Nanostructure of Porous Si and Anodic SiO2 Surface Passivation for Improved Efficiency Porous Si Solar Cells

The photovoltaic effect in the anodic formation of silicon dioxide (SiO₂) on porous silicon (PS) surfaces was investigated toward developing a potential passivation technique to achieve high efficiency nanostructured Si solar cells. The PS layers were prepared by electrochemical anodization in hydrofluoric acid (HF) containing electrolyte. An anodic SiO₂ layer was formed on the PS surface via a bottom-up anodization mechanism in HCl/H₂O solution at room temperature. The thickness of the oxide layer for surface passivation was precisely controlled by adjusting the anodizing current density and the passivation time, for optimal oxidation on the PS layer while maintaining its original nanostructure. HRTEM characterization of the microstructure of the PS layer confirms an atomic lattice matching at the PS/Si interface. The dependence of photovoltaic performance, series resistance, and shunt resistance on passivation time was examined. Due to sufficient passivation on the PS surface, a sample with anodization duration of 30 s achieved the best conversion efficiency of 10.7%. The external quantum efficiency (EQE) and internal quantum efficiency (IQE) indicate a significant decrease in reflectivity due to the PS anti-reflection property and indicate superior performance due to SiO₂ surface passivation. In conclusion, the surface of PS solar cells could be successfully passivated by electrochemical anodization.

Low-Load Metal-Assisted Catalytic Etching Produces Scalable Porosity in Si Powders

The recently discovered low-load metal-assisted catalytic etching (LL-MACE) creates nanostructured Si with controllable and variable characteristics that distinguish this technique from the conventional high-load variant. LL-MACE employs 150 times less metal catalyst and produces porous Si instead of Si nanowires. In this work, we demonstrate that some of the features of LL-MACE cannot be explained by the present understanding of MACE. With mechanistic insight derived from extensive experimentation, it is demonstrated that (1) the method allows the use of not only Ag, Pd, Pt, and Au as metal catalysts but also Cu and (2) judicious combinations of process parameters such as the type of metal, Si doping levels, and etching temperatures facilitate control over yield (0.065-88%), pore size (3-100 nm), specific surface area (20-310 m²·g^-1), and specific pore volume (0.05-1.05 cm³·g^-1). The porous structure of the product depends on the space-charge layer, which is controlled by the Si doping and the chemical identity of the deposited metal. The porous structure was also dependent on the dynamic structure of the deposited metal. A distinctive comet-like structure of metal nanoparticles was observed after etching with Cu, Ag, Pd, and, in some cases, Pt; this structure consisted of 10-50 nm main particles surrounded by smaller (<5 nm) nanoparticles. With good scalability and precise control of structural properties, LL-MACE facilitates Si applications in photovoltaics, energy storage, biomedicine, and water purification.

Nanostructuring of Si substrates by a metal-assisted chemical etching and dewetting process

In this work, we reported on the development of lithography-free technology for the fabrication of nanopatterned Si substrates. The combination of two phenomena, the solid-state dewetting process and metal-assisted wet chemical etching, allowed for fabrication of Si nanocolumns on large areas in a relatively simple way. The process of dewetting the thin metal layer enabled formation of nickel nanoislands, which were used as a shadow mask in the deposition of a catalytic metal pattern. Application of the two-stage dewetting process with the repetition of the metal deposition and annealing step enabled us to obtain a significant increase in the surface coverage ratio and the surface density of the nanoislands. As a catalytic metal, a gold layer was applied in the metal-assisted wet chemical etching process. The obtained columnar nanostructures showed a great verticality and had a high aspect ratio. In the conducted studies, the maximum etching rate (at RT) was higher than 1.2 μm min⁻¹. The etching rate increased with increasing concentration of oxidizing (H₂O₂) and etching (HF) agent, with a tendency to saturate for more concentrated solutions. The etching rate was significantly higher for Si substrates with a crystallographic orientation (115) than for (111), but there was no privileged direction of etching except for the direction vertical to the substrate. With increasing layer thickness of the catalytic metal a decrease in the metal-assisted wet chemical etching process efficiency was observed. The developed technology allows for fabrication of patterned substrates with a wide range of lateral dimension of nanocolumns and their density.

In this work, we reported on the development of lithography-free technology for the fabrication of nanopatterned Si substrates.