Wall Density-Controlled Thermal Conductive and Mechanical Properties of Three-Dimensional Vertically Aligned Boron Nitride Network-Based Polymeric Composites

Synergistic Liquid Metal-Diamond-Reinforced Poly(ionic liquid) Composites for High Thermal Conductivity and Excellent Reliability

This study presents a thermally conductive composite material that combines poly(ionic liquid) (PIL) poly(1-octyl-3-vinylimidazole)bis(trifluoromethanesulfonyl)imide (P[OVIm]NTf2), liquid metal (LM), and diamond as dual fillers, totaling 85 vol % loading. The composite achieves a thermal conductivity of 14.2 W m-1 K-1, a tensile elongation of 74%, and an interfacial adhesion strength of 0.99 MPa on steel substrates. Structural optimization and interfacial engineering contribute to its exceptional mechanical flexibility and processability, confirmed by dynamic rheological analysis. In chip packaging tests, the composite enhances heat dissipation efficiency by reducing interfacial thermal resistance. Diamond incorporation prevents LM oxidation, maintaining 99% surface coverage and minimal performance degradation after aging tests (-55 to 125 °C, 300 cycles; 150 °C, 1000 h). Chromium-plated diamond further improves reliability under high humidity and temperature. This ternary system resolves the trade-off between high filler loading and flexibility in thermal interface materials. Interfacial reinforcement and synergistic stabilization mechanisms balance thermal conductivity with long-term reliability. These findings promote the use of poly(ionic liquid)s in thermal management, offering a durable solution for high-power electronics, especially in extreme conditions. The study establishes a framework for designing advanced TIMs with optimized performance and stability.

Universal Construction of Electrical Insulation and High-Thermal-Conductivity Composites Based on the In Situ Exfoliation of Boron Nitride-Graphene Hybrid Filler

Hexagonal boron nitride (h-BN), with excellent thermal conductivity and insulation capability, has garnered significant attention in the field of electronic thermal management. However, the thermal conductivity of the h-BN-enhanced polymer composite material is far from that expected because of the insurmountable interfacial thermal resistance. In order to realize the high thermal conductivity of polymer composite thermal interface materials, herein, an in situ exfoliation method has been employed to prepare a boron nitride nanosheet-graphene (BNNS-Gr) hybrid filler. After being incorporated into a poly(ethylene glycol) (PEG) matrix, the thermal conductivity of composites is significantly improved on the premise of electrical insulation. Furthermore, a three-dimensional (3D) thermally conductive framework using this hybrid filler as the raw material has also been constructed. After incorporating poly(ethylene glycol) (PEG) through a vacuum impregnation method, this ordered structure effectively resolves the leakage issue in phase-change composites during actual working conditions and showcases enhanced thermal conductivity of 2.45 W m-1 K-1 at 10 vol %, along with excellent electrical insulation, shape stability, and cyclic stability. The modified Hashin-Shtrikman model and the Foygel nonlinear model prove that compounding graphene with BN reduces the interfacial thermal resistance of polymer composites for both disordered and ordered systems. This indicates that the in situ exfoliation strategy is an effective method to fabricate the nanofiller for reducing the interfacial thermal resistance of composites.

Unlocking the Trade-off Between Intrinsic and Interfacial Thermal Transport of Boron Nitride Nanosheets by Surface Functionalization for Advanced Thermal Interface Materials

The increasing computing power of AI presents a major challenge for high-power chip solution and heat dissipation. Boron nitride nanosheet-based thermal interface materials (BNNS-based TIMs) exhibit excellent electrical insulation property, ensuring the secure and stable operation of chips. However, the efficiency of micro/nano interfacial thermal transport is limited, impeding further enhancements in the thermal conductivity (TC) of BNNS-based TIMs. Here, a strategy of surface functionalization is reported to unlock the trade-off between the intrinsic and interfacial thermal transport of BNNS within TIMs. These results suggest that the surface functionalization maintains the intrinsic high TC of BNNS while significantly increasing binding energy between micro/nano interfaces in BNNS-based TIMs, effectively reducing interfacial thermal resistance of BNNS joint interfaces and interfaces between BNNSs and the matrix by 50% and 26.1%, respectively. The BNNS-based TIMs exhibit excellent TC (≈21-25 W/(m·K)) and ultralow Young's modulus, which can promote the development of flexible high-performance chip cooling technology in the AI industry.

Constructing the Snail Shell-Like Framework in Thermal Interface Materials for Enhanced Through-Plane Thermal Conductivity

Melioration of the through-plane thermal conductivity (TC) of thermal interface materials (TIMs) is a sore need for efficient heat dissipation to handle an overheating concern of high-power-density electronics. Herein, we constructed a snail shell-like thermal conductive framework to facilitate vertical heat conduction in TIMs. With inspiration from spirally growing calcium carbonate platelets of snail shells, a facile double-microrod-assisted curliness method was developed to spirally coil boron nitride nanosheet (BNNS)/aramid nanofiber (ANF) laminates where interconnected BNNSs lie along the horizontal plane. Thus, vertical alignment of BNNSs in the resultant TIM was achieved, exhibiting a through-plane TC enhancement of ∼100% compared to the counterpart with randomly distributed BNNSs at the same BNNS addition (50 wt %). The Foygel's nonlinear model revealed that this unique snail shell-like BNNS framework reduced interfacial thermal resistance by 4 orders of magnitude. Our TIM showed superior interfacial thermal dissipation efficiency, leading to a temperature reduction of 42.6 °C for the LED chip compared to the aforementioned counterpart. Our work paves a valuable way for fabricating high-performance TIMs to ensure reliable operation of electrical devices.

Construction of chitosan/alginate aerogels with three-dimensional hierarchical pore network structure via hydrogen bonding dissolution and covalent crosslinking synergistic strategy for thermal management systems

To replace traditional petrochemical-based thermal insulation materials, in this work, the chitosan (CHI)/alginate (ALG) (CA) aerogels with three-dimensional hierarchical pore network structure were constructed by compositing CHI and ALG using a synergistic strategy of hydrogen bonding dissolution and covalent crosslinking. The structure and properties were further regulated by crosslinking the CA aerogels with epichlorohydrin (ECH). The CA aerogels exhibited various forms of covalent crosslinking, hydrogen bonding and electrostatic interactions, with hydrogen bonding content reaching 79.12 %. The CA aerogels showed an excellent three-dimensional hierarchical pore network structure, with an average pore size minimum of 15.92 nm. The structure regulation of CA aerogels obtained excellent compressive properties, with an increase of stress and strain by 137.61 % and 45.05 %, which can support a heavy object 5000 times its weight. Additionally, CA aerogels demonstrate excellent thermal insulation properties and low thermal conductivity, comparable to commercially available insulation materials. More importantly, CA aerogels have good cyclic insulation stability and thermal properties, and they have a flame retardancy rating of V-0, which shows the stability of insulation properties and excellent safety. CA aerogels provide new ideas for the development of biomass thermal insulation materials and are expected to be candidates for thermal management applications.

Constructing Heterostructured MWCNT-BN Hybrid Fillers in Electrospun TPU Films to Achieve Superior Thermal Conductivity and Electrical Insulation Properties

The development of thermally conductive polymer/boron nitride (BN) composites with excellent electrically insulating properties is urgently demanded for electronic devices. However, the method of constructing an efficient thermally conductive network is still challenging. In the present work, heterostructured multi-walled carbon nanotube-boron nitride (MWCNT-BN) hybrids were easily prepared using an electrostatic self-assembly method. The thermally conductive network of the MWCNT-BN in the thermoplastic polyurethane (TPU) matrix was achieved by the electrospinning and stack-molding process. As a result, the in-plane thermal conductivity of TPU composite films reached 7.28 W m-1 K-1, an increase of 959.4% compared to pure TPU films. In addition, the Foygel model showed that the MWCNT-BN hybrid filler could largely decrease thermal resistance compared to that of BN filler and further reduce phonon scattering. Finally, the excellent electrically insulating properties (about 1012 Ω·cm) and superior flexibility of composite film make it a promising material in electronic equipment. This work offers a new idea for designing BN-based hybrids, which have broad prospects in preparing thermally conductive composites for further practical thermal management fields.

Alveoli-Mimetic Synergistic Liquid and Solid Thermal Conductive Interface as a Novel Strategy for Designing High-Performance Thermal Interface Materials

Thermal interface materials (TIMs) are in desperate desire with the development of the modern electronic industry. An excellent TIM needs desired comprehensive properties including but not limited to high thermal conductivity, low Yong's modulus, lightweight, as well as low price. However, as is typically the case, those properties are naturally contradictory. To tackle such dilemmas, a strategy of construction high-performance TIM inspired by alveoli is proposed. The material design includes the self-alignment of graphite into 3D interconnected thermally conductive networks by polydimethylsiloxane beads (PBs) -the alveoli; and a small amount of liquid metal (LM) - capillary networks bridging the PBs and graphite network. Through the delicate structural regulation and the synergistic effect of the LM and solid graphite filler, superb thermal conductivity (9.98 ± 0.34 W m-1 K-1) can be achieved. The light emitting diode (LED) application and their performance in the central processing unit (CPU) heat dispersion manifest the TIM developed in the work has stable thermal conductivity for long-term applications. The thermally conductive, soft, and lightweight composites are believed to be high-performance silicone bases TIMs for advanced electronics.

One-step formation of three-dimensional interconnected T-shaped microstructures inside composites by orthogonal bidirectional self-assembly method

The fillers inside a polymer matrix should typically be self-assembled in both the horizontal and vertical directions to obtain 3-dimentional (3D) percolation pathways, whereby the fields of application can be expanded and the properties of organic-inorganic composite films improved. Conventional dielectrophoresis techniques can typically only drive fillers to self-assemble in only one direction. We have devised a one-step dielectrophoresis-driven approach that effectively induces fillers self-assembly along two orthogonal axes, which results in the formation of 3D interconnected T-shaped iron microstructures (3D-T CIP) inside a polymer matrix. This approach to carbonyl iron powder (CIP) embedded in a polymer matrix results in a linear structure along the thickness direction and a network structure on the top surface of the film. The fillers in the polymer were controlled to achieve orthogonal bidirectional self-assembly using an external alternating current (AC) electric field and a non-contact technique that did not lead to electrical breakdown. The process of 3D-T CIP formation was observed in real time using in situ observation methods with optical microscopy, and the quantity and quality of self-assembly were characterized using statistical and fractal analysis. The process of fillers self-assembly along the direction perpendicular to the electric field was explained by finite element analogue simulations, and the results indicated that the insulating polyethylene terephthalate (PET) film between the electrode and the CIP/prepolymer suspension was the key to the formation of the 3D-T CIP. In contrast to the traditional two-step method of fabricating sandwich-structured film, the fabricated 3D-T CIP film with 3D electrically conductive pathways can be applied as magnetic field sensor.

A binder-free ice template method for vertically aligned 3D boron nitride polymer composites towards thermal management

Hexagonal boron nitride (BN) is an attractive filler candidate for thermal interface materials, but the thermal conductivity enhancement is limited by the anisotropic thermal conductivity of BN and disordered thermal pathways in the polymer matrix. Herein, a facile and economic ice template method is proposed, wherein BN modified by tannic acid (BN-TA) directly self-assemble to form vertically aligned nacre-mimetic scaffold without additional binders and post-treatment. The effects of the BN slurry concentration and the ratio of BN/TA on three-dimensional (3D) skeleton morphology are fully investigated. The corresponding polydimethylsiloxane (PDMS) composite via vacuum-impregnation achieves a high through-plane thermal conductivity of 3.8 W/mK at a low filler loading of 18.7 vol%, which is 2433% and 100% higher than that of pristine PDMS and the PDMS composite with randomly distributed BN-TA, respectively. The finite element analysis results theoretically demonstrate the superiority of the highly longitudinally ordered 3D BN-TA skeleton in axial heat transfer. Additionally, 3D BN-TA/PDMS exhibits excellent practical heat dissipation capability, lower thermal expansion coefficient, and enhanced mechanical properties. This strategy offers an anticipated perspective for developing high-performance thermal interface materials to address the thermal challenges of modern electronics.

Constructing Sandwich-Structured Poly(vinyl alcohol) Composite Films with Thermal Conductive and Electrical Performance

With the miniaturization and high integration development in microelectronic devices, the problem of heat dissipation has attracted widespread attention. Highly thermal conductive and electrical insulation polymer composites show great advantages to solve the problems of heat dissipation. Nevertheless, the fabrication of polymer composites with both excellent thermal conductivity and electrical performance is still a great challenge. Herein, to coordinate the thermal and electrical properties of the composite film, the sandwich-structured poly(vinyl alcohol) (PVA)/boron phosphide (BP)-boron nitride nanosheet (BNNS) composite films were prepared, with the PVA/BP composite film as the top and bottom layers and the BNNS layer as the middle layer. When the filler loading was 31.92 wt %, the sandwich-structured composite films showed excellent in-plane thermal conductivity (9.45 W·m^-1·K^-1), low dielectric constant (1.25 at 10² Hz), and excellent breakdown strength. In the composite film, the interconnected BP particles and BNNS layer formed several heat dissipation pathways to increase the thermal conductivity, while the insulated BNNS layer hampered the electron transformation to enhance the electrical resistivity of films. Therefore, the PVA/BP-BNNS composite films showed a potential application in heat dissipation of high power electronic devices.

Thermal Interface Materials with High Thermal Conductivity and Low Young's Modulus Using a Solid-Liquid Metal Codoping Strategy

Thermal interface materials (TIMs), as typical thermal functional materials, are highly required to possess both high thermal conductivity and low Young's modulus. However, the naturally synchronized change in the thermal and mechanical properties seriously hinders the development of high-performance TIMs. To tackle such a dilemma, a strategy of codoping solid fillers and liquid metal fillers into polymer substrates is proposed in this study. This strategy includes a large amount of liquid metals that play the role of thermal paths and a small amount of uniformly dispersed solid fillers that further enhance heat conduction. Through the synergistic effect of the liquid metal and solid fillers, the thermal conductivity can be improved, and Young's modulus can be kept small simultaneously. A typical TIM with a volume of 55% gallium-based liquid metal and 15% copper particles as fillers has a thermal conductivity of 3.94 W/(m·K) and a Young's modulus of 699 kPa, which had the maximum thermomechanical performance coefficient compared with liquid metal TIMs and solid filler-doped TIMs. In addition, the thermal conductivity of the solid-liquid metal codoped TIM increased sharply with an increase of liquid metal content, and Young's modulus increased rapidly with an increase of the volume ratio of copper and polymer. The high-low-temperature cycling test and large-size light-emitting diode (LED) application demonstrated that this TIM had stable physical performance. The synergistic effect of the solid fillers and liquid metal fillers provides a broad space to solve the classic tradeoff issue of the mechanical and thermal properties of composites.

Parallel Structure Enhanced Polysilylaryl-enyne/Ca0.9La0.067TiO3 Composites with Ultra-High Dielectric Constant and Thermal Conductivity

With the rapid development of the microwave communication industry, microwave dielectric materials have been widely studied as the medium of signal transmission. Nowadays, with the increase in communication frequency, devices are miniaturized, and dielectric materials are required to have higher dielectric constants. At the same time, the miniaturization of devices brings about an increase in power density, which puts forward higher requirements for the thermal conductivity of materials. In this work, polysilylaryl-enyne (PSAE) and Ca_0.9La_0.067TiO₃ (CLT) were chosen as the matrix and filler, respectively, to construct a parallel model composite through a freeze casting method and a 0-3 model composite through the direct mixing method, respectively. After comparing the microstructures of the two models, their dielectric properties and thermal conductivity were measured and simulated. The parallel model composites in the stable range possess uniform parallel structures, and the solid content limit for them could be as high as 73.2%, which is much higher than that of the 0-3 model composites. While the 0-3 model composite possesses an optimal dielectric constant of 25.4 (@10 GHz) and a thermal conductivity of 0.965 W·m^-1·K^-1, the parallel model composite possesses a 2 times higher dielectric constant of 76.2 (@10 GHz) and a 1 times higher thermal conductivity of 2.095 W·m^-1·K^-1. Since the parallel model composite possesses much higher dielectric constant and thermal conductivity than traditional 0-3 model composites, it can be an excellent candidate for microwave communication.

Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging

Miniaturized and high-power-density 3D electronic devices pose new challenges on thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is currently limited by the thermal conductivity achieved by thermal interface materials (TIMs) and by their capability to direct the heat toward heat sinks. Here, high thermal conductivity boron nitride (BN)-based composites that are able to conduct heat intentionally toward specific areas by locally orienting magnetically functionalized BN microplatelets are created using magnetically assisted slip casting. The obtained thermal conductivity along the direction of alignment is unusually high, up to 12.1 W m^-1 K^-1 , thanks to the high concentration of 62.6 vol% of BN in the composite, the low concentration in polymeric binder, and the high degree of alignment. The BN composites have a low density of 1.3 g cm^-3 , a high stiffness of 442.3 MPa, and are electrically insulating. Uniquely, the approach is demonstrated with proof-of-concept composites having locally graded orientations of BN microplatelets to direct the heat away from two vertically stacked heat sources. Rationally designing the microstructure of TIMs to direct heat strategically provides a promising solution for efficient thermal management in 3D integrated electronics.

Interconnected MXene/Graphene Network Constructed by Soft Template for Multi-Performance Improvement of Polymer Composites

The multi-functionalization of polymer composites refers to the ability to connect multiple properties through simple structural design and simultaneously achieve multi-performance optimization. The large-scale design and mass production to realize the reasonable structure design of multifunctional polymer composites are urgently remaining challenges. Herein, the multifunctional MXene/graphene/polymer composites with three-dimensional thermally and electrically conductive network structures are fabricated via the utilization of the microstructure of the soft template, and a facile dispersion dip-coating approach. As a result, the polymer composites have a multi-performance improvement. At the MXene and graphene content of 18.7 wt%, the superior through-plane thermal conductivity of polymer composite is 2.44 W m^-1 K^-1, which is 1118% higher than that of the polymer matrix. The electromagnetic interference (EMI) shielding effectiveness of the sample reaches 43.3 dB in the range of X-band. And the mechanical property of the sample has advanced 4 times compared with the polymer matrix. The excellent EMI shielding and thermal management performance, along with the effortless and easy-to-scalable producing techniques, imply promising perspectives of the polymer composites in the next-generation smart electronic devices.

Lightweight Polyethylene/Hexagonal Boron Nitride Hybrid Thermal Conductor Fabricated by Melt Compounding Plus Salt Leaching

Application of porous polymeric materials is severely limited by their ultralow thermal conductivities. Herein, by promoting the formation of thermal conduction pathways, we fabricated open-cellular structured polyethylene/hexagonal boron nitride hybrid thermal conductors via melt compounding plus salt leaching. The structural analyses indicate that the inclusion of hBN can enhance the open-cell level of resultant materials. X-ray diffractions confirm the high in-plane alignments of hBN in each sample. Consequently, the test results evidence the superior thermal conductivities of our samples, and the thermal conductivities of each sample are characterized as functions of hBN loadings. Ultimately, our advanced porous thermal conductor with a low hBN loading of 3.1 vol% exhibits a high specific thermal conductivity of 0.75 (W/mk)/(g/cm3), which is 82.9% higher than virgin PE and far higher than bulk PE/hBN composites. Our work also intends to reveal the architectural advantages of open-cellular, as compared with the close-one, in fabricating porous materials with highly interconnected fillers.

Isolated Solid Wall-Assisted Thermal Conductive Performance of Three-Dimensional Anisotropic MXene/Graphene Polymeric Composites

The introduction of three-dimensional (3D) continuous conformations in polymer materials is a convincing proposal for acquiring the desirable multifunction to fulfill the urgent demands of highly integrated electronic devices. However, the limited functional design of the filled aligned network remains challenging. Herein, directional self-assembly 3D MXene/graphene aerogels are fabricated as conductive networks for polyethylene glycol (PEG) matrix. Based on the uniaxial and biaxial ice template method, the temperature gradient affects the aligned arrangement of the 3D microstructure. The biaxial PEG/MXene/GR composites exhibit an enhanced through-plane thermal conductivity of 1.64 W m^-1 K^-1 at 10.6 vol % content, which is 522% higher than that of pure PEG. The influence of the biaxial self-assembly strategy compared with that of the uniaxial one on the thermal conductivity reaches the highest 333% when the weight ratio equals 1:1. Meanwhile, the same difference also occurs in the electromagnetic shielding interference (EMI) property. The advanced EMI-shielding effectiveness of the biaxial PM1G1 composites reaches ∼36 dB at the 2.5 mm thickness. This research provides valuable guidance for designing high-performance applications of anisotropic thermal management and EMI shielding in 5G telecommunications and mobile electronic devices.

Machine Learning and Structural Design to Optimize the Flame Retardancy of Polymer Nanocomposites with Graphene Oxide Hydrogen Bonded Zinc Hydroxystannate

Designing flame-retardant polymers with high performance is a long-standing challenge, partly because of the time-consuming traditional approaches based on experiential intuition and trial-and-error screenings. Inspired by the effective new paradigm of data-driven material discovery, we used machine learning to analyze experimental data to accelerate the development of new flame-retardant polymers. To explore the relationship between limit oxygen index (LOI) and components, we prepared 20 composites and then trained a simple equation for the LOI using the method sure independence screening and sparsifying operator (SISSO). The data analysis allows us for a better understanding of the flame-retardant mechanism and components, and the equation has good accuracy in guiding the design of composites with high flame-retardant performance. Meanwhile, the increasing structural design of flame retardants is crucial to flame-retardant polymer composites. We proposed a structure of nano graphene oxide (GO) wrapped micro zinc hydroxystannate (ZHS) in a simple but effective way as a novel flame-retardant agent to enhance the flame retardancy and mechanical properties of polypropylene (PP) composites. The GO sheets were like "light yarns" wrapped onto the ZHS via hydrogen bonding in an ethanol solution. The selected samples were analyzed to confirm the predictive LOI model. The resultant composites with the substitution of intumescent flame retardant (IFR) by 1.0, 2.0, and 4.0 wt % ZHS@GO conferred better flame retardancy compared with PP composite containing only IFR, reflected by the efficient increase of LOI value and V0 rating of UL-94 vertical tests. The analysis principles and facile fabrication strategies proposed in this work could be important for developing highly flame retardant composites.

Highly Thermal Conductive Poly(vinyl alcohol) Composites with Oriented Hybrid Networks: Silver Nanowire Bridged Boron Nitride Nanoplatelets

With the increasing demand for thermal management materials in the highly integrated electronics area, building efficient heat-transfer networks to obtain advanced thermally conductive composites is of great significance. In the present work, highly thermally conductive poly(vinyl alcohol) (PVA)/boron nitride nanoplatelets@silver nanowires (BNNS@AgNW) composites were fabricated via the combination of the electrospinning and the spraying technique, followed by a hot-pressing method. BNNS are oriented along the in-plane direction, while AgNWs with a high aspect ratio can help to construct a thermal conductive network effectively by bridging BNNS in the composites. The PVA/BNNS@AgNW composites showed high in-plane thermal conductivity (TC) of 10.9 W/(m·K) at 33 wt % total fillers addition. Meanwhile, the composite shows excellent thermal dispassion capability when it is taken as a thermal interface material of a working light-emitting diode (LED) chip, which is certified by capturing the surface temperature of the LED chip. In addition, the out-of-plane electrical conductivity of the composites is below 10^-12 S/cm. The composites with outstanding thermal conductive and electrical insulating properties hold promise for application in electrical packaging and thermal management.