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Jian W, Chen Y, Feng X. 3D Conformal Curvy Electronics: Design, Fabrication, and Application. ACS NANO 2025; 19:15177-15188. [PMID: 40251732 DOI: 10.1021/acsnano.5c03179] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 04/20/2025]
Abstract
Owing to their excellent conformability and functional advantages derived from spatially induced structures, 3D conformal curvy electronics have garnered attention for their emerging applications in biomedical healthcare, soft machines, curvy imagers, etc. In this perspective, the historical evolution of 3D conformal curvy electronics is summarized, with representative examples highlighted and developmental trends outlined. The design strategies of 3D conformal curvy electronics are discussed across materials, structures, interfaces, and conformability assessment. Subsequently, diverse fabrication technologies are reviewed, including direct fabrication, conformal transfer printing, and conformal shape reconfiguration. Afterward, the typical applications of 3D conformal curvy electronics are presented, classified by integration with biological tissues, machines, and function-engineered curvy surfaces. Finally, the existing challenges and potential research directions are provided for further exploration.
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Affiliation(s)
- Wei Jian
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Institute of Flexible Electronics Technology of THU, Zhejiang, Jiaxing 314000, China
| | - Ying Chen
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
- Institute of Flexible Electronics Technology of THU, Zhejiang, Jiaxing 314000, China
| | - Xue Feng
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Institute of Flexible Electronics Technology of THU, Zhejiang, Jiaxing 314000, China
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2
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Ahmad M, Shukla D, Zhu Y, Velev OD. Biodegradable Chitosan-Based Stretchable Electronics with Recyclable Silver Nanowires. ACS APPLIED MATERIALS & INTERFACES 2025; 17:17316-17329. [PMID: 39968770 DOI: 10.1021/acsami.4c20193] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 02/20/2025]
Abstract
The combination of biodegradability and biocompatibility makes chitosan a principal bioresourced material in biomedical engineering, wearable technology, and medical diagnostics, particularly for integration in human interfaces for soft electronic applications. However, this requires the introduction of soft electronic circuits with the capability of recycling the functional materials, while biodegrading the substrate. This paper presents the development and characterization of biodegradable soft circuits that are constructed using stretchable and flexible substrates from plasticized chitosan and conductive functional wiring from recyclable silver nanowires (AgNWs). The chitosan substrate demonstrates tunable mechanical properties with a maximum stretchability of ∼116%, in addition to desirable characteristics such as transparency, breathability, and controlled degradation. The plasticizing effect of glycerol reduces the rigidity associated with pure chitosan and imparts flexibility and stretchability to the AgNW-chitosan-glycerol (AgNW-Chi-Gly) composite. The AgNWs embedded in the Chi-Gly matrix are highly conductive, and their functionality in soft electronic devices such as strain sensors and electromyography (EMG) sensors is demonstrated. We show that the soft chitosan-based substrates can be subject to biodegradation at the end of their operational lifespan. The AgNWs can be recycled and reused, enhancing the overall sustainability of such soft electronic devices.
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Affiliation(s)
- Mesbah Ahmad
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
- Department of Chemical Engineering, Bangladesh University of Engineering and Technology, Dhaka 1000, Bangladesh
| | - Darpan Shukla
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Orlin D Velev
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
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3
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Jiang Y, Ye D, Li A, Zhang B, Han W, Niu X, Zeng M, Guo L, Zhang G, Yin Z, Huang Y. Transient charge-driven 3D conformal printing via pulsed-plasma impingement. Proc Natl Acad Sci U S A 2024; 121:e2402135121. [PMID: 38771869 PMCID: PMC11145272 DOI: 10.1073/pnas.2402135121] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/05/2024] [Accepted: 04/23/2024] [Indexed: 05/23/2024] Open
Abstract
Seamless integration of microstructures and circuits on three-dimensional (3D) complex surfaces is of significance and is catalyzing the emergence of many innovative 3D curvy electronic devices. However, patterning fine features on arbitrary 3D targets remains challenging. Here, we propose a facile charge-driven electrohydrodynamic 3D microprinting technique that allows micron- and even submicron-scale patterning of functional inks on a couple of 3D-shaped dielectrics via an atmospheric-pressure cold plasma jet. Relying on the transient charging of exposed sites arising from the weakly ionized gas jet, the specified charge is programmably deposited onto the surface as a virtual electrode with spatial and time spans of ~mm in diameter and ~μs in duration to generate a localized electric field accordantly. Therefore, inks with a wide range of viscosities can be directly drawn out from micro-orifices and deposited on both two-dimensional (2D) planar and 3D curved surfaces with a curvature radius down to ~1 mm and even on the inner wall of narrow cavities via localized electrostatic attraction, exhibiting a printing resolution of ~450 nm. In addition, several conformal electronic devices were successfully printed on 3D dielectric objects. Self-aligned 3D microprinting, with stacking layers up to 1400, is also achieved due to the electrified surfaces. This microplasma-induced printing technique exhibits great advantages such as ultrahigh resolution, excellent compatibility of inks and substrates, antigravity droplet dispersion, and omnidirectional printing on 3D freeform surfaces. It could provide a promising solution for intimately fabricating electronic devices on arbitrary 3D surfaces.
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Affiliation(s)
- Yu Jiang
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Dong Ye
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Aokang Li
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Bo Zhang
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, Shaanxi710049, People's Republic of China
| | - Wenhu Han
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, Shaanxi710049, People's Republic of China
| | - Xuechen Niu
- Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Mingtao Zeng
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Lianbo Guo
- Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Guanjun Zhang
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, Shaanxi710049, People's Republic of China
| | - Zhouping Yin
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - YongAn Huang
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
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4
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Li X, Chen W, Li H, Shen B, He J, Gao H, Bin F, Li H, Xiao D. Temperature Self-Compensating Intelligent Wireless Measuring Contact Lens for Quantitative Intraocular Pressure Monitoring. ACS APPLIED MATERIALS & INTERFACES 2024; 16:22522-22531. [PMID: 38651323 DOI: 10.1021/acsami.4c02289] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 04/25/2024]
Abstract
Flexible bioelectronic devices that can perform real-time and accurate intraocular pressure (IOP) monitoring in both clinical and home settings hold significant implications for the diagnosis and treatment of glaucoma, yet they face challenges due to the open physiological environment of the ocular. Herein, we develop an intelligent wireless measuring contact lens (WMCL) incorporating a dual inductor-capacitor-resistor (LCR) resonant system to achieve temperature self-compensation for quantitative IOP monitoring in different application environments. The WMCL utilizes a compact circuitry design, which enables the integration of low-frequency and high-frequency resonators within a single layer of a sensing circuit without causing visual impairment. Mechanically guided microscale 3D encapsulation strategy combined with flexible circuit printing techniques achieves the surface-adaptive fabrication of the WMCL. The specific design of frequency separation imparts distinct temperature response characteristics to the dual resonators, and the linear combination of the dual resonators can eliminate the impact of temperature variations on measurement accuracy. The WMCL demonstrates outstanding sensitivity and linearity in monitoring the IOP of porcine eyes in vitro while maintaining satisfactory measurement accuracy even with internal temperature variations exceeding 10 °C. Overcoming the impact of temperature variations on IOP monitoring from the system level, the WMCL showcases immense potential as the next generation of all-weather IOP monitoring devices.
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Affiliation(s)
- Xu Li
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China
| | - Wei Chen
- Beijing Friendship Hospital, Capital Medical University, Beijing 100050, China
- Beijing University of Technology, Beijing 100124, China
| | - Hongyang Li
- Beijing Friendship Hospital, Capital Medical University, Beijing 100050, China
| | - Biwen Shen
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China
| | - Jiangang He
- Avic Chengdu Aircraft Design & Research Institute, Chengdu 610041, China
| | - Huanlin Gao
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China
| | - Fengjiao Bin
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China
| | - Hui Li
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China
| | - Dengbao Xiao
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China
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5
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Li X, Chen L, Yu G, Song L, Weng D, Ma Y, Wang J. Rapid Fabrication of High-Resolution Flexible Electronics via Nanoparticle Self-Assembly and Transfer Printing. NANO LETTERS 2024; 24:1332-1340. [PMID: 38232321 DOI: 10.1021/acs.nanolett.3c04316] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 01/19/2024]
Abstract
Printed electronic technology serves as a key component in flexible electronics and wearable devices, yet achieving compatibility with both high resolution and high efficiency remains a significant challenge. Here, we propose a rapid fabrication method of high-resolution nanoparticle microelectronics via self-assembly and transfer printing. The tension gradient-electrostatic attraction composite-induced nanoparticle self-assembly strategy is constructed, which can significantly enhance the self-assembly efficiency, stability, and coverage by leveraging the meniscus Marangoni effect and the electric double-layer effect. The close-packed nanoparticle self-assembly layer can be rapidly formed on microstructure surfaces over a large area. Inspired by ink printing, a transfer printing strategy is further proposed to transform the self-assembly layer into conformal micropatterns. Large-area, high-resolution (2 μm), and ultrathin (1 μm) nanoparticle microelectronics can be stably fabricated, yielding a significant improvement over fluid printing methods. The unique deformability, recoverability, and scalability of nanoparticle microelectronics are revealed, providing promising opportunities for various academic and real applications.
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Affiliation(s)
- Xuan Li
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Lei Chen
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Guoxu Yu
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Lele Song
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Ding Weng
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Yuan Ma
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Jiadao Wang
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
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6
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Gong S, Lu Y, Yin J, Levin A, Cheng W. Materials-Driven Soft Wearable Bioelectronics for Connected Healthcare. Chem Rev 2024; 124:455-553. [PMID: 38174868 DOI: 10.1021/acs.chemrev.3c00502] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/05/2024]
Abstract
In the era of Internet-of-things, many things can stay connected; however, biological systems, including those necessary for human health, remain unable to stay connected to the global Internet due to the lack of soft conformal biosensors. The fundamental challenge lies in the fact that electronics and biology are distinct and incompatible, as they are based on different materials via different functioning principles. In particular, the human body is soft and curvilinear, yet electronics are typically rigid and planar. Recent advances in materials and materials design have generated tremendous opportunities to design soft wearable bioelectronics, which may bridge the gap, enabling the ultimate dream of connected healthcare for anyone, anytime, and anywhere. We begin with a review of the historical development of healthcare, indicating the significant trend of connected healthcare. This is followed by the focal point of discussion about new materials and materials design, particularly low-dimensional nanomaterials. We summarize material types and their attributes for designing soft bioelectronic sensors; we also cover their synthesis and fabrication methods, including top-down, bottom-up, and their combined approaches. Next, we discuss the wearable energy challenges and progress made to date. In addition to front-end wearable devices, we also describe back-end machine learning algorithms, artificial intelligence, telecommunication, and software. Afterward, we describe the integration of soft wearable bioelectronic systems which have been applied in various testbeds in real-world settings, including laboratories that are preclinical and clinical environments. Finally, we narrate the remaining challenges and opportunities in conjunction with our perspectives.
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Affiliation(s)
- Shu Gong
- Department of Chemical & Biological Engineering, Monash University, Clayton, Victoria 3800, Australia
| | - Yan Lu
- Department of Chemical & Biological Engineering, Monash University, Clayton, Victoria 3800, Australia
| | - Jialiang Yin
- Department of Chemical & Biological Engineering, Monash University, Clayton, Victoria 3800, Australia
| | - Arie Levin
- Department of Chemical & Biological Engineering, Monash University, Clayton, Victoria 3800, Australia
| | - Wenlong Cheng
- Department of Chemical & Biological Engineering, Monash University, Clayton, Victoria 3800, Australia
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7
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Xu X, Xue P, Gao M, Li Y, Xu Z, Wei Y, Zhang Z, Liu Y, Wang L, Liu H, Cheng B. Assembled one-dimensional nanowires for flexible electronic devices via printing and coating: Techniques, applications, and perspectives. Adv Colloid Interface Sci 2023; 321:102987. [PMID: 37852138 DOI: 10.1016/j.cis.2023.102987] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/25/2023] [Revised: 07/10/2023] [Accepted: 08/26/2023] [Indexed: 10/20/2023]
Abstract
The rapid progress in flexible electronic devices has necessitated continual research into nanomaterials, structural design, and fabrication processes. One-dimensional nanowires, characterized by their distinct structures and exceptional properties, are considered essential components for various flexible electronic devices. Considerable attention has been directed toward the assembly of nanowires, which presents significant advantages. Printing and coating techniques can be used to assemble nanowires in a relatively simple, efficient, and cost-competitive manner and exhibit potential for scale-up production in the foreseeable future. This review aims to provide an overview of nanowire assembly using printing and coating techniques, such as bar coating, spray coating, dip coating, blade coating, 3D printing, and so forth. The application of assembled nanowires in flexible electronic devices is subsequently discussed. Finally, further discussion is presented on the potential and challenges of flexible electronic devices based on assembled nanowires via printing and coating.
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Affiliation(s)
- Xin Xu
- State Key Laboratory of Biobased Fiber Manufacturing Technology, Tianjin Key Laboratory of Pulp and Paper, Tianjin University of Science and Technology, Tianjin 300457, PR China
| | - Pan Xue
- State Key Laboratory of Biobased Fiber Manufacturing Technology, Tianjin Key Laboratory of Pulp and Paper, Tianjin University of Science and Technology, Tianjin 300457, PR China; School of Chemistry and Chemical Engineering, Yangzhou University, Yangzhou, Jiangsu 225002, PR China
| | - Meng Gao
- State Key Laboratory of Biobased Fiber Manufacturing Technology, Tianjin Key Laboratory of Pulp and Paper, Tianjin University of Science and Technology, Tianjin 300457, PR China
| | - Yibin Li
- State Key Laboratory of Biobased Fiber Manufacturing Technology, Tianjin Key Laboratory of Pulp and Paper, Tianjin University of Science and Technology, Tianjin 300457, PR China
| | - Zijun Xu
- State Key Laboratory of Biobased Fiber Manufacturing Technology, Tianjin Key Laboratory of Pulp and Paper, Tianjin University of Science and Technology, Tianjin 300457, PR China
| | - Yu Wei
- State Key Laboratory of Biobased Fiber Manufacturing Technology, Tianjin Key Laboratory of Pulp and Paper, Tianjin University of Science and Technology, Tianjin 300457, PR China
| | - Zhengjian Zhang
- State Key Laboratory of Biobased Fiber Manufacturing Technology, Tianjin Key Laboratory of Pulp and Paper, Tianjin University of Science and Technology, Tianjin 300457, PR China
| | - Yang Liu
- State Key Laboratory of Biobased Fiber Manufacturing Technology, Tianjin Key Laboratory of Pulp and Paper, Tianjin University of Science and Technology, Tianjin 300457, PR China.
| | - Lei Wang
- School of Pharmaceutical Sciences, Shandong First Medical University & Shandong Academy of Medical Sciences, Jinan, Shandong 250117, PR China.
| | - Hongbin Liu
- State Key Laboratory of Biobased Fiber Manufacturing Technology, Tianjin Key Laboratory of Pulp and Paper, Tianjin University of Science and Technology, Tianjin 300457, PR China
| | - Bowen Cheng
- State Key Laboratory of Biobased Fiber Manufacturing Technology, Tianjin Key Laboratory of Pulp and Paper, Tianjin University of Science and Technology, Tianjin 300457, PR China.
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Bo R, Xu S, Yang Y, Zhang Y. Mechanically-Guided 3D Assembly for Architected Flexible Electronics. Chem Rev 2023; 123:11137-11189. [PMID: 37676059 PMCID: PMC10540141 DOI: 10.1021/acs.chemrev.3c00335] [Citation(s) in RCA: 19] [Impact Index Per Article: 9.5] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/22/2023] [Indexed: 09/08/2023]
Abstract
Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.
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Affiliation(s)
- Renheng Bo
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Shiwei Xu
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Youzhou Yang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Yihui Zhang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
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Lee G, Hossain O, Jamalzadegan S, Liu Y, Wang H, Saville AC, Shymanovich T, Paul R, Rotenberg D, Whitfield AE, Ristaino JB, Zhu Y, Wei Q. Abaxial leaf surface-mounted multimodal wearable sensor for continuous plant physiology monitoring. SCIENCE ADVANCES 2023; 9:eade2232. [PMID: 37043563 PMCID: PMC10096584 DOI: 10.1126/sciadv.ade2232] [Citation(s) in RCA: 25] [Impact Index Per Article: 12.5] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/01/2022] [Accepted: 03/16/2023] [Indexed: 06/19/2023]
Abstract
Wearable plant sensors hold tremendous potential for smart agriculture. We report a lower leaf surface-attached multimodal wearable sensor for continuous monitoring of plant physiology by tracking both biochemical and biophysical signals of the plant and its microenvironment. Sensors for detecting volatile organic compounds (VOCs), temperature, and humidity are integrated into a single platform. The abaxial leaf attachment position is selected on the basis of the stomata density to improve the sensor signal strength. This versatile platform enables various stress monitoring applications, ranging from tracking plant water loss to early detection of plant pathogens. A machine learning model was also developed to analyze multichannel sensor data for quantitative detection of tomato spotted wilt virus as early as 4 days after inoculation. The model also evaluates different sensor combinations for early disease detection and predicts that minimally three sensors are required including the VOC sensors.
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Affiliation(s)
- Giwon Lee
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27695, USA
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, NC 27695, USA
- Department of Chemical Engineering, Kwangwoon University, Seoul 01897, Republic of Korea
| | - Oindrila Hossain
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Sina Jamalzadegan
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Yuxuan Liu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Hongyu Wang
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Amanda C. Saville
- Department of Entomology and Plant Pathology, North Carolina State University, Raleigh, NC 27695, USA
| | - Tatsiana Shymanovich
- Department of Entomology and Plant Pathology, North Carolina State University, Raleigh, NC 27695, USA
| | - Rajesh Paul
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Dorith Rotenberg
- Department of Entomology and Plant Pathology, North Carolina State University, Raleigh, NC 27695, USA
- Emerging Plant Disease and Global Food Security Cluster, North Carolina State University, Raleigh, NC 27695, USA
| | - Anna E. Whitfield
- Department of Entomology and Plant Pathology, North Carolina State University, Raleigh, NC 27695, USA
- Emerging Plant Disease and Global Food Security Cluster, North Carolina State University, Raleigh, NC 27695, USA
| | - Jean B. Ristaino
- Department of Entomology and Plant Pathology, North Carolina State University, Raleigh, NC 27695, USA
- Emerging Plant Disease and Global Food Security Cluster, North Carolina State University, Raleigh, NC 27695, USA
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Qingshan Wei
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27695, USA
- Emerging Plant Disease and Global Food Security Cluster, North Carolina State University, Raleigh, NC 27695, USA
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10
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Bian M, Qian Y, Cao H, Huang T, Ren Z, Dai X, Zhang S, Qiu Y, Si R, Yang L, Yin S. Chemically Welding Silver Nanowires toward Transferable and Flexible Transparent Electrodes in Heaters and Double-Sided Perovskite Solar Cells. ACS APPLIED MATERIALS & INTERFACES 2023; 15:13307-13318. [PMID: 36880523 DOI: 10.1021/acsami.2c21996] [Citation(s) in RCA: 11] [Impact Index Per Article: 5.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Silver nanowires (AgNWs) are important materials for flexible transparent electrodes (FTEs). However, the loose stacking of nanowire junctions greatly affects the electric conductivity across adjacent nanowires. Soldering can effectively reduce the wire-wire contact resistance of AgNWs by epitaxially depositing nanosolders at the junctions, but the process normally needs to be performed with high energy consumption. In this work, we proposed a simple room-temperature method to achieve precise welding of junctions by adjusting the wettability of the soldered precursor solution on the surfaces of AgNWs. The nanoscale welding at nanowire cross junctions forms efficient conductive networks. Furthermore, reduced graphene oxide (rGO) was used to improve the stability of FTEs by wrapping the rGO around the AgNW surface. The obtained FTE shows a figure-of-merit (FoM) of up to 439.3 (6.5 Ω/sq at a transmittance of 88%) and has significant bending stability and environmental and acidic stability. A flexible transparent heater was successfully constructed, which could reach up to 160 °C within a short response time (43 s) and exhibit excellent switching stability. When laminating this FTE onto half perovskite solar cells as the top electrodes, the obtained double-side devices achieved power conversion efficiencies as high as 16.15% and 13.91% from each side, pointing out a convenient method for fabricating double-sided photovoltaic devices.
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Affiliation(s)
- Mengxi Bian
- Key Laboratory of Display Materials and Photoelectric Devices (Ministry of Education), School of Science, Tianjin University of Technology, Tianjin 300384, PR China
- Tianjin Key Laboratory for Photoelectric Materials and Devices & National Demonstration Center for Experimental Function Materials Education, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, PR China
| | - Yicheng Qian
- Tianjin Key Laboratory for Photoelectric Materials and Devices & National Demonstration Center for Experimental Function Materials Education, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, PR China
| | - Huanqi Cao
- Key Laboratory of Display Materials and Photoelectric Devices (Ministry of Education), School of Science, Tianjin University of Technology, Tianjin 300384, PR China
- Tianjin Key Laboratory for Photoelectric Materials and Devices & National Demonstration Center for Experimental Function Materials Education, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, PR China
| | - Tingting Huang
- Tianjin Key Laboratory for Photoelectric Materials and Devices & National Demonstration Center for Experimental Function Materials Education, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, PR China
| | - Zhixin Ren
- Tianjin Key Laboratory for Photoelectric Materials and Devices & National Demonstration Center for Experimental Function Materials Education, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, PR China
| | - Xiaodong Dai
- Key Laboratory of Display Materials and Photoelectric Devices (Ministry of Education), School of Science, Tianjin University of Technology, Tianjin 300384, PR China
- Tianjin Key Laboratory for Photoelectric Materials and Devices & National Demonstration Center for Experimental Function Materials Education, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, PR China
| | - Shifu Zhang
- Tianjin Key Laboratory for Photoelectric Materials and Devices & National Demonstration Center for Experimental Function Materials Education, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, PR China
| | - Yuan Qiu
- Tianjin Key Laboratory for Photoelectric Materials and Devices & National Demonstration Center for Experimental Function Materials Education, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, PR China
| | - Rongmei Si
- Tianjin Baoxingwei Technology Co. Ltd., Economic Development Zone of Baodi District, Tianjin 301800, PR China
| | - Liying Yang
- Key Laboratory of Display Materials and Photoelectric Devices (Ministry of Education), School of Science, Tianjin University of Technology, Tianjin 300384, PR China
- Tianjin Key Laboratory for Photoelectric Materials and Devices & National Demonstration Center for Experimental Function Materials Education, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, PR China
| | - Shougen Yin
- Key Laboratory of Display Materials and Photoelectric Devices (Ministry of Education), School of Science, Tianjin University of Technology, Tianjin 300384, PR China
- Tianjin Key Laboratory for Photoelectric Materials and Devices & National Demonstration Center for Experimental Function Materials Education, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, PR China
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