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For: Kuo CY, Chang YT, Huang YT, Ni IC, Chen MH, Wu CI. MoS2 as an Effective Cu Diffusion Barrier with a Back-End Compatible Process. ACS Appl Mater Interfaces 2023;15:47845-47854. [PMID: 37768847 DOI: 10.1021/acsami.3c12267] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 09/30/2023]
Number Cited by Other Article(s)
1
Kuo CY, Zhu JH, Chiu YP, Ni IC, Chen MH, Wu YR, Wu CI. Graphene-All-Around Cobalt Interconnect with a Back-End-of-Line Compatible Process. NANO LETTERS 2024;24:2102-2109. [PMID: 38295289 PMCID: PMC10870778 DOI: 10.1021/acs.nanolett.3c04833] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/12/2023] [Revised: 01/26/2024] [Accepted: 01/26/2024] [Indexed: 02/02/2024]
2
Mondal S, Basak D. Excitonic Rydberg States in a Trilayer to Monolayer H2-Aided CVD-Grown Large-Area MoS2 Film with Excellent UV to Visible Broad Band Photodetection Applications. ACS APPLIED MATERIALS & INTERFACES 2024;16:2940-2953. [PMID: 38176105 DOI: 10.1021/acsami.3c15655] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 01/06/2024]
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