Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices

Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer

In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm² chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.

Dipping Process Characteristics Based on Image Processing of Pictures Captured by High-speed Cameras

The dipping process was recorded firstly by high-speed camera system; acceleration time, speed, and dipping time were set by the control system of dipping bed, respectively. By image processing of dipping process based on Otsu's method, it was found that low-viscosity flux glue eliminates the micelle effectively, very low speed also leads to small micelle hidden between the bumps, and this small micelle and hidden phenomenon disappeared when the speed is ≥0.2 cm s^-1. Dipping flux quantity of the bump decreases by about 100 square pixels when flux viscosity is reduced from 4,500 to 3,500 mpa s. For the 3,500 mpa s viscosity glue, dipping flux quantity increases with the increase of the speed and decreases with the increase of the speed after the speed is up to 0.8 cm s^-1. The stable time of dipping glue can be obtained by real-time curve of dipping flux quantity and is only 80-90 ms when dipping speed is from 1.6 to 4.0 cm s^-1. Dipping flux quantity has an increasing trend for acceleration time and has a decreasing trend for acceleration. Dipping flux quantity increases with the increase of dipping time, and is becoming saturated when the time is ≥55 ms.

Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS Devices

We report here a successful demonstration of a flip-chip packaging approach for a microelectromechanical systems (MEMS) device with in-plane movable microelectrodes implanted in a rodent brain. The flip-chip processes were carried out using a custom-made apparatus that was capable of the following: 1) creating Ag epoxy microbumps for first-level interconnect; 2) aligning the die and the glass substrate; and 3) creating non-hermetic encapsulation (NHE). The completed flip-chip package had an assembled weight of only 0.5 g significantly less than the previously designed wire-bonded package of 4.5 g. The resistance of the Ag bumps was found to be negligible. The MEMS micro-electrodes were successfully tested for its mechanical movement with microactuators generating forces of 450 μN with a displacement resolution of 8.8 μm/step. An NHE on the front edge of the package was created by patterns of hydrophobic silicone microstructures to prevent contamination from cerebrospinal fluid while simultaneously allowing the microelectrodes to move in and out of the package boundary. The breakdown pressure of the NHE was found to be 80 cm of water, which is significantly (4.5-11 times) larger than normal human intracranial pressures. Bench top tests and in vivo tests of the MEMS flip-chip packages for up to 75 days showed reliable NHE for potential long-term implantation.