High-Performance and Lightweight Thermal Management Devices by 3D Printing and Assembly of Continuous Carbon Nanotube Sheets

Highly conductive and durable nanocomposite hard coatings of carbon fiber reinforced thermoplastic composites against lightning strikes

The growing use of thermoplastic composites (TPCs) like low-melting polyaryletherketone (LM-PAEK) matrices reinforced with unidirectional carbon fiber (CF) in aircraft structures presents a significant challenge in terms of lightning strikes and electromagnetic interference shielding during aircraft operations. This is due to the weak electrical conductivity of TPC structures, which results in widespread damage when struck by lightning. The repair and maintenance of these extended damaged sites can increase operational costs and loss of flights. Several lightning strike protection (LSP) systems have been developed and implemented to address these concerns. This study evaluated a highly conductive coating with a low filler rate for its effectiveness as an LSP solution for TPCs on exterior aircraft surfaces. The TPC panel without any coatings was first studied. Subsequently, the level of conductivity was increased by incorporating the nanoscale conductive fillers, silver-coated copper (Ag/Cu) nanoflakes, with a silver content of 20 wt.% (Ag20/Cu) and 30 wt.% (Ag30/Cu), correspondingly, into the coating at two loadings of 55 wt.% and 70 wt.% in an epoxy carrier for the surface coatings. The behavior of electrical and surface conductivity was thoroughly examined to understand the impact of Ag/Cu with a high aspect ratio and the effectiveness of the LSP solution. In addition, the spray-coated TPC panels underwent rigorous Zone 2A lightning strike testing using simulated lightning current, in agreement with the industry standard of Society of Automotive Engineers (SAE) Aerospace Recommended Practice (ARP) 5412B. Despite the higher resistance due to the lower conductive coating weight, the TPC panels with Ag30/Cu at loading of 70 wt.% achieved better results than those with Ag30/Cu at loading of 55 wt.%. This is evidenced by the minor structural delamination and CF breakage on the front surface, which proposes a new economic route for a sustainable post-processed LSP system in the aviation industry.

Thermally Conductive and Electrically Insulating Polymer-Based Composites Heat Sinks Fabricated by Fusion Deposition Modeling

This study explores the potential of novel boron nitride (BN) microplatelet composites with combined thermal conduction and electrical insulation properties. These composites are manufactured through Fusion Deposition Modeling (FDM), and their application for thermal management in electronic devices is demonstrated. The primary focus of this work is, therefore, the investigation of the thermoplastic composite properties to show the 3D printing of lightweight polymeric heat sinks with remarkable thermal performance. By comparing various microfillers, including BN and MgO particles, their effects on material properties and alignment within the polymer matrix during filament fabrication and FDM processing are analyzed. The characterization includes the evaluation of morphology, thermal conductivity, and mechanical and electrical properties. Particularly, a composite with 32 wt% of BN microplatelets shows an in-plane thermal conductivity of 1.97 W m-1 K-1, offering electrical insulation and excellent printability. To assess practical applications, lightweight pin fin heat sinks using these composites are designed and 3D printed. Their thermal performance is evaluated via thermography under different heating conditions. The findings are very promising for an efficient and cost-effective fabrication of thermal devices, which can be obtained through extrusion-based Additive Manufacturing (AM), such as FDM, and exploited as enhanced thermal management solutions in electronic devices.

Beyond homogeneous dispersion: oriented conductive fillers for high κ nanocomposites

Rational design of structures for regulating the thermal conductivities (κ) of materials is critical to many components and products employed in electrical, electronic, energy, construction, aerospace, and medical applications. As such, considerable efforts have been devoted to developing polymer composites with tailored conducting filler architectures and thermal conduits for highly improved κ. This paper is dedicated to overviewing recent advances in this area to offer perspectives for the next level of future development. The limitations of conventional particulate-filled composites and the issue of percolation are discussed. In view of different directions of heat dissipation in polymer composites for different end applications, various approaches for designing the micro- and macroscopic structures of thermally conductive networks in the polymer matrix are highlighted. Methodological approaches devised to significantly ameliorate thermal conduction are categorized with respect to the pathways of heat dissipation. Future prospects for the development of thermally conductive polymer composites with modulated thermal conduction pathways are highlighted.

The Fabrication and Properties of a Bendable High-Temperature Resistance Conductive Pitch-Based Carbon/CNT Film Nanocomposite

This paper fabricates a carbon nanotube (CNT ) film-reinforced mesophase pitch-based carbon (CNTF/MPC) nanocomposite by using a hot-pressing carbonization method. During the carbonization, the stacked aromatic layers tended to rearrange into amorphous carbon, and subsequently generated crystalline carbon in the matrix. The continuous entangled CNT networks were efficiently densified by the carbon matrix though optimized external pressure to obtain the high-performance nanocomposites. The CNTF/MPC@1300 displayed a stable electrical conductivity up to 841 S/cm at RT-150 °C. Its thermal conductivity in the thickness direction was 1.89 W/m∙K, an order of magnitude higher than that of CNT film. Moreover, CNTF/MPC@1300 showed a mass retention of 99.3% at 1000 °C. Its tensile strength was 2.6 times the CNT film and the tensile modulus was two orders of magnitude higher. Though the CNTF/MPC nanocomposites exhibited brittle tensile failure mode, they resisted cyclic bending without damage. The results demonstrate that the CNTF/MPC nanocomposite has potential application in multi-functional temperature resistance aerospace structures.

Carbon Nanotube Reinforced Strong Carbon Matrix Composites

As an excellent candidate for lightweight structural materials and nonmetal electrical conductors, carbon nanotube reinforced carbon matrix (CNT/C) composites have potential use in technologies employed in aerospace, military, and defense endeavors, where the combinations of light weight, high strength, and excellent conductivity are required. Both polymer infiltration pyrolysis (PIP) and chemical vapor infiltration (CVI) methods have been widely studied for CNT/C composite fabrications with diverse focuses and various modifications. Progress has been reported to optimize the performance of CNT/C composites from broad aspects, including matrix densification, CNT alignment, microstructure control, and interface engineering, etc. Recent approaches, such as using resistance heating for PIP or CVI, contribute to the development of CNT/C composites. To deliver a timely and up-to-date overview of CNT/C composites, we have reviewed the most recent trends in fabrication processes, summarized the mechanical reinforcement mechanism, and discussed the electrical and thermal properties, as well as relevant case studies for high-temperature applications. Conclusions and perspectives addressing future routes for performance optimization are also presented. Hence, this review serves as a rundown of recent advances in CNT/C composites and will be a valuable resource to aid future developments in this field.

Lightweight, Superelastic Yet Thermoconductive Boron Nitride Nanocomposite Aerogel for Thermal Energy Regulation

Conventional three-dimensional (3D) thermal conductors or heat sinks are normally bulky solids with high density, which is cumbersome and not portable to satisfy current demands for soft and flexible electronic devices. To address this issue, here, a lightweight, superelastic yet thermally conductive boron nitride (BN) nanocomposite aerogel is designed by a facile freeze-drying method. The attained aerogel constituting of tailored interconnected binary inorganic-organic network structure exhibits low bulk density (6.5 mg cm^-3) and outstanding mechanical performances for compression, clotting, and stretching. Meanwhile, the aerogel has promising thermal stability and high thermal conductivity over wide temperature ranges (30-300 °C), validating the application even in extremely hot environments. Moreover, the aerogel can serve as a lightweight and elastic heat conductor for the enhancement of thermal energy harvest. Interestingly, during alternate strain loading/unloading under heating, the superelasticity and the anisotropy of thermal conductive transduction make the aerogel enable the elastic thermal energy capture and dynamic regulation. Therefore, our findings provide a potential use for the thermally conductive aerogel in future green energy applications.

A graphene-based smart thermal conductive system regulated by a reversible pressure-induced mechanism

Thermal dissipation and thermal insulation are important for maintaining the normal operation of devices, extending the service life of instruments, ensuring efficient energy utilization, and improving temperature-related human comfort. Yet it is difficult to achieve both the functions of thermal dissipation and thermal insulation in a single material with a specific thermal conductivity under specific conditions. In this work, based on the huge difference in thermal conductivity between air and reduced graphene oxide (rGO), a pressure-induced mechanism is used to regulate the amount of air inside an rGO foam, so that a periodic reversible change of thermal conductivity can be realized, achieving the dual functions of thermal dissipation and thermal insulation to meet the requirements of different application scenarios. Further fitting calculations suggest that the thermal conductivity of rGO foam is positively and negatively associated with the applied pressure and temperature, respectively, and it can be calculated for given pressure and temperature conditions. The pressure-induced reversible regulation of thermal conductivity in rGO foam provides a new design construct for smart thermal-management devices, and a new direction of application for 2D materials.