Highly Multifunctional and Thermoconductive Performances of Densely Filled Boron Nitride Nanosheets/Epoxy Resin Bulk Composites

Adhesion Energy-Assisted Low Contact Thermal Resistance Epoxy Resin-Based Composite

Although intense efforts have been devoted to the development of thermally conductive epoxy resin composites, most previous works ignore the importance of the contact thermal resistance between epoxy resin composites and mating surfaces. Here, we report on epoxy resin/hexagonal boron nitride (h-BN) composites, which show low contact thermal resistance with the contacting surface by tuning adhesion energy. We found that adhesion energy increases with increasing the ratio of soybean-based epoxy resin/amino silicone oil and h-BN contents. The adhesion energy has a negative correlation with the contact thermal resistance; that is, enhancing the adhesion energy will lead to reduced contact thermal resistance. The contact thermal conductance increases with the h-BN contents and is low to 0.025 mm2·K/W for the epoxy resin/60 wt % h-BN composites, which is consistent with the theoretically calculated value. By investigating the wettability and chain dynamics of the epoxy resin/h-BN composites, we confirm that the low contact thermal resistance stems from the increased intermolecular interaction between the epoxy resin chains. The present study provides a practical approach for the development of epoxy resin composites with enhanced thermal conductivity and reduced contact thermal resistance, aiming for effective thermal management of electronics.

Mechanical and Antimicrobial Properties of Boron Nitride/Methacrylic Acid Quaternary Ammonium Composites Reinforced Dental Flowable Resins

Dental resin composites (DRCs) are commonly used to restore teeth affected by dental caries or defects. These materials must possess excellent properties to withstand the complex oral environment. The objective of this study was to prepare and characterize Boron nitride nanosheets (BNN)/ dimethyl amino hexadecyl methacrylate (DMAHDM) composites (BNN/DMA), and to evaluate them as functional fillers to enhance the mechanical and antimicrobial properties of dental resins. The BNN/DMA composites were successfully prepared under the theoretical guidance of molecular dynamics (MD), and then the physicochemical and morphological characterization of the BNN/DMA composites were carried out by using various test methods, such as FT-IR, XRD, UV-vis spectroscopy, SEM, TEM, and AFM. It was doped into the dental flowable resin in a certain proportion, and the results showed that the flexural strength (FS), elastic modulus (EM), compressive strength (CS), and microhardness (MH) of the modified resin composites were increased by 53.29, 47.8, 97.59, and 37.1%, respectively, with the addition of 0.8 wt % of BNN/DMA composite fillers. It has a good inhibition effect on Streptococcus mutans, with an inhibition rate as high as 90.43%. Furthermore, this effect persists even after one month of aging. In conclusion, the modification of flowable resins with low-concentration BNN/DMA composites favorably integrates the mechanical properties and long-term antimicrobial activity of dental resins. At the same time, they have good biocompatibility and do not affect the aesthetics. The BNN/DMA composite modified flowable resin has the potential to become a new type of antimicrobial dental restorative material.

On-Demand Preparation of Boron Nitride Nanosheets for Functional Nanocomposites

Boron nitride nanosheets (BNNSs) have garnered significant attention across diverse fields; however, accomplishing on-demand, large-scale, and highly efficient preparation of BNNSs remains a challenge. Here, an on-demand preparation (OdP) method combining high-pressure homogenization and short-time ultrasonication is presented; it enables a highly efficient and controllable preparation of BNNSs from bulk hexagonal boron nitride (h-BN). The homogenization pressure and number of cycles are adjusted, and the production efficiency and yield of BNNSs reach 0.95 g g-1 h-1 and 82.8%, respectively, which significantly exceed those attained by using existing methods. The universality of the OdP method is demonstrated on h-BN raw materials of various bulk sizes from various producers. Furthermore, this method allows the preparation of BNNSs having specific sizes based on the final requirements. Both simulation and experimental results indicate that large BNNSs are particularly suitable for enhancing the thermal conductivity and electrical insulation properties of dielectric polymer nanocomposites. Interestingly, the small BNNS-filled photonic nanocomposite films fabricated via the OdP method exhibit superior daytime radiative cooling properties. Additionally, the OdP method offers the benefits of low energy consumption and reduced greenhouse gas emissions and fossil energy use. These findings underscore the unique advantages of the OdP method over other techniques for a high-efficiency and controllable preparation of large BNNSs.

Highly Multifunctional Performances of Boron Nitride Nanosheets/Polydimethylsiloxane Composite Foams

Although this kind of hexagonal boron nitride (h-BN)-filled polydimethylsiloxane (PDMS) multifunctional composite foam has been greatly expected, its development is still relatively slow as a result of the limitation of synthetic challenge. In this work, a new foaming process of BNNSs-PDMS, alcohol, and water three-phase emulsion system is employed to synthesize a series of high-quality BNNSs/PDMS composite foams (BSFs) filled with highly functional and uniformly distributed BNNSs. As a result of well-bonded interfaces between the BNNSs and PDMS, enhanced multiple functions of BSFs appeared. The BSFs can show complete resilience at a compressive strain of 90% and only 3.99% irreversible deformation after 100,000 compressing-releasing hyperelastic cycles at a strain of 60%. On the basis of their outstanding shape-memory properties, the maximum voltage value of compression-driven piezo-triboelectric (CDPT) responses of the BSFs is up to ∼20 V. Depending on the remarkable super-elastic and CDPT performances, the BSFs can be used for sensitive sensing of temperature difference and electromechanical responses. Also, in the range of 12-40 GHz, the BSF materials display ultralow dielectric constants between 1.1 and 1.4 with proper dielectric loss tangent values of <0.3 and exhibit an enhanced and broadened sound adsorption capacity ranging from 500 to 6500 Hz. Although BSFs have high porosities of >65%, their thermal conductivities can still reach up to 0.407 ± 0.039 W m^-1 K^-1. Moreover, the BSF materials display favorable thermal stability, obviously reduced coefficient of thermal expansion, and good flame retardancy. All of these properties render the BSFs as a new category of excellent multifunctional material.

Enhanced Performance of Li-S Batteries due to Synergistic Adsorption and Catalysis Activity within a Separation Coating Made of Hybridized BNNSs/N-Doping Porous Carbon Fibers

Lithium-sulfur (Li-S) batteries with high theoretical energy density are considered as the most promising devices for rechargeable energy-storage systems. However, their actual applications are rather limited by the shuttle effect of lithium polysulfides (LiPSs) and the sluggish redox kinetics. Here, the boron nitride nanosheets are homodispersedly embedded into N-doping porous carbon fibers (BNNSs/CHFs) by an electrospinning technique and a subsequent in situ pyrolysis process. The hybridized BNNSs/CHFs can be smartly designed as a multifunctional separation coating onto the commercial PP membrane to enhance the electrochemical performance of Li-S batteries. As a result, the Li-S batteries with extra BNNSs/CHF modification deliver a highly reversible discharge capacity of 830.4 mA h g^-1 at a current density of 1 C. Even under 4 C, the discharge specific capacity can reach up to 609.9 mA h g^-1 and maintain at 553.9 mA h g^-1 after 500 cycles, showing a low capacity decay of 0.01836% per cycle. It is considered that the excellent performance is attributed to the synergistic effect of adsorption and catalysis of the BNNSs/CHF coating used. First, this coating can efficiently reduce the charge transfer resistance and enhance Li-ion diffusion, due to increased catalytic activity from strong electronic interactions between BNNSs and N-doping CHFs. Second, the combination of polar BNNSs and abundant pore structures within the hybridized BNNSs/CHF networks can highly facilitate an adsorption for LiPSs. Here, we believed that this work would provide a promising strategy to increase the Li-S batteries' performance by introducing hybridized BNNSs/N-doping carbon networks, which could efficiently suppress the LiPSs' shuttle effect and improve the electrochemical kinetics of Li-S batteries.

Facile Strategy for Constructing Highly Thermally Conductive Epoxy Composites Based on a Salt Template-Assisted 3D Carbonization Nanohybrid Network

The construction of an interconnected nanofiller network is critical for the preparation of highly effective thermal management composites, though it remains a challenge to eliminate the anisotropic thermal conductivity of the nanofiller-induced defective interfacial heat-flow efficiency. In this work, a facile and novel approach is proposed to optimize phonon transport by building a salt template-assisted three-dimensional (3D) carbonization nanohybrid network in an epoxy system. The advantage of the salt template relied on green and scalable merits to construct a 3D nanofiller network and supporting abundant holes for the introduction of a polymer matrix after washing. Meanwhile, the contained carbonization materials contributed to reducing the interfacial phonon scattering issues of the filler/filler and filler/polymer for an efficient heat-flow pathway. As a result of this effect, the prepared epoxy nano-composites presented a high thermal conductivity of 4.27 W/m K, resulting in a 1841% increase compared to the thermal conductivity of the pure epoxy resin. In addition, the epoxy composites exhibited good mechanical properties and thermal conductive performance during heating and cooling. Therefore, this study may provide new insights into the design and preparation of thermal management polymers to meet the applicational requirements of electronics.

Thermally Conductive but Electrically Insulating Polybenzazole Nanofiber/Boron Nitride Nanosheets Nanocomposite Paper for Heat Dissipation of 5G Base Stations and Transformers

The rapid development of 5G equipment and high-power density electronic devices calls for high thermal conductivity materials for heat dissipation. Dielectric polymer composites are highly promising as the electrical insulation, mechanical property, thermal stability, and even fire retardance are also of great importance for electrical and electronic applications. However, the current thermal conductivity enhancement of dielectric polymer composites is usually at the cost of lowering the mechanical and electrical insulating properties. In this work, we report the facile preparation of highly thermally conductive and electrically insulating poly(p-phenylene benzobisoxazole) nanofiber (PBONF) composites by incorporating a low weight fraction of functionalized boron nitride nanosheets (BNNSs). With strong electrostatic interaction, the BNNSs are encapsulated by PBONFs, and the constructed robust interconnected network makes the nanocomposites exhibit a nacre-like structure. Accordingly, the nanocomposite paper has a high in-plane thermal conductivity of 21.34 W m^-1 K^-1 at a low loading of 10 wt % BNNSs and exhibits an ultrahigh strength of 206 MPa. Additionally, the nanocomposite paper exhibits superior electrical insulation properties up to higher than 350 °C and excellent fire retardance. The strong heat dissipation capability of the nanocomposite paper was demonstrated in 5G base stations and control transformers, showing wide potential applications in high power density electrical equipment and electronic devices.

Synchronously improved thermal conductivity and dielectric constant for epoxy composites by introducing functionalized silicon carbide nanoparticles and boron nitride microspheres

Polymer-based dielectrics with high thermal conductivity and superb dielectric properties hold great promising for advanced electronic packaging and thermal management application. However, integrating these properties into a single material remains challenging due to their mutually exclusive physical connotations. Here, an ideal dielectric thermally conductive epoxy composite is successfully prepared by incorporating multiscale hybrid fillers of boron nitride microsphere (BNMS) and silicon dioxide coated silicon carbide nanoparticles (SiC@SiO₂). In the resultant composites, the microscale BNMS serve as the principal building blocks to establish the thermally conductive network, while the nanoscale SiC@SiO₂ as bridges to optimize the heat transfer and suppress the interfacial phonon scattering. In addition, the special core-shell nanoarchitecture of SiC@SiO₂ can significantly impede the leakage current and generate a great deal of minicapacitors in the composites. Consequently, favorable thermal conductivity (0.76 W/mK) and dielectric constant (∼8.19) are simultaneously achieved in the BNMS/SiC@SiO₂/Epoxy composites without compromising the dielectric loss (∼0.022). The strategy described in this study provides important insights into the design of high-performance dielectric composites by capitalizing on the merits of different particles.

Preparation and Properties of Epoxy Composites with Multi-Scale BN Sheets

Epoxy resin is one of the most widely used thermosetting polymers and commonly applied in power electronics field. The intrinsic properties of epoxy can be improved by the introduction of inorganic filler, thus fabricating a composite material. In this paper, different scales of modified boron nitride (BN, 1 μm, 10 μm) were used to improve the thermal conductivity of epoxy resin. The surfaces BN were modification by a silane coupling agent to improve the compatibility between BN and epoxy resin. The effects of micro-and nano-BN sheets on the microstructure, breakdown strength, thermal and mechanical properties of epoxy resin composite were studied. The characterization of its morphology by scanning electron microscopy shows that nano-BN distribution is in the middle of micro-BN, forming a better bridging effect. The data of the breakdown strength and thermal conductivity indicated that when the content of micro-BN is 30 wt% and nano-BN is 20 wt%, the thermal conductivity of BN/epoxy composite was 1.52 W/m·K. In addition, the breakdown strength is 77.1 kV/mm. Thus, this type of BN-filled BN/EP composites with remarkable insulation and thermal conductivity properties would have potential for power engineering materials.

A study on the viscosity reduction mechanism of high-filled silicone potting adhesive by the formation of Al2O3 clusters

Heat dissipation has become a key problem for highly integrated and miniaturized electronic components. High thermal conductivity, good flowability and low coefficient of linear thermal expansion (CLTE) are indispensable performance parameters in the field of electronic potting composite materials. In this study, spherical alumina (Al₂O₃) was surface modified by γ-(2,3-epoxypropoxy) propyltrimethoxy silane (KH560) and γ-aminopropyltriethoxy silane (KH550) and labelled as Al₂O₃-epoxy and Al₂O₃–NH₂, respectively. Al₂O₃-epoxy and Al₂O₃–NH₂ powders were equally filled in vinyl silicone oil to prepare a high Al₂O₃ loading (89 wt%) precursor of silicone potting adhesive. The viscosity of the precursor rapidly decreased with increasing reaction time of Al₂O₃-epoxy and Al₂O₃–NH₂ at 140 °C. The viscosity reduction mechanism may be due to the formation of some Al₂O₃ clusters by the reaction of Al₂O₃-epoxy with Al₂O₃–NH₂, which results in some vinyl silicone oil segments being held in the channel of particles through capillary phenomenon, leading to the friction among Al₂O₃ clusters decreasing considerably. Laser particle size analysis and scanning electron microscopy (SEM) results confirmed the existence of Al₂O₃ clusters. Energy dispersive spectroscopy (EDS) and dynamic viscoelasticity experiments revealed that some segments of vinyl silicone oils were held by Al₂O₃ clusters. When Al₂O₃-epoxy and Al₂O₃–NH₂ reacted for 4 h, the thermal conductivity, CLTE and volume electrical resistivity of the silicone potting adhesive reached 2.73 W m⁻¹ k⁻¹, 75.8 ppm/°C and 4.6 × 10¹³ Ω cm, respectively. A new strategy for preparing electronic potting materials with high thermal conductivity, good flowability and low CLTE is presented.

Surface-modified Al₂O₃-epoxy reacts with Al₂O₃–NH₂ to form clusters that reduce the viscosity of electronic potting composites.

Polymer-Assisted Dispersion of Boron Nitride/Graphene in a Thermoplastic Polyurethane Hybrid for Cooled Smart Clothes

The avoidance and mitigation of energy wastage have attracted increasing attention in the context of global warming and climate change. With advances in materials science, diverse multifunctional materials with high thermal conductivity have shown excellent energy-saving potential. In this study, a hybrid film exhibiting high thermal conductivity with excellent stretchability and washability was prepared. First, a simple surface modification of boron nitride (BN) was performed to realize a modified boron nitride (BNOH) filler. Next, an organic dispersant was synthesized to enhance the dispersion of BNOH and graphene nanoplatelets (GNPs) in the proposed composite. Subsequently, a simple procedure was used to combine the dispersed GNPs and BNOH fillers with thermoplastic polyurethane (TPU) to fabricate a hybrid structure. The hybrid films composed of BNOH-GNP/TPU with a dispersant exhibited a high thermal conductivity of 12.62 W m^-1 K^-1 at a low filler loading of 20 wt.%. This hybrid film afforded excellent stretchability and washability, as indicated by the very small thermal-conductivity reduction to only 12.23 W m^-1 K^-1 after 100 cycles of fatigue testing and to 12.01 W m^-1 K^-1 after 10 washing cycles. Furthermore, the cooling and hydrophobicity properties of the hybrid film were enhanced when compared with neat TPU. Overall, our approach demonstrates a simple and novel strategy to break the passive effect of traditional commercial cooling clothing by combining a high-thermal-conductivity film with an active cooling source to amplify the cooling effect and develop wearable cooled smart clothes with great commercial potential.

Beyond homogeneous dispersion: oriented conductive fillers for high κ nanocomposites

Rational design of structures for regulating the thermal conductivities (κ) of materials is critical to many components and products employed in electrical, electronic, energy, construction, aerospace, and medical applications. As such, considerable efforts have been devoted to developing polymer composites with tailored conducting filler architectures and thermal conduits for highly improved κ. This paper is dedicated to overviewing recent advances in this area to offer perspectives for the next level of future development. The limitations of conventional particulate-filled composites and the issue of percolation are discussed. In view of different directions of heat dissipation in polymer composites for different end applications, various approaches for designing the micro- and macroscopic structures of thermally conductive networks in the polymer matrix are highlighted. Methodological approaches devised to significantly ameliorate thermal conduction are categorized with respect to the pathways of heat dissipation. Future prospects for the development of thermally conductive polymer composites with modulated thermal conduction pathways are highlighted.