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Kim M, Park H, Kim E, Chung M, Oh JH. Photo-crosslinkable organic materials for flexible and stretchable electronics. MATERIALS HORIZONS 2025. [PMID: 40202255 DOI: 10.1039/d4mh01757a] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 04/10/2025]
Abstract
As technology advances to enhance human perceptual experiences of the surrounding environment, significant research on stretchable electronics is actively progressing, spanning from the synthesis of materials to their applications in fully integrated devices. A critical challenge lies in developing materials that can maintain their electrical properties under substantial stretching. Photo-crosslinkable organic materials have emerged as a promising solution due to their ability to be precisely modified with light to achieve desired properties, such as enhanced durability, stable conductivity, and micropatterning. This review examines recent research on photo-crosslinkable organic materials, focusing on their components and integration within stretchable electronic devices. We explore the essential characteristics required for each device component (insulators, semiconductors, and conductors) and explain how photo-crosslinking technology addresses these needs through its principles and implementation. Additionally, we discuss the integration and utilization of these components in real-world applications, including physical sensors, organic field-effect transistors (OFETs), and organic solar cells (OSCs). Finally, we offer a concise perspective on the future directions and potential challenges in ongoing research on photo-crosslinkable organic materials.
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Affiliation(s)
- Minsung Kim
- School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of Korea.
| | - Hayeong Park
- School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of Korea.
| | - Eunjin Kim
- School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of Korea.
| | - Minji Chung
- School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of Korea.
| | - Joon Hak Oh
- School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of Korea.
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2
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Kim K, Grummon BC, Thrasher CJ, Macfarlane RJ. Regio-Selective Mechanical Enhancement of Polymer-Grafted Nanoparticle Composites via Light-Mediated Crosslinking. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2025; 37:e2410493. [PMID: 39871745 PMCID: PMC11899498 DOI: 10.1002/adma.202410493] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/19/2024] [Revised: 12/30/2024] [Indexed: 01/29/2025]
Abstract
Polymer-brush-grafted nanoparticles (PGNPs) that can be covalently crosslinked post-processing enable the fabrication of mechanically robust and chemically stable polymer nanocomposites with high inorganic filler content. Modifying PGNP brushes to append UV-activated crosslinkers along the polymer chains would permit a modular crosslinking strategy applicable to a diverse range of nanocomposite compositions. Further, light-activated crosslinking reactions enable spatial control of crosslink density to program intentionally inhomogeneous mechanical responses. Here, a method of synthesizing composites using UV-crosslinkable brush-coated nanoparticles (referred to as UV-XNPs) is introduced that can be applied to various monomer compositions by incorporating photoinitiators into the polymer brushes. UV crosslinking of processed UV-XNP structures can increase their tensile modulus up to 15-fold without any noticeable alteration to their appearance or shape. By using photomasks to alter UV intensity across a sample, intentionally designed inhomogeneities in crosslink density result in predetermined anisotropic shape changes under strain. This unique capability of UV-XNP materials is applied to stiffness-patterned flexible electronic substrates that prevent the delamination of rigid components under deformation. The potential of UV-XNPs as functional, soft device components is further demonstrated by wearable devices that can be modified post-fabrication to customize their performance, permitting the ability to add functionality to existing device architectures.
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Affiliation(s)
- Kyungtae Kim
- Department of Materials Science and EngineeringMassachusetts Institute of Technology (MIT)77 Massachusetts AvenueCambridgeMA02139USA
| | - Benjamin C. Grummon
- Department of ChemistryMassachusetts Institute of Technology (MIT)77 Massachusetts AvenueCambridgeMA02139USA
| | - Carl J. Thrasher
- Department of Materials Science and EngineeringMassachusetts Institute of Technology (MIT)77 Massachusetts AvenueCambridgeMA02139USA
| | - Robert J. Macfarlane
- Department of Materials Science and EngineeringMassachusetts Institute of Technology (MIT)77 Massachusetts AvenueCambridgeMA02139USA
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3
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Granelli R, Kovács-Vajna ZM, Torricelli F. Additive Manufacturing of Organic Electrochemical Transistors: Methods, Device Architectures, and Emerging Applications. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2025; 21:e2410499. [PMID: 39945058 PMCID: PMC11922034 DOI: 10.1002/smll.202410499] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/06/2024] [Revised: 01/14/2025] [Indexed: 03/20/2025]
Abstract
Organic electrochemical transistors (OECTs) are key devices in a large set of application fields including bioelectronics, neuromorphics, sensing, and flexible electronics. This review explores the advancements in additive manufacturing techniques accounting for printing technologies, device architectures, and emerging applications. The promising applications of printed OECTs, ranging from biochemical sensors to neuromorphic computing are examined, showcasing their versatility. Despite significant advancements, ongoing challenges persist, such as material-related issues, inconsistencies in film homogeneity, and the scalability of integration processes. This review identifies these critical obstacles and offers targeted solutions and future research directions aimed at enhancing the performance and reliability of fully-printed OECTs. By addressing these challenges, the aim of this study is to facilitate the development of next-generation OECTs that can meet the demands of emerging applications in sustainable and intelligent electronic and bioelectronic systems.
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Affiliation(s)
- Roberto Granelli
- Department of Information Engineering, University of Brescia, via Branze 38, Brescia, 25123, Italy
| | - Zsolt M Kovács-Vajna
- Department of Information Engineering, University of Brescia, via Branze 38, Brescia, 25123, Italy
| | - Fabrizio Torricelli
- Department of Information Engineering, University of Brescia, via Branze 38, Brescia, 25123, Italy
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Xiao F, Wei Z, Xu Z, Wang H, Li J, Zhu J. Fully 3D-Printed Soft Capacitive Sensor of High Toughness and Large Measurement Range. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2025; 12:e2410284. [PMID: 39764742 PMCID: PMC11848610 DOI: 10.1002/advs.202410284] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/26/2024] [Revised: 11/03/2024] [Indexed: 02/25/2025]
Abstract
Soft capacitive sensors are widely utilized in wearable devices, flexible electronics, and soft robotics due to their high sensitivity. However, they may suffer delamination and/or debonding due to their low interfacial toughness. In addition, they usually exhibit a small measurement range resulting from their limited stiffness variation range. In this paper, soft silicone-based capacitive sensors are developed by using a customized multimaterial 3D printer. By curing silicone materials simultaneously, the continuous conductive and dielectric layers achieve a substantial interfacial toughness of 1036 J·m-2. The sensor with tilted thin-plate dielectrics exhibits interfacial toughness of 645 J·m-2 or 339 J·m-2 in the transverse or longitudinal direction, respectively. Additionally, the sensors demonstrate a broad measurement range from 0.85 Pa to 5000 kPa. This extended range is facilitated by the significant stiffness variation of the separated tilted thin-plate dielectrics, ranging from 0.56 kPa to 19.76 MPa. Two applications of these fully printed soft sensors, including an intelligent sensorized insole and a robotic hand combining both soft actuators and soft sensors are showcased. It is believed that the strategy, employing 3D printing for soft microstructured sensors, is a general approach not only applicable for improving the performance of soft sensors, but also conducive to designing powerful soft functional devices.
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Affiliation(s)
- Fei Xiao
- School of Science and EngineeringThe Chinese University of Hong KongShenzhen518172P. R. China
- Soft Robotics CenterShenzhen Institute of Artificial Intelligence and Robotics for SocietyShenzhen518129P. R. China
| | - Zhuoheng Wei
- School of Science and EngineeringThe Chinese University of Hong KongShenzhen518172P. R. China
- Soft Robotics CenterShenzhen Institute of Artificial Intelligence and Robotics for SocietyShenzhen518129P. R. China
| | - Zhipeng Xu
- School of Science and EngineeringThe Chinese University of Hong KongShenzhen518172P. R. China
- Soft Robotics CenterShenzhen Institute of Artificial Intelligence and Robotics for SocietyShenzhen518129P. R. China
| | - Hao Wang
- School of Science and EngineeringThe Chinese University of Hong KongShenzhen518172P. R. China
- Soft Robotics CenterShenzhen Institute of Artificial Intelligence and Robotics for SocietyShenzhen518129P. R. China
| | - Jisen Li
- School of Science and EngineeringThe Chinese University of Hong KongShenzhen518172P. R. China
- Soft Robotics CenterShenzhen Institute of Artificial Intelligence and Robotics for SocietyShenzhen518129P. R. China
| | - Jian Zhu
- School of Science and EngineeringThe Chinese University of Hong KongShenzhen518172P. R. China
- Soft Robotics CenterShenzhen Institute of Artificial Intelligence and Robotics for SocietyShenzhen518129P. R. China
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Wu L, Song Y. Recent innovations in interfacial strategies for DLP 3D printing process optimization. MATERIALS HORIZONS 2025; 12:401-417. [PMID: 39470616 DOI: 10.1039/d4mh01160k] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/30/2024]
Abstract
Three-dimensional (3D) printing, also known as additive manufacturing, is capable of transforming computer-aided designs into intricate structures directly and on demand. This technology has garnered significant attention in recent years. Among the various approaches, digital light processing (DLP) 3D printing, which utilizes polymers or prepolymers as the ink, has emerged as the leading new technology, driven by high demand across diverse fields such as customized production, healthcare, education, and art design. DLP 3D printing technology employs cured slices as molding units and is recognized for its potential to achieve both high printing speed and resolution. Recent insights into the DLP printing process highlight its inherent interface transformations between liquid and solid states. This review summarizes key aspects of the printing process, speed, precision, and material diversity optimization, from the view of interfacial interactions between solid and liquid phases which are influenced by resin formation, curing surfaces and light source properties. These interactions include those at the liquid resin-UV pattern interface, the cured structure-curing surface interface, the liquid resin-curing surface interface, and the liquid resin-cured structure interface, each contributing to the unique characteristics of the printed results. Finally, this review addresses the current challenges and limitations of DLP 3D printing, providing valuable insights for future improvements and guiding potential innovations in the field.
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Affiliation(s)
- Lei Wu
- Key Laboratory of Green Printing, Beijing National Laboratory for Molecular Sciences (BNLMS), Institute of Chemistry, Chinese Academy of Sciences, Beijing, 100190, P. R. China.
| | - Yanlin Song
- Key Laboratory of Green Printing, Beijing National Laboratory for Molecular Sciences (BNLMS), Institute of Chemistry, Chinese Academy of Sciences, Beijing, 100190, P. R. China.
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Berman A, Hsiao K, Root SE, Choi H, Ilyn D, Xu C, Stein E, Cutkosky M, DeSimone JM, Bao Z. Additively manufactured micro-lattice dielectrics for multiaxial capacitive sensors. SCIENCE ADVANCES 2024; 10:eadq8866. [PMID: 39365852 PMCID: PMC11451511 DOI: 10.1126/sciadv.adq8866] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/04/2024] [Accepted: 08/30/2024] [Indexed: 10/06/2024]
Abstract
Soft sensors that can perceive multiaxial forces, such as normal and shear, are of interest for dexterous robotic manipulation and monitoring of human performance. Typical planar fabrication techniques have substantial design constraints that often prohibit the creation of functionally compelling and complex architectures. Moreover, they often require multiple-step operations for production. Here, we use an additive manufacturing process based on continuous liquid interface production to create high-resolution (30-micrometer) three-dimensional elastomeric polyurethane lattices for use as dielectric layers in capacitive sensors. We show that the capacitive responses and sensitivities are highly tunable through designs of lattice type, thickness, and material-void volume percentage. Microcomputed tomography and finite element simulation are used to elucidate the influence of lattice design on the deformation mechanism and concomitant sensing behavior. The advantage of three-dimensional printing is exhibited with examples of fully printed representative athletic equipment with integrated sensors.
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Affiliation(s)
- Arielle Berman
- Department of Mechanical Engineering, Stanford University, Stanford, CA 94305, USA
| | - Kaiwen Hsiao
- Department of Materials Science and Engineering, Texas A&M University, College Station, TX 77840, USA
| | - Samuel E. Root
- Department of Chemical Engineering, Stanford University, Stanford, CA 94305, USA
| | - Hojung Choi
- Department of Mechanical Engineering, Stanford University, Stanford, CA 94305, USA
| | - Daniel Ilyn
- Department of Mechanical Engineering, Stanford University, Stanford, CA 94305, USA
| | - Chengyi Xu
- Department of Chemical Engineering, Stanford University, Stanford, CA 94305, USA
| | - Emily Stein
- Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, USA
| | - Mark Cutkosky
- Department of Mechanical Engineering, Stanford University, Stanford, CA 94305, USA
| | - Joseph M. DeSimone
- Department of Chemical Engineering, Stanford University, Stanford, CA 94305, USA
| | - Zhenan Bao
- Department of Chemical Engineering, Stanford University, Stanford, CA 94305, USA
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He X, Zhang B, Liu Q, Chen H, Cheng J, Jian B, Yin H, Li H, Duan K, Zhang J, Ge Q. Highly conductive and stretchable nanostructured ionogels for 3D printing capacitive sensors with superior performance. Nat Commun 2024; 15:6431. [PMID: 39085229 PMCID: PMC11291765 DOI: 10.1038/s41467-024-50797-w] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/27/2024] [Accepted: 07/22/2024] [Indexed: 08/02/2024] Open
Abstract
Ionogels are promising material candidates for ionotronics due to their excellent ionic conductivity, stretchability, and thermal stability. However, it is challenging to develop 3D printable ionogels with both excellent electrical and mechanical properties. Here, we report a highly conductive and stretchable nanostructured (CSN) ionogel for 3D printing ionotronic sensors. We propose the photopolymerization-induced microphase separation strategy to prepare the CSN ionogels comprising continuous conducting nanochannels intertwined with cross-linked polymeric framework. The resultant CSN ionogels simultaneously achieves high ionic conductivity (over 3 S m-1), high stretchability (over 1500%), low degree of hysteresis (0.4% at 50% strain), wide-temperature-range thermostability (-72 to 250 °C). Moreover, its high compatible with DLP 3D printing enables the fabrication of complex ionogel micro-architectures with high resolution (up to 5 μm), which allows us to manufacture capacitive sensors with superior sensing performances. The proposed CSN ionogel paves an efficient way to manufacture the next-generation capacitive sensors with enhanced performance.
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Affiliation(s)
- Xiangnan He
- Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Southern University of Science and Technology, Shenzhen, China
- Department of Mechanical and Energy Engineering, Southern University of Science and Technology, 518055, Shenzhen, China
| | - Biao Zhang
- Xi'an Institute of Flexible Electronics, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an, China
| | - Qingjiang Liu
- Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Southern University of Science and Technology, Shenzhen, China
- Department of Mechanical and Energy Engineering, Southern University of Science and Technology, 518055, Shenzhen, China
| | - Hao Chen
- Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Southern University of Science and Technology, Shenzhen, China
- Department of Mechanical and Energy Engineering, Southern University of Science and Technology, 518055, Shenzhen, China
| | - Jianxiang Cheng
- Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Southern University of Science and Technology, Shenzhen, China
- Department of Mechanical and Energy Engineering, Southern University of Science and Technology, 518055, Shenzhen, China
| | - Bingcong Jian
- Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Southern University of Science and Technology, Shenzhen, China
- Department of Mechanical and Energy Engineering, Southern University of Science and Technology, 518055, Shenzhen, China
| | - Hanlin Yin
- Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Southern University of Science and Technology, Shenzhen, China
- Department of Mechanical and Energy Engineering, Southern University of Science and Technology, 518055, Shenzhen, China
| | - Honggeng Li
- Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Southern University of Science and Technology, Shenzhen, China
- Department of Mechanical and Energy Engineering, Southern University of Science and Technology, 518055, Shenzhen, China
| | - Ke Duan
- Department of Materials Science and Engineering, College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China
| | - Jianwei Zhang
- Department of Materials Science and Engineering, College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China
| | - Qi Ge
- Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Southern University of Science and Technology, Shenzhen, China.
- Department of Mechanical and Energy Engineering, Southern University of Science and Technology, 518055, Shenzhen, China.
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Oh E, Kane AQ, Truby RL. Architected Poly(ionic liquid) Composites with Spatially Programmable Mechanical Properties and Mixed Conductivity. ACS APPLIED MATERIALS & INTERFACES 2024; 16:10736-10745. [PMID: 38354100 DOI: 10.1021/acsami.3c18512] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 02/16/2024]
Abstract
Structural electrolytes present advantages over liquid varieties, which are critical to myriad applications. In particular, structural electrolytes based on polymerized ionic liquids or poly(ionic liquids) (pILs) provide wide electrochemical windows, high thermal stability, nonvolatility, and modular chemistry. However, current methods of fabricating structural electrolytes from pILs and their composites present limitations. Recent advances have been made in 3D printing pIL electrolytes, but current printing techniques limit the complexity of forms that can be achieved, as well as the ability to control mechanical properties or conductivity. We introduce a method for fabricating architected pIL composites as structural electrolytes via embedded 3D (EMB3D) printing. We present a modular design for formulating ionic liquid (IL) monomer composite inks that can be printed into sparse, lightweight, free-standing lattices with different functionalities. In addition to characterizing the rheological and mechanical behaviors of IL monomer inks and pIL lattices, we demonstrate the self-sensing capabilities of our printed structural electrolytes during cyclic compression. Finally, we use our inks and printing method to spatially program self-sensing capabilities in pIL lattices through heterogeneous architectures as well as ink compositions that provide mixed ionic-electronic conductivity. Our free-form approach to fabricating structural electrolytes in complex, 3D forms with programmable, anisotropic properties has broad potential use in next-generation sensors, soft robotics, bioelectronics, energy storage devices, and more.
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Affiliation(s)
- EunBi Oh
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
| | - Alexander Q Kane
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
| | - Ryan L Truby
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
- Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, United States
- Center for Robotics and Biosystems, Northwestern University, Evanston, Illinois 60208, United States
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Wang Z, Liang X, Wang G, Wang X, Chen Y. Emerging Bioprinting for Wound Healing. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023:e2304738. [PMID: 37566537 DOI: 10.1002/adma.202304738] [Citation(s) in RCA: 22] [Impact Index Per Article: 11.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/19/2023] [Revised: 08/05/2023] [Indexed: 08/13/2023]
Abstract
Bioprinting has attracted much attention due to its suitability for fabricating biomedical devices. In particular, bioprinting has become one of the growing centers in the field of wound healing, with various types of bioprinted devices being developed, including 3D scaffolds, microneedle patches, and flexible electronics. Bioprinted devices can be designed with specific biostructures and biofunctions that closely match the shape of wound sites and accelerate the regeneration of skin through various approaches. Herein, a comprehensive review of the bioprinting of smart wound dressings is presented, emphasizing the crucial effect of bioprinting in determining biostructures and biofunctions. The review begins with an overview of bioprinting techniques and bioprinted devices, followed with an in-depth discussion of polymer-based inks, modification strategies, additive ingredients, properties, and applications. The strategies for the modification of bioprinted devices are divided into seven categories, including chemical synthesis of novel inks, physical blending, coaxial bioprinting, multimaterial bioprinting, physical absorption, chemical immobilization, and hybridization with living cells, and examples are presented. Thereafter, the frontiers of bioprinting and wound healing, including 4D bioprinting, artificial intelligence-assisted bioprinting, and in situ bioprinting, are discussed from a perspective of interdisciplinary sciences. Finally, the current challenges and future prospects in this field are highlighted.
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Affiliation(s)
- Zijian Wang
- Department of Biomedical Engineering, Hubei Province Key Laboratory of Allergy and Immune Related Disease, TaiKang Medical School (School of Basic Medical Sciences), Wuhan University, Wuhan, 430071, China
- Department of Urology, Hubei Province Key Laboratory of Urinary System Diseases, Cancer Precision Diagnosis and Treatment and Translational Medicine Hubei Engineering Research Center, Zhongnan Hospital of Wuhan University, Wuhan, 430071, China
| | - Xiao Liang
- Department of Biomedical Engineering, Hubei Province Key Laboratory of Allergy and Immune Related Disease, TaiKang Medical School (School of Basic Medical Sciences), Wuhan University, Wuhan, 430071, China
| | - Guanyi Wang
- Department of Urology, Hubei Province Key Laboratory of Urinary System Diseases, Cancer Precision Diagnosis and Treatment and Translational Medicine Hubei Engineering Research Center, Zhongnan Hospital of Wuhan University, Wuhan, 430071, China
| | - Xinghuan Wang
- Department of Urology, Hubei Province Key Laboratory of Urinary System Diseases, Cancer Precision Diagnosis and Treatment and Translational Medicine Hubei Engineering Research Center, Zhongnan Hospital of Wuhan University, Wuhan, 430071, China
| | - Yun Chen
- Department of Biomedical Engineering, Hubei Province Key Laboratory of Allergy and Immune Related Disease, TaiKang Medical School (School of Basic Medical Sciences), Wuhan University, Wuhan, 430071, China
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Lin C, Zhang YF, Lu D, Silva A, Liu Z, Yang HY. Low-Temperature Resistant Stretchable Micro-Supercapacitor Based on 3D Printed Octet-Truss Design. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2023; 19:e2207634. [PMID: 36732912 DOI: 10.1002/smll.202207634] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/06/2022] [Revised: 01/09/2023] [Indexed: 06/08/2023]
Abstract
Recently, stretchable micro-supercapacitors (MSCs) that can be easily integrated into electronic devices have attracted research and industrial attentions. In this work, three-dimensional (3D) stretchable MSCs with an octet-truss electrode (OTE) design have been demonstrated by a rapid digital light processing (DLP) process. The 3D-printed electrode structure is beneficial for electrode-electrolyte interface formation and consequently increases the number of ions adsorbed on the electrode surface. The designed MSCs can achieve a high capacitance as ≈74.76 mF cm-3 under 1 mA cm-3 at room temperature even under a high mechanical deformation, and can achieve 19.53 mF cm-3 under 0.1 mA cm-3 at a low temperature (-30 °C). Moreover, finite element analysis (FEA) reveals the OTE structure provides 8 times more contact area per unit volume at the electrode-electrolyte interface compared to the traditional interdigital electrode (IDE). This work combines structural design and 3D printing techniques, which provides new insights into highly stretchable MSCs for next-generation electronic devices.
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Affiliation(s)
- Congjian Lin
- Digital Manufacturing and Design Centre, Singapore University of Technology and Design, 8 Somapah Road, Singapore, 487372, Singapore
| | - Yuan-Fang Zhang
- Shien-Ming Wu School of Intelligent Engineering, South China University of Technology, Guangzhou, 511442, P. R. China
| | - Dingjie Lu
- Institute of High Performance Computing, Agency for Science Technology and Research, 1 Fusionopolis Way, Singapore, 138632, Singapore
| | - Arlindo Silva
- Digital Manufacturing and Design Centre, Singapore University of Technology and Design, 8 Somapah Road, Singapore, 487372, Singapore
| | - Zhuangjian Liu
- Institute of High Performance Computing, Agency for Science Technology and Research, 1 Fusionopolis Way, Singapore, 138632, Singapore
| | - Hui Ying Yang
- Digital Manufacturing and Design Centre, Singapore University of Technology and Design, 8 Somapah Road, Singapore, 487372, Singapore
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