Review of thermal conductivity in composites: Mechanisms, parameters and theory

Synchronously enhancing thermal conductivity and dielectric properties in epoxy composites via incorporation of functionalized boron nitride

Polymer-like dielectrics with superb thermal conductivity as well as high dielectric properties hold great promise for the modern electronic field. Nevertheless, integrating these properties into a single material simultaneously remains problematic due to their mutually limited physical connotations. In this study, we developed high-quality thermally conductive epoxy composites with excellent dielectric properties. This was achieved by incorporating surface-functionalized microscale hexagonal boron nitride (BN) along with N-[3-(Trimethoxysilyl)propyl]ethylene diamine (DN) and N-[3-(Trimethoxysilyl)propyl]aniline (PN). In the resulting epoxy composite, microscale BN serves as the primary building block for establishing the thermally conductive network, while silica particles act as bridges to regulate heat transfer and reduce interfacial phonon-scattering. The prepared composites were thoroughly examined across various filler contents (ranging from 10 to 80 wt%). Among them, the DNBN/epoxy composite exhibited higher thermal conductivity (in-plane: 47.03 W m-1 K-1) at 60 wt% filler content compared to BN/epoxy (39.40 W m-1 K-1) and PNBN/epoxy (33 W m-1 K-1) composites. These results highlight the usefulness of surface modification of BN in improving compatibility between fillers and epoxy, ultimately reducing composite viscosity. Furthermore, the DNBN/epoxy composite at 60 wt% demonstrated superb dielectric constant (∼6.15) without compromising on dissipation loss (∼0.06). The strategy adopted in this study offers significant insights into designing dielectric thermally conductive composites with superior performance outcomes.

Elastic SiC Aerogel for Thermal Insulation: A Systematic Review

SiC aerogels with their lightweight nature and exceptional thermal insulation properties have emerged as the most ideal materials for thermal protection in hypersonic vehicles; However, conventional SiC aerogels are prone to brittleness and mechanical degradation when exposed to complex loads such as shock and mechanical vibration. Hence, preserving the structural integrity of aerogels under the combined influence of thermal and mechanical external forces is crucial not only for stabling their thermal insulation performance but also for determining their practicality in harsh environments. This review focuses on the optimization of design based on the structure-performance of SiC aerogels, providing a comprehensive review of the inherent correlations among structural stability, mechanical properties, and insulation performance. First, the thermal transfer mechanism of aerogels from a microstructural perspective is studied, followed by the relationship between the building blocks of SiC aerogels (0D particles, 1D nanowires/nanofibers) and their compression performance (including compressive resilience, compressive strength, and fatigue resistance). Moreover, the strategy to improve the high-temperature oxidation resistance and insulation performance of SiC aerogels is explored. Lastly, the challenges and future breakthrough directions for SiC aerogels are presented.

Advanced Cooling Textiles: Mechanisms, Applications, and Perspectives

High-temperature environments pose significant risks to human health and safety. The body's natural ability to regulate temperature becomes overwhelmed under extreme heat, leading to heat stroke, dehydration, and even death. Therefore, the development of effective personal thermal-moisture management systems is crucial for maintaining human well-being. In recent years, significant advancements have been witnessed in the field of textile-based cooling systems, which utilize innovative materials and strategies to achieve effective cooling under different environments. This review aims to provide an overview of the current progress in textile-based personal cooling systems, mainly focusing on the classification, mechanisms, and fabrication techniques. Furthermore, the challenges and potential application scenarios are highlighted, providing valuable insights for further advancements and the eventual industrialization of personal cooling textiles.

Review of sustainable, eco-friendly, and conductive polymer nanocomposites for electronic and thermal applications: current status and future prospects

Biodegradable polymer nanocomposites (BPNCs) are advanced materials that have gained significant attention over the past 20 years due to their advantages over conventional polymers. BPNCs are eco-friendly, cost-effective, contamination-resistant, and tailorable for specific applications. Nevertheless, their usage is limited due to their unsatisfactory physical and mechanical properties. To improve these properties, nanofillers are incorporated into natural polymer matrices, to enhance mechanical durability, biodegradability, electrical conductivity, dielectric, and thermal properties. Despite the significant advances in the development of BPNCs over the last decades, our understanding of their dielectric, thermal, and electrical conductivity is still far from complete. This review paper aims to provide comprehensive insights into the fundamental principles behind these properties, the main synthesis, and characterization methods, and their functionality and performance. Moreover, the role of nanofillers in strength, permeability, thermal stability, biodegradability, heat transport, and electrical conductivity is discussed. Additionally, the paper explores the applications, challenges, and opportunities of BPNCs for electronic devices, thermal management, and food packaging. Finally, this paper highlights the benefits of BPNCs as biodegradable and biodecomposable functional materials to replace traditional plastics. Finally, the contemporary industrial advances based on an overview of the main stakeholders and recently commercialized products are addressed.

Predicting Phase Stability at Interfaces

We present the RAFFLE methodology for structural prediction of the interface between two materials and demonstrate its effectiveness by applying it to MgO encapsulated by two layers of graphene. To address the challenge of interface structure prediction, our methodology combines physical insights derived from morphological features observed in related systems with an iterative machine learning technique. This employs physical-based methods, including void-filling and n-body distribution functions to predict interface structures. For the carbon-MgO encapsulated system, we have shown the rocksalt and hexagonal phases of MgO to be the two most energetically stable in the few-layer regime. We demonstrate that monolayer rocksalt is heavily stabilized by interfacing with graphene, becoming more energetically favorable than the graphenelike monolayer hexagonal MgO. The RAFFLE methodology provides valuable insights into interface behavior, and a route to finding new materials at interfaces.

Structural and thermal analyses in semiconducting and metallic zigzag single-walled carbon nanotubes using molecular dynamics simulations

Equilibrium molecular dynamics (EMD) simulations have been performed to investigate the structural analysis and thermal conductivity (λ) of semiconducting (8,0) and metallic (12,0) zigzag single-walled carbon nanotubes (SWCNTs) for varying ±γ(%) strains. For the first time, the present outcomes provide valuable insights into the relationship between the structural properties of zigzag SWCNTs and corresponding thermal behavior, which is essential for the development of high-performance nanocomposites. The radial distribution function (RDF) has been employed to assess the buckling and deformation understandings of the (8,0) and (12,0) SWCNTs for a wide range of temperature T(K) and varying ±γ(%) strains. The visualization of SWCNTs shows that the earlier buckling and deformation processes are observed for semiconducting SWCNTs as compared to metallic SWCNTs for high T(K) and it also evident through an abrupt increase in RDF peaks. The RDF and visualization analyses demonstrate that the (8,0) SWCNTs can more tunable under compressive than tensile strains, however, the (12,0) zigzag SWCNTs indicate an opposite trend and may tolerate more tensile than compressive strains. Investigations show that the tunable domain of ±γ(%) strains decreases from (-10%≤ γ ≤+19%) to (-5%≤ γ ≤+10%) for (8,0) SWCNTs and the buckling process shifts to lower ±γ(%) for (12,0) SWCNTs with increasing T(K). For intermediate-high T(K), the λ(T) of (12,0) SWCNTs is high but the (8,0) SWCNTs show certainly high λ(T) for low T(K). The present λ(T, ±γ) data are in reasonable agreement with parts of previous NEMD, GK-HNEMD data and experimental investigations with simulation results generally under predicting the λ(T, ±γ) by the ∼1% to ∼20%, regardless of the ±γ(%) strains, depending on T(K). Our simulation data significantly expand the strain range to -10% ≤ γ ≤ +19% for both zigzag SWCNTs, depending on temperature T(K). This extension of the range aims to establish a tunable regime and delve into the intrinsic characteristics of zigzag SWCNTs, building upon previous work.

Thermal Conductivity in Concrete Samples with Natural and Synthetic Fibers

One crucial property of concrete, particularly in construction, is its thermal conductivity, which impacts heat transfer through conduction. For example, reducing the thermal conductivity of concrete can lead to energy savings in buildings. Various techniques exist for measuring the thermal conductivity of materials, but there is limited discussion in the literature about suitable methods for concrete. In this study, the transient line source method is employed to evaluate the thermal conductivity of concrete samples with natural and synthetic fibers after 7 and 28 days of curing. The results indicate that concrete with hemp fiber generally exhibits higher thermal conductivity values, increasing by 48% after 28 days of curing, while synthetic fibers have a minimal effect. In conclusion, this research opens the door to using natural alternatives like hemp fiber to improve concrete's thermal properties, providing alternatives for thermo-active foundations and geothermal energy piles which require high thermal conductivities.

Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges

With the integration and miniaturization of chips, there is an increasing demand for improved heat dissipation. However, the low thermal conductivity (TC) of polymers, which are commonly used in chip packaging, has seriously limited the development of chips. To address this limitation, researchers have recently shown considerable interest in incorporating high-TC fillers into polymers to fabricate thermally conductive composites. Hexagonal boron nitride (h-BN) has emerged as a promising filler candidate due to its high-TC and excellent electrical insulation. This review comprehensively outlines the design strategies for using h-BN as a high-TC filler and covers intrinsic TC and morphology effects, functionalization methods, and the construction of three-dimensional (3D) thermal conduction networks. Additionally, it introduces some experimental TC measurement techniques of composites and theoretical computational simulations for composite design. Finally, the review summarizes some effective strategies and possible challenges for the design of h-BN fillers. This review provides researchers in the field of thermally conductive polymeric composites with a comprehensive understanding of thermal conduction and constructive guidance on h-BN design.

Dual-Effect Coupling for Superior Dielectric and Thermal Conductivity of Polyimide Composite Films Featuring "Crystal-Like Phase" Structure

To match the increasing miniaturization and integration of electronic devices, higher requirements are put on the dielectric and thermal properties of the dielectrics to overcome the problems of delayed signal transmission and heat accumulation. Here, a 3D  porous thermal conductivity network is successfully constructed inside the polyimide (PI) matrix by the combination of ionic liquids (IL) and calcium fluoride (CaF2 ) nanofillers, motivated by the bubble-hole forming orientation force. Benefiting from the 3D thermal network formed by IL as a porogenic template and "crystal-like phase" structures induced by CaF2 - polyamide acid charge transfer, IL-10 vol% CaF2 /PI porous film exhibits a low permittivity of 2.14 and a thermal conductivity of 7.22 W m-1 K-1 . This design strategy breaks the bottleneck that low permittivity and high thermal conductivity in microelectronic systems are difficult to be jointly controlled, and provides a feasible solution for the development of intelligent microelectronics.

Enhancing the Thermal Conductivity of Epoxy Composites via Constructing Oriented ZnO Nanowire-Decorated Carbon Fibers Networks

With the miniaturization and high integration of electronic devices, high-performance thermally conductive composites have received increasing attention. The construction of hierarchical structures is an effective strategy to reduce interfacial thermal resistance and enhance composite thermal conductivity. In this study, by decorating carbon fibers (CF) with needle-like ZnO nanowires, hierarchical hybrid fillers (CF@ZnO) were rationally designed and synthesized using the hydrothermal method, which was further used to construct oriented aligned filler networks via the simple freeze-casting process. Subsequently, epoxy (EP)-based composites were prepared using the vacuum impregnation method. Compared with the pure CF, the CF@ZnO hybrid fillers led to a significant increase in thermal conductivity, which was mainly due to the fact that the ZnO nanowires could act as bridging links between CF to increase more thermally conductive pathways, which in turn reduced interfacial thermal resistance. In addition, the introduction of CF@ZnO fillers was also beneficial in improving the thermal stability of the EP-based composites, which was favorable for practical thermal management applications.

Impact of Graphitization Degree on the Electrochemical and Thermal Properties of Coal

Coal-based cryptocrystalline graphite is an intermediate phase formed during the transformation of highly metamorphic anthracite into crystalline graphite. In order to explore the relationship between the graphitization degree of coal-based cryptocrystalline graphite and its physical properties from macromolecular structure to provide a theoretical basis for industrial application, samples were tested by X-ray diffraction, electrochemistry, and thermal conductivity and compared with standard graphite (SG) and artificial thermal simulation graphitized samples. The results show that with the increase of graphitization degree and the growth of microcrystalline structure, the electrical impedance of cryptocrystalline graphite decreases, the conductivity increases, the specific capacity of initial discharge increases, and the thermal conductivity increases, which gradually approach the electrical and thermal properties of crystalline graphite. The linear equations between impedance and La and Lc are y = -0.42x + 70.44 and y = -1.87x + 70.62, and the correlation coefficients are 0.93 and 0.88. The linear equations between thermal conductivity and the horizontal extension length (La) and vertical stacking thickness (Lc) are y = 0.09x + 1.36 and y = 0.4x + 0.76, the correlation coefficients are 0.82 and 0.84., and the reduction of microcrystalline parameters d002 and the increase of La and Lc lead to a direct improvement of physical properties. Artificial thermal simulation samples also show the same regularity, but their physical properties are lower than those of natural evolution samples. Short-term high-temperature simulation is different from long-term magma heat and pressure, and the growth of graphite microcrystals is more complete under long-term geological conditions, resulting in better physical properties.

Application and Development of Smart Thermally Conductive Fiber Materials

In recent years, with the rapid advancement in various high-tech technologies, efficient heat dissipation has become a key issue restricting the further development of high-power-density electronic devices and components. Concurrently, the demand for thermal comfort has increased; making effective personal thermal management a current research hotspot. There is a growing demand for thermally conductive materials that are diversified and specific. Therefore, smart thermally conductive fiber materials characterized by their high thermal conductivity and smart response properties have gained increasing attention. This review provides a comprehensive overview of emerging materials and approaches in the development of smart thermally conductive fiber materials. It categorizes them into composite thermally conductive fibers filled with high thermal conductivity fillers, electrically heated thermally conductive fiber materials, thermally radiative thermally conductive fiber materials, and phase change thermally conductive fiber materials. Finally, the challenges and opportunities faced by smart thermally conductive fiber materials are discussed and prospects for their future development are presented.

Starch/carbon nanofibers bionanocomposites via melt mixing: Effect of dispersion and compatibility on conductivity and mechanical properties

Biodegradable polymers with conductivity and mechanical properties are required in several applications where it is necessary to substitute conductive synthetic plastics due to the high waste produced. In this study, bionanocomposites (BNCs) have been compounded by thermoplastification of rice starch via melt mixing with carbon nanofibers (NPs) and modified NPs (NPs [M]) using plasma of acrylic acid. Spectroscopy analysis, X-ray diffraction, and morphology were studied to elucidate the effect of dispersion and compatibility on the conductivity and mechanical properties. The incorporation of NPs promoted esterification reactions with starch during the melt mixing process, giving rise to changes in its crystal structure. NPs [M] showed better dispersion and compatibility because the plasma prevents reagglomeration and generates a stronger affinity. BNCs showed significative flexibility with remarked % elongation at break from 5.64 % to 248.60 %, and thermal conductivity increased from 0.10 to 0.58 W/m K, with NPs [M] at 5 %. In contrast, the electrical conductivity remained in the same magnitude order (10-4 S/cm). The better compatibility between starch-NPs [M] hinders electronic transport but increases the propagation of phonons to promote thermal conductivity. BNCs fabricated in this study by a dry and scalable process could be of interest in some application areas (intelligent food packing, electronics, textiles, etc.).

HL, Monticeli FM, Romanzini D. Effect of the Graphene Quantum Dot Content on the Thermal, Dynamic-Mechanical, and Morphological Properties of Epoxy Resin

Different amounts of graphene quantum dots (CQDs) (0, 1, 2.5, and 5 wt%) were incorporated into an epoxy matrix. The thermal conductivity, density, morphology, and dynamic mechanical thermal (DMTA) properties were reused from the study of Seibert et al.. The Pearson plot showed a high correlation between mass loading, thermal conductivity, and thermal diffusivity. A poorer correlation with density and heat capacity was observed. At lower CQD concentrations (0.1 wt%), the fracture surface showed to be more heterogeneous, while at higher amounts (2.5 and 5 wt%), a more homogeneous surface was observed. The storage modulus values did not change with the CQD amount. But the extension of the glassy plateau increased with higher CQD contents, with an increase of ~40 °C for the 5 wt% compared to the 2.5 wt% and almost twice compared to the neat epoxy. This result is attributed to the intrinsic characteristics of the filler. Additionally, lower energy dissipation and a higher glass transition temperature were observed with the CQD amount. The novelty and importance are related to the fact that for more rigid matrices (corroborated with the literature), the mechanical properties did not change, because the polymer bridging mechanism was not present, in spite of the excellent CQD dispersion as well as the filler amount. On the other hand, thermal conductivity is directly related to particle size and dispersion.

Corrosion-Resistant Hydrophobic Thermal Barrier Composite Coating on Metal Strip: A New Dimension to Steel Strips for Roofing Segment

This study demonstrates a cost-effective, thin, multifunctional composite coating system with outstanding thermal insulation for thermal management and heat shield applications, such as roofs, as well as outstanding resistance to corrosion. The hydrophobic multifunctional epoxy composite coating systems were designed with surface-modified fillers to impart both reduced heat conduction and high infrared reflectance in a thin coating with a 65-100 μm dry film thickness (DFT). With a judicial combination of hollow microspheres (HMS) activated and modified with silica (sHMS) and stearic acid-modified TiO2 (sMO), the developed composite coating attained the highest thermal insulation property with a temperature drop of 21-31 °C at different distances below the coated panel, which is superior to the values of temperature drop reported earlier. The high solar reflectance of the composite coating in the near-infrared (NIR) region exceeds 72% with a low thermal conductivity of 0.178 W m-1 K-1. After 720 h of exposure in a 3.5 wt % NaCl solution, the composite coating revealed a corrosion protection efficiency of 99%. The work demonstrates that high solar reflectivity and low thermal conductivity must be active simultaneously to achieve superior thermal shielding in a thin coating on a metal. A careful selection of fillers and appropriate surface modifications ensures hydrophobicity and proper distribution of the fillers in the coating for a high barrier effect to prevent environmental deterioration. With these superior performance parameters, the developed composite coatings make an essential contribution to energy sustainability and the protection against environmental degradation.

Model Approach to Thermal Conductivity in Hybrid Graphene-Polymer Nanocomposites

The thermal conductivity of epoxy nanocomposites filled with self-assembled hybrid nanoparticles composed of multilayered graphene nanoplatelets and anatase nanoparticles was described using an analytical model based on the effective medium approximation with a reasonable amount of input data. The proposed effective thickness approach allowed for the simplification of the thermal conductivity simulations in hybrid graphene@anatase TiO2 nanosheets by including the phenomenological thermal boundary resistance. The sensitivity of the modeled thermal conductivity to the geometrical and material parameters of filling particles and the host polymer matrix, filler's mass concentration, self-assembling degree, and Kapitza thermal boundary resistances at emerging interfaces was numerically evaluated. A fair agreement of the calculated and measured room-temperature thermal conductivity was obtained.

Ladder-like Poly(methacryloxypropyl) silsesquioxane-Al2O3-polybutadiene Flexible Nanocomposites with High Thermal Conductivity

Ladder-like poly(methacryloxypropyl)-silsesquioxanes (LPMASQ) are photocurable Si-based gels characterized by a double-stranded structure that ensures superior thermal stability and mechanical properties than common organic polymers. In this work, these attractive features were exploited to produce, in combination with alumina nanoparticles (NPs), both unmodified and functionalized with methacryloxypropyl-trimethoxysilane (MPTMS), LPMASQ/Al2O3 composites displaying remarkable thermal conductivity. Additionally, we combined LPMASQ with polybutadiene (PB) to produce hybrid nanocomposites with the addition of functionalized Al2O3 NPs. The materials underwent thermal stability, structural, and morphological evaluations via thermogravimetric analysis (TGA), scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDXS), Fourier transform infrared spectroscopy (FTIR), and solid-state nuclear magnetic resonance (NMR). Both blending PB with LPMASQ and surface functionalization of nanoparticles proved to be effective strategies for incorporating a higher ceramic filler amount in the matrices, resulting in significant increases in thermal conductivity. Specifically, a 113.6% increase in comparison to the bare matrix was achieved at relatively low filler content (11.2 vol%) in the presence of 40 wt% LPMASQ. Results highlight the potential of ladder-like silsesquioxanes in the field of thermally conductive polymers and their applications in heat dissipation for flexible electronic devices.

Nanobrick Wall Multilayer Thin Films with High Dielectric Breakdown Strength

Current thermally conductive and electrically insulating insulation systems are struggling to meet the needs of modern electronics due to increasing heat generation and power densities. Little research has focused on creating insulation systems that excel at both dissipating heat and withstanding high voltages (i.e., have both high thermal conductivity and a high breakdown strength). Herein, a polyelectrolyte-based multilayer nanocomposite is demonstrated to be a thermally conductive high-voltage insulation. Through inclusion of both boehmite and vermiculite clay, the breakdown strength of the nanocomposite was increased by ≈115%. It was also found that this unique nanocomposite has an increase in its breakdown strength, modulus, and hydrophobicity when exposed to elevated temperatures. This readily scalable insulation exhibits a remarkable combination of breakdown strength (250 kV/mm) and thermal conductivity (0.16 W m-1 K-1) for a polyelectrolyte-based nanocomposite. This dual clay insulation is a step toward meeting the needs of the next generation of high-performance insulation systems.

Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites

Efficient heat dissipation is vital for advancing device integration and high-frequency performance. Three-dimensional printing, famous for its convenience and structural controllability, facilitates complex parts with high thermal conductivity. Despite this, few studies have considered the influence of shear rate on the thermal conductivity of printed parts. Herein, polydimethylsiloxane/boron nitride (PDMS/BN) composites were prepared and printed by direct ink writing (DIW). In order to ensure the smooth extrusion of the printing process and the structural stability of the part, a system with 40 wt% BN was selected according to the rheological properties. In addition, the effect of printing speed on the morphology of BN particles during 3D printing was studied by XRD, SEM observation, as well as ANSYS Polyflow simulation. The results demonstrated that increasing the printing speed from 10 mm/s to 120 mm/s altered the orientation angle of BN particles from 78.3° to 35.7°, promoting their alignment along the printing direction due to the high shear rate experienced. The resulting printed parts accordingly exhibited an impressive thermal conductivity of 0.849 W∙m-1∙K-1, higher than the 0.454 W∙m-1∙K-1 of the control sample. This study provides valuable insights and an important reference for future developments in the fabrication of thermal management devices with customizable thermal conductivity.

Thermally Conductive and Electrically Insulating Epoxy Composites Filled with Network-like Alumina In Situ Coated Graphene

With the rapid development of the electronics industry, there is a growing demand for packaging materials that possess both high thermal conductivity (TC) and low electrical conductivity (EC). However, traditional insulating fillers such as boron nitride, aluminum nitride, and alumina (Al2O3) have relatively low intrinsic TC. When graphene, which exhibits both superhigh TC and EC, is used as a filler to fill epoxy resin, the TC of blends can be much higher than that of blends containing more traditional fillers. However, the high EC of graphene limits its application in cases where electrical insulation is required. To address this challenge, a method for coating graphene sheets with an in situ grown Al2O3 layer has been proposed for the fabrication of epoxy-based composites with both high TC and low EC. In the presence of a cationic surfactant, a dense Al2O3 layer with a network structure can be formed on the surface of graphene sheets. When the total content of Al2O3 and graphene mixed filler reached 30 wt%, the TC of the epoxy composite reached 0.97 W m-1 K-1, while the EC remained above 1011 Ω·cm. Finite element simulations accurately predicted TC and EC values in accordance with experimental results. This material, with its combination of high TC and good insulation properties, exhibits excellent potential for microelectronic packaging applications.

Recent Progress on Multifunctional Thermally Conductive Epoxy Composite

In last years, the requirements for materials and devices have increased exponentially. Greater competitiveness; cost and weight reduction for structural materials; greater power density for electronic devices; higher design versatility; materials customizing and tailoring; lower energy consumption during the manufacturing, transport, and use; among others, are some of the most common market demands. A higher operational efficiency together with long service life claimed. Particularly, high thermally conductive in epoxy resins is an important requirement for numerous applications, including energy and electrical and electronic industry. Over time, these materials have evolved from traditional single-function to multifunctional materials to satisfy the increasing demands of applications. Considering the complex application contexts, this review aims to provide insight into the present state of the art and future challenges of thermally conductive epoxy composites with various functionalities. Firstly, the basic theory of thermally conductive epoxy composites is summarized. Secondly, the review provides a comprehensive description of five types of multifunctional thermally conductive epoxy composites, including their fabrication methods and specific behavior. Furthermore, the key technical problems are proposed, and the major challenges to developing multifunctional thermally conductive epoxy composites are presented. Ultimately, the purpose of this review is to provide guidance and inspiration for the development of multifunctional thermally conductive epoxy composites to meet the increasing demands of the next generation of materials.

3D-Printed Polyamide 12/Styrene-Acrylic Copolymer-Boron Nitride (PA12/SA-BN) Composite with Macro and Micro Double Anisotropic Thermally Conductive Structures

Anisotropic thermally conductive composites are very critical for precise thermal management of electronic devices. In this work, in order to prepare a composite with significant anisotropic thermal conductivity, polyamide 12/styrene-acrylic copolymer-boron nitride (PA12/SA-BN) composites with macro and micro double anisotropic structures were fabricated successfully using 3D printing and micro-shear methods. The morphologies and thermally conductive properties of composites were systematically characterized via SEM, XRD, and the laser flash method. Experimental results indicate that the through-plane thermal conductivity of the composite is 4.2 W/(m·K) with only 21.4 wt% BN, which is five times higher than that of the composite with randomly oriented BN. Simulation results show that the macro-anisotropic structure of the composite (caused by the selective distribution of BN) as well as the micro-anisotropic structure (caused by the orientation structure of BN) both play critical roles in spreading heat along the specified direction. Therefore, as-obtained composites with double anisotropic structures possess great potential for the application inefficient and controllable thermal management in various fields.

High-Thermal-Conductivity and High-Fluidity Heat Transfer Emulsion with 89 wt % Suspended Liquid Metal Microdroplets

Colloidal suspensions of thermally conductive particles in a carrier fluid are considered promising heat transfer fluids for various thermal energy transfer applications, such as transportation, plants, electronics, and renewable energy systems. The thermal conductivity (k) of the particle-suspended fluids can be improved substantially by increasing the concentration of conductive particles above a "thermal percolation threshold," which is limited because of the vitrification of the resulting fluid at the high particle loadings. In this study, eutectic Ga-In liquid metal (LM) was employed as a soft high-k filler dispersed as microdroplets at high loadings in paraffin oil (as a carrier fluid) to produce an emulsion-type heat transfer fluid with the combined advantages of high thermal conductivity and high fluidity. Two types of the LM-in-oil emulsions, which were produced via the probe-sonication and rotor-stator homogenization (RSH) methods, demonstrated significant improvements in k, i.e., Δk ∼409 and ∼261%, respectively, at the maximum investigated LM loading of 50 vol % (∼89 wt %), attributed to the enhanced heat transport via high-k LM fillers above the percolation threshold. Despite the high filler loading, the RSH-produced emulsion retained remarkably high fluidity, with a relatively low viscosity increase and no yield stress, demonstrating its potential as a circulatable heat transfer fluid.

Advances and mechanisms in polymer composites toward thermal conduction and electromagnetic wave absorption

Polymer composites have essential applications in electronics due to their versatility, stable performance, and processability. However, with the increasing miniaturization and high power of electronics in the 5G era, there are significant challenges related to heat accumulation and electromagnetic wave (EMW) radiation in narrow spaces. Traditional solutions involve using either thermally conductive or EMW absorbing polymer composites, but these fail to meet the demand for multi-functional integrated materials in electronics. Therefore, designing thermal conduction and EMW absorption integrated polymer composites has become essential to solve the problems of heat accumulation and electromagnetic pollution in electronics and adapt to its development trend. Researchers have developed different approaches to fabricate thermal conduction and EMW absorption integrated polymer composites, including integrating functional fillers with both thermal conduction and EMW absorption functions and innovating processing methods. This review summarizes the latest research progress, factors that affect performance, and the mechanisms of thermal conduction and EMW absorption integrated polymer composites. The review also discusses problems that limit the development of these composites and potential solutions and development directions. The aim of this review is to provide references for the development of thermal conduction and EMW absorption integrated polymer composites.

Hydroxy silicone oil modified boron nitride for high thermal conductivity and low dielectric loss silicone rubber composites: experimental and molecular simulation studies

Polymer-based composites are widely used in microelectronics and wireless communications, which require high thermal conductivity and low dielectric loss for effective heat dispersion and signal transmission. Different lengths of hydroxyl silicone oil chains modified boron nitride/silicone rubber composites were explored and prepared in this work. Experiments demonstrate that the long-chain modified BN improves the thermal conductivity and decreases the dielectric loss of composites. A molecular dynamics simulation was employed to study the mechanism and affecting variables. The calculated results indicated that the improvement of the thermal and dielectric properties is mainly related to the interfacial behavior, including interfacial compatibility, interfacial bond strength, and phonon matching. Based on the simulated interfacial behavior and thermal conductivity, the thermal and dielectric properties of different chain-length modified boron nitride/silicone rubber composites have been anticipated. The results show that the longer-chain modified boron nitride/silicone rubber composites have better thermal and dielectric properties. This research may give a theoretical foundation for the development of materials with designable performance for electronic devices.

High Performance Epoxy Composites Containing Nanofiller Modified by Plasma Bubbles

The thermal conductivity of polymer materials is a fundamental parameter in the field of high-voltage electrical insulation. When the operating frequency and power for electrical equipment or electronic devices increase significantly, the internal heat will increase dramatically, and the accumulation of heat will further lead to insulation failure and serious damage of the whole system. The addition of filler with high thermal conductivity into polymer is a common solution. However, the interfacial thermal resistance between filler and bulk materials is the major obstacle to improve thermal conductivity. Herein, in order to reduce the interfacial thermal resistance, nanofillers are modified by plasma technology. The surface modification of nano-Al₂O₃ is carried out using plasma bubbles with three atmospheres (Ar, Ar+O₂, air) as well as coupling agent. The situation of surface grafting before and after the modification is characterized using FTIR, XPS, and SEM. The effect of the mechanism of modification on the thermal conductivity and reaction pathway is investigated. The results showed that the thermal conductivity after plasma modification is increased significantly. Especially, the thermal conductivity is increased by 35% for the sample modified by Ar+O₂ atmosphere. This results because more hydroxyl is introduced on the filler surface by the plasma bubbles, which enhance the interface compatibility between filler and epoxy. In addition, surface insulation performance for the modified samples also is enhanced by 14%. This is associated with the change of surface resistance and trap distribution. These results provide potential support for the development of fabrication for high performance epoxy composites.

A Malleable Composite Dough with Well-Dispersed and High-Content Boron Nitride Nanosheets

Aggregation of two-dimensional (2D) nanosheet fillers in a polymer matrix is a prevalent problem when the filler loading is high, leading to degradation of physical and mechanical properties of the composite. To avoid aggregation, a low-weight fraction of the 2D material (<5 wt %) is usually used to fabricate the composite, limiting performance improvement. Here, we develop a mechanical interlocking strategy where well-dispersed high filling content (up to 20 wt %) of boron nitride nanosheets (BNNSs) can be incorporated into a polytetrafluoroethylene (PTFE) matrix, resulting in a malleable, easy-to-process and reusable BNNS/PTFE composite dough. Importantly, the well-dispersed BNNS fillers can be rearranged into a highly oriented direction due to the malleable nature of the dough. The resultant composite film has a high thermal conductivity (4408% increase), low dielectric constant/loss, and excellent mechanical properties (334%, 69%, 266%, and 302% increases for tensile modulus, strength, toughness, and elongation, respectively), making it suitable for thermal management applications in the high-frequency areas. The technique is useful for the large-scale production of other 2D material/polymer composites with a high filler content for different applications.

Biomimetic Liquid Metal-Elastomer Composited Foam with Adjustable Thermal Conductivity for Heat Control

The application of traditional materials with constant thermal conductivity in time-varying thermal environments poses great challenges due to their inability of adjusting thermal conductivity according to different requirements, for which reason materials with adjustable thermal conductivity have attracted much attention. However, certain limitations induced by those materials' low softness or harsh adjustment conditions restrict them from being applied in heat dissipation and heat transfer scenarios. In this study, we report a biomimetic liquid metal-elastomer composited foam with adjustable thermal conductivity (B-LM-ECF). Inspired by the rationale of homeothermic animals regulating the thermal conductivity of their subcutaneous tissue, the prepared material adjusts its thermal conductivity via adjusting the volume proportion of liquid metal within it. The thermal conductivity of B-LM-ECF can be adjusted within the range of 0.11-8.4 W·m-1K-1. The adjustment factor η of B-LM-ECF is 76, which is defined as the ratio of the highest to the lowest thermal conductivity of the material. The material enabling reversible switching for itself from thermal insulation to heat dissipation. The prepared material exhibits 45 KPa of Young's modulus with the maximum fracture tensile rate of 600%, facilitating better covering for thermal management objects. We selected a power lithium battery and a smartphone as specific thermal management objects to demonstrate its practical application in thermal management experiment.

Enhanced Electromagnetic Shielding and Thermal Management Properties in MXene/Aramid Nanofiber Films Fabricated by Intermittent Filtration

High-efficiency electromagnetic interference (EMI) shielding and heat dissipation synergy materials with flexible, robust, and environmental stability are urgently demanded in next-generation integration electronic devices. In this work, we report the lamellar MXene/Aramid nanofiber (ANF) composite films, which establish a nacre-like structure for EMI shielding and heat dissipation by using the intermittent filtration strategy. The MXene/ANF composite film filled with 50 wt % MXene demonstrates enhanced mechanical properties with a strength of 230.5 MPa, an elongation at break of 6.2%, and a toughness of 11.8 MJ·m³ (50 wt % MXene). These remarkable properties are attributed to the hydrogen bonding and highly oriented structure. Furthermore, due to the formation of the MXene conductive network, the MXene/ANF composite film shows an outstanding conductivity of 624.6 S/cm, an EMI shielding effectiveness (EMI SE) of 44.0 dB, and a superior specific SE value (SSE/t) of 18847.6 dB·cm²/g, which is better than the vacuum filtration film. Moreover, the MXene/ANF composite film also shows a great thermal conductivity of 0.43 W/m·K. The multifunctional MXene/ANF composite films with high-performance EMI shielding, heat dissipation, and joule heating show great potential in the field of aerospace, military, microelectronics, microcircuit, and smart wearable electronics.

Numerical Study on Effect of Contact and Interfacial Resistance on Thermal Conductivity of Dispersed Composites

A series of finite element analyses were conducted to clarify the effect of contact and interfacial resistance between constituents on effective thermal conductivities of dispersed composites. Equally dispersed fillers in FCC (face-centered cubic) and BCC (body-centered cubic) material systems were extracted from cyclic microstructures as unit cell models. In addition to spherical fillers, a polyhedron called the Wigner-Seitz cell that can realize a fully packed microstructure was chosen as the shape of the filler to investigate the effect of contact between the high volumetric fraction of fillers. The effective thermal conductivities of the resulting composites were calculated based on the FEA results and compared to the theoretical results for various volume fractions of the fillers including the maximum packing fraction. The following conclusions were obtained from the present study: 1. The effect of the contact depending on the shape and configuration of the fillers has more of a significant influence on the effective thermal conductivity than the influence of the increase in the volume fraction of the fillers. 2. When the contact occurred, the effective thermal conductivity became more than double that without contact. 3. Interfacial thermal resistance must be less than the order of 10^-4 m² K/W to obtain improvement in the effective thermal conductivity by compounding the fillers.

Response-Surface-Methodology-Based Increasing of the Isotropic Thermal Conductivity of Polyethylene Composites Containing Multiple Fillers

To optimize the thermal conductivity of high-density polyethylene, 15 hybrid filler composites containing either aluminum oxide, graphite, expanded graphite, carbon nanotubes or a combination of the former, have been studied using an extrusion-compression processing tandem. The experimental density of the cube-shaped specimens is substantially lower than the theoretical density calculated by the linear mixing rule, mainly for the composites with high filler contents. The morphology of the composites, as studied by scanning electron microscopy (SEM), highlighted a good dispersion quality and random orientation of the fillers in the test specimens but also revealed air inclusions in the composites, explaining the density results. It is shown that the addition of filler(s) increases both the melt viscosity (up to ca. 270%) and the thermal conductivity (up to ca. 1000%). Hence, a very strong increase of TC can be practically hampered by a too high viscosity to enable processing. Supported by ANOVA analysis, the application of response surface methodology (RSM), assuming a perfect compression, indicates that all fillers have a significant effect on the thermal conductivity and synergistic effects can be achieved. The regression model obtained can adequately predict the thermal conductivity of composites of various compositions, as already confirmed based on three validation experiments in the present work.

Review on Heat Generation of Rubber Composites

Rubber composites are extensively used in industrial applications for their exceptional elasticity. The fatigue temperature rise occurs during operation, resulting in a serious decline in performance. Reducing heat generation of the composites during cyclic loading will help to avoid substantial overheating that most likely results in the degradation of materials. Herein, we discuss the two main reasons for heat generation, including viscoelasticity and friction. Influencing factors of heat generation are highlighted, including the Payne effect, Mullins effect, interface interaction, crosslink density, bond rubber content, and fillers. Besides, theoretical models to predict the temperature rise are also analyzed. This work provides a promising way to achieve advanced rubber composites with high performance in the future.

Durable, Low-Cost, and Efficient Heat Spreader Design from Scrap Aramid Fibers and Hexagonal Boron Nitride

Aramid, chemically known as para phenylene terephthalamide or PPD-T, has been widely used in the reinforcement of telecommunication cables, rubber materials (transmission belts, pneumatic belts), ballistic clothing, and frictional materials primarily due to their high tensile resistance, high elastic modulus, and excellent thermal stability (−80–200 °C). These unique properties of aramid originate from its chemical structure, which consists of relatively rigid polymer chains linked by benzene rings and amide bonds (-CO-NH-). Here, in this work inspired by these properties, a heat spreader called Thermal Interface Material (TIM) is developed by synthesizing a resin from scrap aramid fibers. When hexagonal boron nitride (h-BN) as filler is introduced into the as-synthesized aramid resin to form a thin film of thermal sheet (50 μm), an in-plane thermal conductivity as high as 32.973 W/mK is achieved due to the firmly stacked and symmetric arrangement of the h-BN in the resin matrix. Moreover, the influence of h-BN platelet size is studied by fabricating thermal sheets with three different sizes of h-BN (6–7.5 μm, 15–21 μm, and 30–35 μm) in the aramid resin. The results of the study show that as platelet size increases, thermal conductivity increases significantly. Since the resin reported herein is developed out of scrap aramid fibers, the cost involved in the manufacture of the thermal sheet will be greatly lower. As the thermal sheet is designed with h-BN rather than graphene or carbonaceous materials, this high heat spreading sheet can be employed for 5G antenna modules where properties like a low dielectric constant and high electrical insulation are mandated.

Angular-Shaped Boron Nitride Nanosheets with a High Aspect Ratio to Improve the Out-of-Plane Thermal Conductivity of Polyimide Composite Films

Polyimide/boron nitride nanosheet (PI/BNNS) composite films have potential applications in the field of electrical devices due to the superior thermal conductivity and outstanding insulating properties of the boron nitride nanosheet. In this study, the boron nitride nanosheet (BNNS-t) was prepared by the template method using sodium chloride as the template, and B₂O₃ and flowing ammonia as the boron and nitrogen sources, respectively. Then, the PI/BNNS-t composite films were investigated with different loading of BNNS-t as thermally conductive fillers. The results show that BNNS-t has a high aspect ratio and a uniform lateral dimension, with a large dimension and a thin thickness, and there are a few nanosheets with angular shapes in the as-obtained BNNS-t. The synergistic effect of the above characteristics for BNNS-t is beneficial to constructing the three-dimensional heat conduction network of the PI/BNNS-t composite films, which can significantly improve the out-of-plane thermal conduction properties. And then, the out-of-plane thermal conductivity of the PI/BNNS-t composite film achieves 0.67 W m^-1 K^-1 at 40% loading, which is nearly 3.5 times that of the PI film.

Influence of filler material on properties of fiber-reinforced polymer composites: A review

The current day target for material scientists and researchers is developing a wholesome material to satisfy the parameters such as durability, manufacturability, low cost, and lightweight. Extensive research studies are ongoing on the possible application of polymer matrix composites in engineering and technology, since these materials have an edge over conventional materials in terms of performance. Hybridization of reinforcements is considered to be a better option to enhance the efficiency and performance of composite materials. Accordingly, research studies focus on the surface treatment of natural fibers and the addition of nanofillers (natural or synthetic) by industry and academia to take the properties and application of composites to the next level. This review purely focuses on the influence of fillers on the properties of composites along with the probable application of filler-based polymer composites.

Absorption Dominated Directional Electromagnetic Interference Shielding through Asymmetry in a Multilayered Construct with an Exceptionally High Green Index

Fabricating green electromagnetic interference (EMI) shields is the need of the hour because strong secondary reflections in the vicinity of the shield adversely affect the environment and the reliability of the neighboring devices. To this end, the present work aims to maximize the absorption-based EMI shielding through a multilayered construct comprising a porous structure (pore size less than λ/5), a highly conducting entity, and a layer to match the impedance. The elements of this construct were positioned so that the incoming electromagnetic (EM) radiation interacts with the other layers of the construct before the conducting entity. This positioning of the layers in the construct offers a high green shielding index (g_s) and low reflection coefficient (R ∼ 0.1) with an exceptionally high percent absorption (up to 99%). Polyurethane (PU) foams were fabricated using the salt-leaching technique and strategically positioned with carbon nanotube (CNT) papers and polycarbonate (PC)-based films to obtain symmetric and asymmetric constructs. These structures were then employed to gain mechanistic insight into the directional dependency of shielding performance, g_s, and heat dissipation ability. Interestingly, maximum total shielding effectiveness (SE_T) of -52 dB (88% absorption @8.2 GHz) and specific shielding effectiveness/thickness (SSE_t) of -373 dB/cm²g were achieved for a symmetric construct whereas, for the asymmetric construct, the SE_T and SSE_t were -37 dB and -280 dB/cm²g, respectively, with an exceptionally high g_s of 8.6, the highest reported so far. The asymmetricity in the construct led to directional dependence of the absorption component (% SE_A, shielding effectiveness due to absorption) and heat dissipation, primarily governed by the electrical and thermal conductivity gradient, respectively. This study opens new avenues in this field and reports constructs with an exceptionally high green index.

Aerogels Meet Phase Change Materials: Fundamentals, Advances, and Beyond

Benefiting from the inherent properties of ultralight weight, ultrahigh porosity, ultrahigh specific surface area, adjustable thermal/electrical conductivities, and mechanical flexibility, aerogels are considered ideal supporting alternatives to efficiently encapsulate phase change materials (PCMs) and rationalize phase transformation behaviors. The marriage of versatile aerogels and PCMs is a milestone in pioneering advanced multifunctional composite PCMs. Emerging aerogel-based composite PCMs with high energy storage density are accepted as a cutting-edge thermal energy storage (TES) concept, enabling advanced functionality of PCMs. Considering the lack of a timely and comprehensive review on aerogel-based composite PCMs, herein, we systematically retrospect the state-of-the-art advances of versatile aerogels for high-performance and multifunctional composite PCMs, with particular emphasis on advanced multiple functions, such as acoustic-thermal and solar-thermal-electricity energy conversion strategies, mechanical flexibility, flame retardancy, shape memory, intelligent grippers, and thermal infrared stealth. Emphasis is also given to the versatile roles of different aerogels in composite PCMs and the relationships between their architectures and thermophysical properties. This review also showcases the discovery of an interdisciplinary research field combining aerogels and 3D printing technology, which will contribute to pioneering cutting-edge PCMs. This review aims to arouse wider research interests among interdisciplinary fields and provide insightful guidance for the rational design of advanced multifunctional aerogel-based composite PCMs, thus facilitating the significant breakthroughs in both fundamental research and commercial applications.

Development and Perspectives of Thermal Conductive Polymer Composites

With the development of electronic appliances and electronic equipment towards miniaturization, lightweight and high-power density, the heat generated and accumulated by devices during high-speed operation seriously reduces the working efficiency and service life of the equipment. The key to solving this problem is to develop high-performance thermal management materials and improve the heat dissipation efficiency of the equipment. This paper mainly summarizes the research progress of polymer composites with high thermal conductivity and electrical insulation, including the thermal conductivity mechanism of composites, the factors affecting the thermal conductivity of composites, and the research status of thermally conductive and electrical insulation polymer composites in recent years. Finally, we look forward to the research focus and urgent problems that should be addressed of high-performance thermal conductive composites, which will provide strategies for further development and application of advanced thermal and electrical insulation composites.

Scalable Manufacturing Process and Multifunctional Performance of Cotton Fibre-Reinforced Poly(Lactic Acid) (PLA) Bio-Composites Coated by Graphene Oxide

Natural fibre biopolymer composites with both fibres and matrix being derived from biomaterials are increasingly used in demanding applications, such as sensing, packaging, building, and transport, and require good electrical, thermal, and flame retardant properties. Herein, an investigation of the effectiveness of functionalising nonwoven cotton/poly(lactic acid) (PLA) fibre mats with graphene oxide nanosheets has been reported by using a facile dip-coating method followed by thermal reduction for enhancing the electric, thermal, and abrasion-resistance properties. The manufacturing processes for preparing biocomposites and introducing functionality are readily scalable. Experimental results reveal that with the addition of less than 0.5 wt% graphene nanoplatelets, the biocomposites showed significant improvements in abrasion resistance, electrical conductivity, thermal conductivity, and diffusivity. Furthermore, the composite shows excellent piezo-resistivity to act as strain sensors with a gauge factor of 2.59 at strains up to 1%.