Theory and analysis of electrode size optimization for capacitive microfabricated ultrasonic transducers

A Handheld Imaging Probe for Acoustic Angiography With an Ultrawideband Capacitive Micromachined Ultrasonic Transducer (CMUT) Array

This article presents an imaging probe with a 256-element ultrawideband (UWB) 1-D capacitive micromachined ultrasonic transducer (CMUT) array designed for acoustic angiography (AA). This array was fabricated on a borosilicate glass wafer with a reduced bottom electrode and an additional central plate mass to achieve the broad bandwidth. A custom 256-channel handheld probe was designed and implemented with integrated low-noise amplifiers and supporting power circuitry. This probe was used to characterize the UWB CMUT, which has a functional 3-dB frequency band from 3.5 to 23.5 MHz. A mechanical index (MI) of 0.33 was achieved at 3.5 MHz at a depth of 11 mm. These promising measurements are then combined to demonstrate AA. The use of alternate amplitude modulation (aAM) combined with a frequency analysis of the measured transmit signal demonstrates the suitability of the UWB CMUT for AA. This is achieved by measuring only a low level of unwanted high-frequency harmonics in both the transmit signal and the reconstructed image in the areas other than the contrast bubbles.

Applications of Capacitive Micromachined Ultrasonic Transducers: A Comprehensive Review

Capacitive micromachined ultrasonic transducer (CMUT) was introduced as an alternative to the piezoelectric thick-film-based transducers in medical imaging applications. Gradually, CMUTs have been investigated in almost all the applications in acoustics due to their superior transduction properties. CMOS compatible process flow and limitless possibilities of miniaturization made CMUT a preferred choice for the ultrasound industry. This article comprehensively reviews all the applications in which CMUT was used until now. Such a complete review of the practical applications of CMUT has not been reported elsewhere. A topicwise presentation approach is adopted, and wherever possible, the necessary details of the device properties and experimental niceties were briefly covered.

A Review on Analytical Modeling for Collapse Mode Capacitive Micromachined Ultrasonic Transducer of the Collapse Voltage and the Static Membrane Deflections

Analytical modeling of capacitive micromachined ultrasonic transducer (CMUT) is one of the commonly used modeling methods and has the advantages of intuitive understanding of the physics of CMUTs and convergent when modeling of collapse mode CMUT. This review article summarizes analytical modeling of the collapse voltage and shows that the collapse voltage of a CMUT correlates with the effective gap height and the electrode area. There are analytical expressions for the collapse voltage. Modeling of the membrane deflections are characterized by governing equations from Timoshenko, von Kármán equations and the 2D plate equation, and solved by various methods such as Galerkin’s method and perturbation method. Analytical expressions from Timoshenko’s equation can be used for small deflections, while analytical expression from von Kármán equations can be used for both small and large deflections.

CMUT-Based Sensor for Acoustic Emission Application: Experimental and Theoretical Contributions to Sensitivity Optimization

The paper deals with a capacitive micromachined ultrasonic transducer (CMUT)-based sensor dedicated to the detection of acoustic emissions from damaged structures. This work aims to explore different ways to improve the signal-to-noise ratio and the sensitivity of such sensors focusing on the design and packaging of the sensor, electrical connections, signal processing, coupling conditions, design of the elementary cells and operating conditions. In the first part, the CMUT-R100 sensor prototype is presented and electromechanically characterized. It is mainly composed of a CMUT-chip manufactured using the MUMPS process, including 40 circular 100 µm radius cells and covering a frequency band from 310 kHz to 420 kHz, and work on the packaging, electrical connections and signal processing allowed the signal-to-noise ratio to be increased from 17 dB to 37 dB. In the second part, the sensitivity of the sensor is studied by considering two contributions: the acoustic-mechanical one is dependent on the coupling conditions of the layered sensor structure and the mechanical-electrical one is dependent on the conversion of the mechanical vibration to electrical charges. The acoustic-mechanical sensitivity is experimentally and numerically addressed highlighting the care to be taken in implementation of the silicon chip in the brass housing. Insertion losses of about 50% are experimentally observed on an acoustic test between unpackaged and packaged silicon chip configurations. The mechanical-electrical sensitivity is analytically described leading to a closed-form amplitude of the detected signal under dynamic excitation. Thus, the influence of geometrical parameters, material properties and operating conditions on sensitivity enhancement is clearly established: such as smaller electrostatic air gap, and larger thickness, Young's modulus and DC bias voltage.

PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications

This article presents a new wafer-bonding fabrication technique for Capacitive Micromachined Ultrasonic Transducers (CMUTs) using polymethyl methacrylate (PMMA). The PMMA-based single-mask and single-dry-etch step-bonding device is much simpler, and reduces process steps and cost as compared to other wafer-bonding methods and sacrificial-layer processes. A low-temperature (<180∘C) bonding process was carried out in a purpose-built bonding tool to minimize the involvement of expensive laboratory equipment. A single-element CMUT comprising 16 cells of 2.5 mm radius and 800 nm cavity was fabricated. The center frequency of the device was set to 200 kHz for underwater communication purposes. Characterization of the device was carried out in immersion, and results were subsequently validated with data from Finite Element Analysis (FEA). Results show the feasibility of the fabricated CMUTs as receivers for underwater applications.

Fabrication and testing of polymer-based capacitive micromachined ultrasound transducers for medical imaging

The ultrasonic transducer industry is dominated by piezoelectric materials. As an emerging alternative, capacitive micromachined ultrasound transducers (CMUTs) offer wider bandwidth, better integration with electronics, and ease of fabricating large arrays. CMUTs have a sealed cavity between a fixed electrode and a suspended metalized membrane. Manufacturing cost and sensitivity are limiting factors in current CMUTs that depend on the fabrication equipment and, especially, on the materials used. For widespread use of CMUTs, a much lower fabrication cost that uses inexpensive materials, which maintain or improve upon existing sensitivity, is needed. Herein, a new fabrication process is described for polymer-based CMUTs (polyCMUTs) using the photopolymer SU-8 and Omnicoat. The first ultrasound B-mode image of a wire phantom created with a 64-element linear array using synthetic aperture beamforming techniques is presented. A 12 V _AC signal superimposed on a 10 V_DC signal was used on the transmission side, and only a bias-tee, with no amplifiers, was used on the receiving side. The low operational voltage and high sensitivity of this device can be partially attributed to a pre-biasing condition on the membrane. By using a novel sacrificial layer combined with a top electrode embedded inside the membrane, we demonstrated that SU-8 can be used to manufacture CMUTs inexpensively. Moreover, the fabrication used relatively simple equipment, and the number of fabrication steps was reduced compared to traditional CMUT fabrication. This new fabrication process has the potential to increase the use of CMUTs in the ultrasound market, including the market for wearable transducers.

Unbiased Charged Circular CMUT Microphone: Lumped-Element Modeling and Performance

An energy-consistent lumped-element equivalent circuit model for charged circular capacitive micromachined ultrasonic transducer (CMUT) cell is derived and presented. It is analytically shown and experimentally verified that a series dc voltage source at the electrical terminals is sufficient to model the charging in CMUT. A model-based method for determining this potential from impedance measurements at low bias voltages is presented. The model is validated experimentally using an airborne CMUT, which resonates at 103 kHz. Impedance measurements, reception measurements at resonance and off-resonance, and the transient response of the CMUT are compared with the model predictions.

Capacitive micromachined ultrasonic transducers based on annular cell geometry for air-coupled applications

A novel design of an air-coupled capacitive micromachined ultrasonic transducer (CMUT) with annular cell geometry (annular CMUT) is proposed. Finite element analysis shows that an annular cell has a ratio of average-to-maximum displacement (RAMD) of 0.52-0.58 which is 58-76% higher than that of a conventional circular cell. The increased RAMD leads to a larger volume displacement which results in a 48.4% improved transmit sensitivity and 127.3% improved power intensity. Single-cell annular CMUTs were fabricated with 20-μm silicon plates on 13.7-μm deep and 1.35-mm wide annular cavities using the wafer bonding technique. The measured RAMD of the fabricated CMUTs is 0.54. The resonance frequency was measured to be 94.5kHz at 170-V DC bias. The transmit sensitivity was measured to be 33.83Pa/V and 25.85Pa/V when the CMUT was excited by a continuous wave and a 20-cycle burst, respectively. The receive sensitivity at 170-V DC bias was measured to be 7.7mV/Pa for a 20-cycle burst, and 15.0mV/Pa for a continuous incident wave. The proposed annular CMUT design demonstrates a significant improvement in transmit efficiency, which is an important parameter for air-coupled ultrasonic transducers.

Capacitive Micromachined Ultrasonic Transducers (CMUTs) for Underwater Imaging Applications

A capacitive micromachined ultrasonic transducer structure for use in underwater imaging is designed, fabricated and tested in this paper. In this structure, a silicon dioxide insulation layer is inserted between the top electrodes and the vibration membrane to prevent ohmic contact. The capacitance-voltage (C-V) characteristic curve shows that the transducer offers suitable levels of hysteresis and repeatability performance. The -6 dB center frequency is 540 kHz and the transducer has a bandwidth of 840 kHz for a relative bandwidth of 155%. Underwater pressure of 143.43 Pa is achieved 1 m away from the capacitive micromachined ultrasonic transducer under 20 Vpp excitation. Two-dimensional underwater ultrasonic imaging, which is able to prove that a rectangular object is present underwater, is achieved. The results presented here indicate that our work will be highly beneficial for the establishment of an underwater ultrasonic imaging system.

Review of air-coupled ultrasonic materials characterization

This article presents a review of air-coupled ultrasonics employed in the characterization or nondestructive inspection of industrial materials. Developments in air-coupled transduction and electronics are briefly treated, although the emphasis here is on methods of characterization and inspection, and in overcoming limitations inherent in the use of such a tenuous sound coupling medium as air. The role of Lamb waves in plate characterization is covered, including the use of air-coupled acoustic beams to measure the elastic and/or viscoelastic properties of a material. Air-coupled acoustic detection, when other methods are employed to generate high-amplitude sound beams is also reviewed. Applications to civil engineering, acoustic tomography, and the characterization of both paper and wood are dealt with here. A brief summary of developments in air-coupled acoustic arrays and the application of air-coupled methods in nonlinear ultrasonics complete the review. In particular, the work of Professor Bernard Hosten and his collaborators at Bordeaux is carefully examined.

Optimization of electrode size for aluminum-nitride matrix ultrasonic transducers in the frequency range above 200 MHz

This paper describes an optimization method of the top electrode size for a thin film matrix ultrasonic transducer (M-UT) in the frequency range above 200 MHz. The goal of this work is to design an optimal top electrode size for an M-UT providing the maximal output peak-peak voltage (V(PP)) and the maximal signal-to-noise ratio (SNR) without additional electrical impedance matching. In order to reduce the complexity of the M-UT with more than 1000 elements, an intrinsic matching by electrode size variation is necessary. However, the size of a single element top electrode for an M-UT is related to the number of elements within a targeted sensor area, V(PP) and SNR of the transducer. In this paper, varying the active area of the top electrode from 0.09 to 25 mm(2) shows that for an Al-AlN-Al on silicon wafer configuration connected with a JSR Ultrasonics pulser/receiver (50 ohms), the optimal electrode size is 1 mm(2). With the optimal size electrode, the maximum output V(PP) of 0.08 V and the SNR of 42.93 dB are achieved at the resonance frequency of 225 MHz, and the bandwidth is 16.21 MHz.

High-power CMUTs: design and experimental verification

Capacitive micromachined ultrasonic transducers (CMUTs) have great potential to compete with piezoelectric transducers in high-power applications. As the output pressures increase, nonlinearity of CMUT must be reconsidered and optimization is required to reduce harmonic distortions. In this paper, we describe a design approach in which uncollapsed CMUT array elements are sized so as to operate at the maximum radiation impedance and have gap heights such that the generated electrostatic force can sustain a plate displacement with full swing at the given drive amplitude. The proposed design enables high output pressures and low harmonic distortions at the output. An equivalent circuit model of the array is used that accurately simulates the uncollapsed mode of operation. The model facilities the design of CMUT parameters for high-pressure output, without the intensive need for computationally involved FEM tools. The optimized design requires a relatively thick plate compared with a conventional CMUT plate. Thus, we used a silicon wafer as the CMUT plate. The fabrication process involves an anodic bonding process for bonding the silicon plate with the glass substrate. To eliminate the bias voltage, which may cause charging problems, the CMUT array is driven with large continuous wave signals at half of the resonant frequency. The fabricated arrays are tested in an oil tank by applying a 125-V peak 5-cycle burst sinusoidal signal at 1.44 MHz. The applied voltage is increased until the plate is about to touch the bottom electrode to get the maximum peak displacement. The observed pressure is about 1.8 MPa with -28 dBc second harmonic at the surface of the array.

Radiation impedance of collapsed capacitive micromachined ultrasonic transducers

The radiation impedance of a capacitive micromachined ultrasonic transducer (CMUT) array is a critical parameter to achieve high performance. In this paper, we present a calculation of the radiation impedance of collapsed, clamped, circular CMUTs both analytically and using finite element method (FEM) simulations. First, we model the radiation impedance of a single collapsed CMUT cell analytically by expressing its velocity profile as a linear combination of special functions for which the generated pressures are known. For an array of collapsed CMUT cells, the mutual impedance between the cells is also taken into account. The radiation impedances for arrays of 7, 19, 37, and 61 circular collapsed CMUT cells for different contact radii are calculated both analytically and by FEM simulations. The radiation resistance of an array reaches a plateau and maintains this level for a wide frequency range. The variation of radiation reactance with respect to frequency indicates an inductance-like behavior in the same frequency range. We find that the peak radiation resistance value is reached at higher kd values in the collapsed case as compared with the uncollapsed case, where k is the wavenumber and d is the center-to-center distance between two neighboring CMUT cells.

Deep-collapse operation of capacitive micromachined ultrasonic transducers

Capacitive micromachined ultrasonic transducers (CMUTs) have been introduced as a promising technology for ultrasound imaging and therapeutic ultrasound applications which require high transmitted pressures for increased penetration, high signal-to-noise ratio, and fast heating. However, output power limitation of CMUTs compared with piezoelectrics has been a major drawback. In this work, we show that the output pressure of CMUTs can be significantly increased by deep-collapse operation, which utilizes an electrical pulse excitation much higher than the collapse voltage. We extend the analyses made for CMUTs working in the conventional (uncollapsed) region to the collapsed region and experimentally verify the findings. The static deflection profile of a collapsed membrane is calculated by an analytical approach within 0.6% error when compared with static, electromechanical finite element method (FEM) simulations. The electrical and mechanical restoring forces acting on a collapsed membrane are calculated. It is demonstrated that the stored mechanical energy and the electrical energy increase nonlinearly with increasing pulse amplitude if the membrane has a full-coverage top electrode. Utilizing higher restoring and electrical forces in the deep-collapsed region, we measure 3.5 MPa peak-to-peak pressure centered at 6.8 MHz with a 106% fractional bandwidth at the surface of the transducer with a collapse voltage of 35 V, when the pulse amplitude is 160 V. The experimental results are verified using transient FEM simulations.

Capacitive micromachined ultrasonic transducers for medical imaging and therapy

Capacitive micromachined ultrasonic transducers (CMUTs) have been subject to extensive research for the last two decades. Although they were initially developed for air-coupled applications, today their main application space is medical imaging and therapy. This paper first presents a brief description of CMUTs, their basic structure, and operating principles. Our progression of developing several generations of fabrication processes is discussed with an emphasis on the advantages and disadvantages of each process. Monolithic and hybrid approaches for integrating CMUTs with supporting integrated circuits are surveyed. Several prototype transducer arrays with integrated frontend electronic circuits we developed and their use for 2-D and 3-D, anatomical and functional imaging, and ablative therapies are described. The presented results prove the CMUT as a MEMS technology for many medical diagnostic and therapeutic applications.

Radiation impedance of an array of circular capacitive micromachined ultrasonic transducers

The radiation impedance of a capacitive micromachined ultrasonic transducer (cMUT) with a circular membrane is calculated analytically using its velocity profile for the frequencies up to its parallel resonance frequency for both the immersion and the airborne applications. The results are verified by finite element simulations. The work is extended to calculate the radiation impedance of an array of cMUT cells positioned in a hexagonal pattern. A higher radiation resistance improves the bandwidth as well as the efficiency of the cMUT. The radiation resistance is determined to be a strong function of the cell spacing. It is shown that a center-to-center cell spacing of 1.25 wavelengths maximizes the radiation resistance, if the membranes are not too thin. It is also found that excitation of nonsymmetric modes may reduce the radiation resistance in immersion applications.

Fabricating capacitive micromachined ultrasonic transducers with a novel silicon-nitride-based wafer bonding process

We report the fabrication and experimental testing of 1-D 23-element capacitive micromachined ultrasonic transducer (CMUT) arrays that have been fabricated using a novel wafer-bonding process whereby the membrane and the insulation layer are both silicon nitride. The membrane and cell cavities are deposited and patterned on separate wafers and fusion-bonded in a vacuum environment to create CMUT cells. A user-grown silicon-nitride membrane layer avoids the need for expensive silicon-on-insulator (SOI) wafers, reduces parasitic capacitance, and reduces dielectric charging. It allows more freedom in selecting the membrane thickness while also providing the benefits of wafer-bonding fabrication such as excellent fill factor, ease of vacuum sealing, and a simplified fabrication process when compared with the more standard sacrificial release process. The devices fabricated have a cell diameter of 22 microm, a membrane thickness of 400 nm, a gap depth of 150 nm, and an insulation thickness of 250 nm. The resonant frequency of the CMUT in air is 17 MHz and has an attenuation compensated center frequency of approximately 9 MHz in immersion with a -6 dB fractional bandwidth of 123%. This paper presents the fabrication process and some characterization results.

Parametric linear modeling of circular cMUT membranes in vacuum

We present a lumped element parametric model for the clamped circular membrane of a capacitive micromachined ultrasonic transducer (cMUT). The model incorporates an electrical port and two sets of acoustic ports, through which the cMUT couples to the medium. The modeling approach is based on matching a lumped element model and the mechanical impedance of the cMUT membrane at the resonance frequencies in vacuum. Very good agreement between finite element simulation results and model impedance is obtained. Equivalent circuit model parameters can be found from material properties and membrane dimensions without a need for finite element simulation.

Comparison of conventional and collapsed region operation of capacitive micromachined ultrasonic transducers

We report experimental results from a comparative study on collapsed region and conventional region operation of capacitive micromachined ultrasonic transducers (CMUTs) fabricated with a wafer bonding technique. Using ultrasonic pulse-echo and pitch-catch measurements, we characterized single elements of 1-D CMUT arrays operating in oil. The experimental results from this study agreed with the simulation results: a CMUT operating in the collapsed region produced a higher maximum output pressure than a CMUT operated in the conventional region at 90% of its collapse voltage (3 kPa/V vs. 16.1 kPa/V at 2.3 MHz). While the pulse-echo fractional bandwidth (126%) was higher in the collapsed region operation than in the conventional operation (117%), the pulse-echo amplitude in collapsed region operation was 11 dB higher than in conventional region operation. Furthermore, within the range of tested bias voltages, the output pressure monotonously increased with increased bias during collapsed region operation. It was also found that in the conventional mode, short AC pulses (larger than the collapse voltage) could be applied without collapsing the membranes. Finally, while no significant difference was observed in reflectivity of the CMUT face between the two regions of operation, hysteretic behavior of the devices was identified in the collapsed region operation.

CMUTS with dual-electrode structure for improved transmit and receive performance

In this paper, we introduce capacitive micro-machined ultrasonic transducers (CMUTs) with electrically isolated multiple electrodes embedded in the same silicon nitride CMUT membrane. Some of the advantages of this structure are demonstrated using a dual-electrode CMUT with separate transmit and receive electrodes as an example. By locating the transmit electrodes near the edges of a rectangular CMUT membrane, the stable displacement range, hence the maximum pressure amplitude during transmit mode is increased without collapsing the membrane when operated within static collapse voltage range. In the receive mode, the center receive electrode is brought closer to the substrate by biasing the side electrodes, and a higher electromechanical transformer ratio is obtained at low direct current (DC) bias. Therefore, dual-electrode CMUT has an effectively larger gap as compared to conventional CMUT during transmit, and it has an effectively smaller gap during receive. Demonstrative experiments are performed on dual-electrode CMUTs with rectangular membranes with different side and center electrode sizes for transmit and receive measurements. By using the two 4-microm wide side electrodes and an 8-microm wide center electrode on a 20-microm wide membrane, a 6.8 dB increase in maximum output pressure is obtained with side electrode excitation as compared to conventional center electrode. Similarly, the receive performance improvement was demonstrated while reducing the DC bias requirements. Simple finite-element and equivalent circuit-based models were developed to successfully model the behavior of dual-electrode CMUTs. Simulations show that, with simple modifications, more than 10 dB overall sensitivity improvement is feasible with dual-electrode CMUTs with rectangular membranes.

Dynamic analysis of capacitive micromachined ultrasonic transducers

Electrostatic transducers are usually operated under a DC bias below their collapse voltage. The same scheme has been adopted for capacitive micromachined ultrasonic transducers (cMUTs). DC bias deflects the cMUT membranes toward the substrate, so that their centers are free to move during both receive and transmit operations. In this paper, we present time-domain, finite element calculations for cMUTs using LS-DYNA, a commercially available finite element package. In addition to this DC bias mode, other new cMUT operations (collapse and collapse-snapback) have recently been demonstrated. Because cMUT membranes make contact with the substrate in these new operations, modeling of these cMUTs should include contact analysis. Our model was a cMUT transducer consisting of many hexagonal membranes; because it was symmetrical, we modeled only one-sixth of a hexagonal cell loaded with a fluid medium. The finite element results for both conventional and collapse modes were compared to measurements made by an optical interferometer; a good match was observed. Thus, the model is useful for designing cMUTs that operate in regimes where membranes make contact with the substrate.

Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays

Integration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMUT element, we developed an electrical CMUT model with parameters derived through finite element analysis, and performed both the pre- and postlayout verification. An experimental chip consisting of 4 X 4 array of the designed circuit cells, each cell occupying a 200 X 200 microm2 area, was formed for the initial test studies and scheduled for fabrication in 0.8 microm, 50 V CMOS technology. The designed circuit is suitable for integration with CMUT arrays through flip-chip bonding and the CMUT-on-CMOS process.

Finite-element analysis of capacitive micromachined ultrasonic transducers

In this paper, we present the results of finite-element analysis performed to investigate capacitive micromachined ultrasonic transducers (CMUTs). Both three-dimensional (3-D) and 2-D models were developed using a commercially available finite-element modeling (FEM) software. Depending on the dimensionality of the model, the membranes were constructed using plane or shell elements. The electrostatic gap was modeled using many parallel plate transducers. An axisymmetric model for a single membrane was built; the electrical input impedance of the device then was calculated in vacuum to investigate series and parallel resonant frequencies, where the input impedance has a minimum and a maximum, respectively. A method for decomposing the membrane capacitance into parasitic and active parts was demonstrated, and it was shown that the parallel resonant frequency shifted down with increased biased voltage. Calculations then were performed for immersion transducers. Acoustic wave propagation was simulated in the immersion medium, using appropriate elements in a 3-D model. Absorbing boundaries were implemented to avoid the reflections at the end of the medium mesh. One row of an array element, modeled with appropriate boundary conditions, was used to calculate the output pressure. The results were compared with a simpler model: a single membrane in immersion, with symmetry boundary conditions on the sidewalls that cause the calculations to reflect the properties of an infinitely large array. A 2-D model then was developed to demonstrate the effect of membrane dimensions on the output pressure and bandwidth. Our calculations revealed that the small signal transmit pressure was inversely proportional to the square root of gap height. We also compared FEM results with analytical and experimental results.

Design, fabrication and characterization of a capacitive micromachined ultrasonic probe for medical imaging

In this paper we report the design, fabrication process, and characterization of a 64-elements capacitive micromachined ultrasonic transducer (cMUT), 3 MHz center frequency, 100% fractional bandwidth. Using this transducer, we developed a linear probe for application in medical echographic imaging. The probe was fully characterized and tested with a commercial echographic scanner to obtain first images from phantoms and in vivo human body. The results, which quickly follow similar results obtained by other researchers, clearly show the great potentiality of this new emerging technology. The cMUT probe works better than the standard piezoelectric probe as far as the axial resolution is concerned, but it suffers from low sensitivity. At present this can be a limit, especially for in depth operation. But we are strongly confident that significant improvements can be obtained in the very near future to overcome this limitation, with a better transducer design, the use of an acoustic lens, and using well matched, front-end electronics between the transducer and the echographic system.

A finite difference model for cMUT devices

A finite difference method was implemented to simulate capacitive micromachined ultrasonic transducers (cMUTs) and compared to models described in the literature such as finite element methods. Similar results were obtained. It was found that one master curve described the clamped capacitance. We introduced normalized capacitance versus normalized bias voltage and metallization rate, independent of layer thickness, gap height, and size membrane, leading to the determination of a coupling factor master curve. We present here calculations and measurements of electrical impedance for cMUTs. An electromechanical equivalent circuit was used to perform simulations. Our experimental measurements confirmed the theoretical results in terms of resonance, anti-resonance frequencies, clamped capacitance, and electromechanical coupling factor. Due to inhomogeneity of the tested element array and strong parasitic capacitance between cells, the maximum coupling coefficient value achieved was 0.27. Good agreement with theory was obtained for all findings.

Linear and nonlinear equivalent circuit modeling of CMUTs

Using piston radiator and plate capacitance theory capacitive micromachined ultrasound transducers (CMUT) membrane cells can be described by one-dimensional (1-D) model parameters. This paper describes in detail a new method, which derives a 1-D model for CMUT arrays from finite-element methods (FEM) simulations. A few static and harmonic FEM analyses of a single CMUT membrane cell are sufficient to derive the mechanical and electrical parameters of an equivalent piston as the moving part of the cell area. For an array of parallel-driven cells, the acoustic parameters are derived as a complex mechanical fluid impedance, depending on the membrane shape form. As a main advantage, the nonlinear behavior of the CMUT can be investigated much easier and faster compared to FEM simulations, e.g., for a design of the maximum applicable voltage depending on the input signal. The 1-D parameter model allows an easy description of the CMUT behavior in air and fluids and simplifies the investigation of wave propagation within the connecting fluid represented by FEM or transmission line matrix (TLM) models.

Capacitive micromachined ultrasonic transducers: fabrication technology

Capacitive micromachined ultrasonic transducer (cMUT) technology is a prime candidate for next generation imaging systems. Medical and underwater imaging and the nondestructive evaluation (NDE) societies have expressed growing interest in cMUTs over the years. Capacitive micromachined ultrasonic transducer technology is expected to make a strong impact on imaging technologies, especially volumetric imaging, and to appear in commercial products in the near future. This paper focuses on fabrication technologies for cMUTs and reviews and compares variations in the production processes. We have developed two main approaches to the fabrication of cMUTs: the sacrificial release process and the recently introduced wafer-bonding method. This paper gives a thorough review of the sacrificial release processes, and it describes the new wafer-bonding method in detail. Process variations are compared qualitatively and quantitatively whenever possible. Through these comparisons, it was concluded that wafer-bonded cMUT technology was superior in terms of process control, yield, and uniformity. Because the number of steps and consequent process time were reduced (from six-mask process to four-mask process), turn-around time was improved significantly.

Optimization of the gain-bandwidth product of capacitive micromachined ultrasonic transducers

Capacitive micromachined ultrasonic transducers (cMUT) have large bandwidths, but they typically have low conversion efficiencies. This paper defines a performance measure in the form of a gain-bandwidth product and investigates the conditions in which this performance measure is maximized. A Mason model corrected with finite-element simulations is used for the purpose of optimizing parameters. There are different performance measures for transducers operating in transmit, receive, or pulse-echo modes. Basic parameters of the transducer are optimized for those operating modes. Optimized values for a cMUT with silicon nitride membrane and immersed in water are given. The effect of including an electrical matching network is considered. In particular, the effect of a shunt inductor in the gain-bandwidth product is investigated. Design tools are introduced, which are used to determine optimal dimensions of cMUTs with the specified frequency or gain response.

Capacitive micromachined ultrasonic transducer design for high power transmission

Capacitive micromachined ultrasonic transducers (cMUTs) were developed to meet the demands of the ultrasonic industry. To achieve maximum efficiency, the conventional operation of the cMUT requires a bias voltage close to the collapse voltage. Total acoustic output pressure is limited by the efficiency of the cMUT and the maximum-allowed pulse voltage on the membrane. In this paper, we propose the collapse-snapback operation of the cMUT: the membrane is collapsed onto the substrate in the collapsing cycle, and released in the snapback cycle. The collapse-snapback operation overcomes the above-mentioned limitations of the conventional operation. The collapse-snapback operation utilizes a larger range of membrane deflection profiles (both collapsed and released profiles) and generates higher acoustic output pressures. The static finite element calculations were performed to design cMUTs with specific collapse and snapback voltages by changing the electrode parameters (radius (re), position (de), and thickness (te)). These designs were refined for optimum average displacement per cycle. An electrode radius greater than 60% of the membrane radius significantly improved the displacement per volt. Moderately thick membranes (te approximately 0.2 microm) were preferred, as thicker membranes reduced the displacement per volt. Under proper bias conditions, the collapse-snapback operation, designed for high-power transmission, allowed the application of pulse voltages larger than the difference of collapse and snapback voltages. Dynamic finite element calculations of an infinite cMUT array on the substrate loaded with acoustic fluid medium were performed to determine the dynamic response of the cMUT. Commercially available FEM packages ANSYS and LS-DYNA were used for static and dynamic calculations, respectively. The cMUTs were fabricated for optimal performance in the collapse-snapback operation. The transmit experiments were performed on a 2-D cMUT array using a calibrated hydrophone. Taking into account the attenuation and diffraction losses, the pressure on the cMUT surface was extracted. The cMUT generated 0.47 MPa (6 kPa/V) and 1.04 MPa (11 kPa/V) in the conventional and collapse-snapback operations, respectively. Therefore, collapse-snapback operation of the cMUTs was superior for high-power transmission.

Precompensated excitation waveforms to suppress harmonic generation in MEMS electrostatic transducers

Microelectromechanical systems (MEMS) electrostatic-based transducers inherently produce harmonics as the electrostatic force generated in the transmit mode is approximately proportional to the square of the applied voltage signal. This characteristic precludes them from being effectively used for harmonic imaging (either with or without the addition of microbubble-based contrast agents). The harmonic signal that is nonlinearly generated by tissue (or contrast agent) cannot be distinguished from the inherent transmitted harmonic signal. We investigated two precompensation methods to cancel this inherent harmonic generation in electrostatic transducers. A combination of finite element analysis (FEA) and experimental results are presented. The first approach relies on a calculation, or measurement, of the transducer's linear transfer function, which is valid for small signal levels. Using this transfer function and a measurement of the undesired harmonic signal, a predistorted transmit signal was calculated to cancel the harmonic inherently generated by the transducer. Due to the lack of perfect linearity, the approach does hot work completely in a single iteration. However, with subsequent iterations, the problem becomes more linear and converges toward a very satisfactory result (a 18.6 dB harmonic reduction was achieved in FEA simulations and a 20.7 dB reduction was measured in a prototype experiment). The second approach tested involves defining a desired function [including a direct current (DC) offset], then taking the square root of this function to determine the shape of the required input function. A 5.5 dB reduction of transmitted harmonic was obtained in both FEA simulation and experimental prototypes test.

The effects of membrane metallization in capacitive microfabricated ultrasonic transducers

The mechanical effects of the metal layer on the membranes of capacitive micromachined ultrasonic transducers (CMUTs) are analyzed in this paper by means of finite element simulations. The influence of electrode size and thickness on the electrostatic behavior of the single CMUT cell, including diaphragm displacement, cell capacitance, and collapse voltage, is explored. The effect on device sensitivity is investigated through the transformation factor of the cell, that is computed by FEM and compared with the parallel plate model prediction. It is found that for a non-negligible electrode thickness, as in the majority of fabricated devices, both the static and dynamic performance of the cell can be affected in a significant way. Thus, the effects of membrane metallization must be taken into account in CMUT design and optimization.

Capacitive micromachined ultrasonic Lamb wave transducers using rectangular membranes

This paper details the theory, fabrication, and characterization of a new Lamb wave device. Built using capacitive micromachined ultrasonic transducers (CMUTs), the structure described uses rectangular membranes to excite and receive Lamb waves on a silicon substrate. An equivalent circuit model for the transducer is proposed that produces results, which match well with those observed by experiment. During the derivation of this model, emphasis is placed on the resistance presented to the transducer membranes by the Lamb wave modes. Finite element analysis performed in this effort shows that the dominant propagating mode in the device is the lowest order antisymmetric flexural wave (A0). Furthermore, most of the power that couples into the Lamb wave is due to energy in the vibrating membrane that is transferred to the substrate through the supporting posts of the device. The manufacturing process of the structure, which relies solely on fundamental IC-fabrication techniques, is also discussed. The resulting device has an 18-microm-thick substrate that is almost entirely made up of crystalline silicon and operates at a frequency of 2.1 MHz. The characterization of this device includes S-parameter and laser vibrometer measurements as well as delay-line transmission data. The insertion loss, as determined by both S-parameter and delay-line transmission measurements, is 20 dB at 2.1 MHz. When configured as a delay-line oscillator, the device functions well as a sensor with sensitivity to changes in the mass loading of its substrate.

A new regime for operating capacitive micromachined ultrasonic transducers

We report on a new operation regime for capacitive micromachined ultrasonic transducers (cMUTs). Traditionally, cMUTs are operated at a bias voltage lower than the collapse voltage of their membranes. In the new proposed operation regime, first the cMUT is biased past the collapse voltage. Second, the bias voltage applied to the collapsed membrane is reduced without releasing the membrane. Third, the cMUT is excited with an ac signal at the bias point, keeping the total applied voltage between the collapse and snapback voltages. In this operation regime, the center of the membrane is always in contact with the substrate. Our finite element methods (FEM) calculations reveal that a cMUT operating in this new regime, between collapse and snapback voltages, possesses a coupling efficiency (k(T)2) higher than a cMUT operating in the conventional regime below its collapse voltage. This paper compares the simulation results of the coupling efficiencies of cMUTs operating in conventional and new operation regimes.

Calculation and measurement of electromechanical coupling coefficient of capacitive micromachined ultrasonic transducers

The electromechanical coupling coefficient is an important figure of merit of ultrasonic transducers. The transducer bandwidth is determined by the electromechanical coupling efficiency. The coupling coefficient is, by definition, the ratio of delivered mechanical energy to the stored total energy in the transducer. In this paper, we present the calculation and measurement of coupling coefficient for capacitive micromachined ultrasonic transducers (CMUTs). The finite element method (FEM) is used for our calculations, and the FEM results are compared with the analytical results obtained with parallel plate approximation. The effect of series and parallel capacitances in the CMUT also is investigated. The FEM calculations of the CMUT indicate that the electromechanical coupling coefficient is independent of any series capacitance that may exist in the structure. The series capacitance, however, alters the collapse voltage of the membrane. The parallel parasitic capacitance that may exist in a CMUT or is external to the transducer reduces the coupling coefficient at a given bias voltage. At the collapse, regardless of the parasitics, the coupling coefficient reaches unity. Our experimental measurements confirm a coupling coefficient of 0.85 before collapse, and measurements are in agreement with theory.

Electromechanical coupling factor of capacitive micromachined ultrasonic transducers

Recently, a linear, analytical distributed model for capacitive micromachined ultrasonic transducers (CMUTs) was presented, and an electromechanical equivalent circuit based on the theory reported was used to describe the behavior of the transducer [IEEE Trans. Ultrason. Ferroelectr. Freq. Control 49, 159-168 (2002)]. The distributed model is applied here to calculate the dynamic coupling factor k(w) of a lossless CMUT, based on a definition that involves the energies stored in a dynamic vibration cycle, and the results are compared with those obtained with a lumped model. A strong discrepancy is found between the two models as the bias voltage increases. The lumped model predicts an increasing dynamic k factor up to unity, whereas the distributed model predicts a more realistic saturation of this parameter to values substantially lower. It is demonstrated that the maximum value of k(w), corresponding to an operating point close to the diaphragm collapse, is 0.4 for a CMUT single cell with a circular membrane diaphragm and no parasitic capacitance (0.36 for a cell with a circular plate diaphragm). This means that the dynamic coupling factor of a CMUT is comparable to that of a piezoceramic plate oscillating in the thickness mode. Parasitic capacitance decreases the value of k(w), because it does not contribute to the energy conversion. The effective coupling factor k(eff) is also investigated, showing that this parameter coincides with k(w) within the lumped model approximation, but a quite different result is obtained if a computation is made with the more accurate distributed model. As a consequence, k(eff), which can be measured from the transducer electrical impedance, does not give a reliable value of the actual dynamic coupling factor.

Capacitive micromachined ultrasonic transducers: next-generation arrays for acoustic imaging?

Piezoelectric materials have dominated the ultrasonic transducer technology. Recently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as an alternative technology offering advantages such as wide bandwidth, ease of fabricating large arrays, and potential for integration with electronics. The aim of this paper is to demonstrate the viability of CMUTs for ultrasound imaging. We present the first pulse-echo phased array B-scan sector images using a 128-element, one-dimensional (1-D) linear CMUT array. We fabricated 64- and 128-element 1-D CMUT arrays with 100% yield and uniform element response across the arrays. These arrays have been operated in immersion with no failure or degradation in performance over the time. For imaging experiments, we built a resolution test phantom roughly mimicking the attenuation properties of soft tissue. We used a PC-based experimental system, including custom-designed electronic circuits to acquire the complete set of 128 x 128 RF A-scans from all transmit-receive element combinations. We obtained the pulse-echo frequency response by analyzing the echo signals from wire targets. These echo signals presented an 80% fractional bandwidth around 3 MHz, including the effect of attenuation in the propagating medium. We reconstructed the B-scan images with a sector angle of 90 degrees and an image depth of 210 mm through offline processing by using RF beamforming and synthetic phased array approaches. The measured 6-dB lateral and axial resolutions at 135 mm depth were 0.0144 radians and 0.3 mm, respectively. The electronic noise floor of the image was more than 50 dB below the maximum mainlobe magnitude. We also performed preliminary investigations on the effects of crosstalk among array elements on the image quality. In the near field, some artifacts were observable extending out from the array to a depth of 2 cm. A tail also was observed in the point spread function (PSF) in the axial direction, indicating the existence of crosstalk. The relative amplitude of this tail with respect to the mainlobe was less than -20 dB.