Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering

Automatic Joining of Electrical Components to Smart Textiles by Ultrasonic Soldering

A suitable connection method to automatically produce E-textiles does not exist. Ultrasonic soldering could be a good solution for that since it works with flux-free solder, which avoids embrittlement of the textile integrated wires. This article describes the detailed process of robot-assisted ultrasonic soldering of e-textiles to printed circuit boards (PCB). The aim is to understand the influencing factors affecting the connection and to determine the corresponding solder parameters. Various test methods are used to evaluate the samples, such as direct optical observation of the microstructure, a peeling tensile test, and a contact resistance measurement. The contact strength increases by reducing the operating temperature and the ultrasonic time. The lower operating temperature and the reduced ultrasonic time cause a more homogeneous metal structure with less defects improving the mechanical strength of the samples.

Effect of ultrasound on dissolution of Al in Sn

This study investigated the dissolution behavior of the aluminum substrate in molten tin at 523 K, 573 K, and 623 K with and without applied ultrasonic vibration (USV) respectively. In order to reveal the mechanism of accelerated dissolution by USV, the ultrasonic pressure distribution in the molten pool and the cavitation thermal effect were simulated by finite element analysis. Furthermore, the microstructures after the dissolution were observed. The results showed USV greatly accelerated the dissolution rate (by 21-27 times) at the interface, where an uneven ultrasonic pressure distribution in the molten pool caused inhomogeneous dissolution. The amount of Al dissolved in Sn at a particular temperature after 5 s of USV was equivalent to a holding time of 30 min without USV. The simulation results showed that the cavitation-thermal effect caused by USV increased the temperature (up to the melting point of Al) at the interfacial micro-region. It is evident that the combined effect of cavitation-thermal and ultrasonic streaming caused by USV increase the dissolution rate.

Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound

SiC ceramics were successfully soldered with the assistance of ultrasound. Two kinds of filler metals, namely non-eutectic Zn-5Al-3Cu and eutectic Zn-5Al alloys, were used. The effects of ultrasonic action on the microstructure and mechanical properties of the soldered joints were investigated. The results showed that ultrasound could promote the wetting and bonding between the SiC ceramic and filler metals within tens of seconds. For the Zn-5Al-3Cu solder, a fully grain-refined structure in the bond layer was obtained as the ultrasonic action time increased. This may lead to a substantial enhancement in the strength of the soldered joints. For the Zn-5Al solder, the shear strength of the soldered joints was only ∼102 MPa when the ultrasonic action time was shorter, and fractures occurred in the brittle lamellar eutectic phases in the center of the bond layer. With increasing ultrasonic action time, the lamellar eutectic phase in the bond layer of SiC joints could be completely transformed to a fine non-lamellar eutectic structure. Meanwhile, the grains in the bond layer were obviously refined. Those results led to the remarkable enhancement of the shear strength of the joints (∼138 MPa) using the Zn-5Al solder, which had approached that enhancement using the Zn-5Al-3Cu solder. The enhanced mechanical properties of the joints were attributed to the significant refinement of the grains and the change in the eutectic structure in the bond layer. Prolonged enhanced heterogeneous nucleation triggered by ultrasonic cavitation is the predominant refinement mechanism of the bond metals of the SiC joints.

Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound

Rapid transient liquid phase (TLP) bonding process on Ag/Sn/Ag system is achieved in air by the assistance of ultrasonic, which has great potential to be applied to high-temperature power devices packaging. In this study, the influence of ultrasonic effect on the morphology and growth kinetics of Ag₃Sn grains, and the joint microstructure, mechanical property and thermal reliability were systematically investigated. Experimental results indicated that the rapid consumption of the "dynamic" transient liquid phase was attributed to the accelerated dissolution of Ag substrate and the extrusion of liquid Sn, which were entirely induced by the complex sonochemical effects on the liquid/solid intermetallic compounds (IMCs) interface. An elongated scallop-like morphology of Ag₃Sn grains was developed during Ag/Sn interfacial reaction with ultrasonic, accompanied by widening of grooves between neighbored grains. This phenomenon is called as a strengthening thermal grooving, in which the grooves at grain boundaries provide stable molten channels for Ag atoms diffusion from the substrate. Consequently, the improved elemental diffusion was evaluated through the growth kinetics of Ag₃Sn IMCs, with conservative estimation of 6-16.5 times faster than the traditional TLP process. In addition, both excellent mechanical property and thermal reliability of the Ag-Sn intermetallic joint were experimentally verified by shear test and high-temperature storage test, respectively.