Miniaturization, Triple-Line Effects, and Reactive Wetting of Microsolder Interfaces

Effect of Surface Roughness and Droplet Size on Solder Wetting Angles

Reactive wetting is a process ubiquitous in modern electronic soldering processes. Nonetheless, the dependencies of reactive wetting angles on surface roughness and droplet size are not well understood but become increasingly important for reliable miniaturization of devices. In this study, advancing contact angles of the Sn^(l)/Cu^(s) reactive solder system are investigated and the aforementioned dependencies are evaluated. Several surface roughnesses and a large array of droplet sizes are measured. Clear size dependencies are observed for both smooth and rough substrates, yet interestingly, the trends are inverted. This inversion of the size dependence of the wetting angle is discussed on the basis of the triple line pinning phenomenon, Wenzel's wetting model, and the consumption of Sn by a solder reaction. Quantitative models are proposed, with which size dependencies on rough and smooth surfaces can be better understood. Triple line pinning barrier energies are calculated. Larger pinning barriers are determined for rougher substrates.

Open Problems in Wetting Phenomena: Pinning Retention Forces

We review existing explanations for drop pinning and the origin of the force required to initiate the sliding of a drop on a solid surface (depinning). Theories that describe these phenomena include de Gennes', Marmur's, Furmidge's, the related Furmidge-Extrand's, and Tadmor's theory. These theories are all well cited but generally do not address each other, and usually papers that cite one of them ignore the others. Here, we discuss the advantages and disadvantages of these theories and their applicability to different experimental systems. Thus, we link different experimental systems to the theories that describe them best. We describe the force laws that can be deduced should these theories be united and the major open problems that remain. We describe a physical meaning that can be extracted from retention force measurements, specifically, the interfacial modulus that describes the tendency of a solid to conform to the liquid. This has implications for various wetting phenomena such as adhesion robustness, drug penetration into biological tissues, and solid robustness/resilience versus solid degradation over time as a result of its contact with a liquid.