nacre structures. The entangled graphene nacre fibers achieved high strength of 1.2 GPa and toughness of 47 MJ/m³, and films reached 1.5 GPa and 25 MJ/m³. Experiments and simulations reveal that strong entanglement can effectively dissipate interlayer energy to relieve the conflict between strength and toughness, acting as natural folded proteins. The strong interlayer entanglement opens up a new path for designing stronger and tougher artificial materials to mimic but surpass natural materials.