Influence of non-metallic parts of waste printed circuit boards on the properties of plasticised polyvinyl chloride recycled from the waste wire

High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites

The reutilization non-metallic components from a waste-printed circuit board (WPCB) has become one of the most significant bottlenecks in the comprehensive reuse of electronic wastes due to its low value and complex compositions, and it has received great attention from scientific and industrial researchers. To effectively address the environmental pollution caused by inappropriate recycling methods, such as incineration and landfill, extensive efforts have been dedicated to achieving the high value-added reutilization of WPCB non-metals in sustainable polymer composites. In this review, recent progress in developing sustainable polymer composites based on WPCB non-metallic components was systematically summarized. It has been demonstrated that the WPCB non-metals can serve as a promising reinforcing and functional fillers to significantly ameliorate some of the physical and chemical properties of polymer composites, such as excellent mechanical properties, enhanced thermal stability, and flame retardancy. The recovery strategies and composition of WPCB non-metals were also briefly discussed. Finally, the future potentials and remaining challenges regarding the reutilization of WPCB non-metallic components are outlined. This work provides readers with a comprehensive understanding of the preparation, structure, and properties of the polymer composites based on WPCB non-metals, providing significant insights regarding the high value-added reutilization of WPCB non-metals of electronic wastes.

The Development of Environmentally Sustainable Poly(vinyl chloride) Composite from Waste Non-Metallic Printed Circuit Board with Interfacial Agents

The recycling of non-metallic printed circuit boards (NMPCB) as a filler in poly(vinyl chloride) (PVC) composite would help to encourage the use of waste NMPCB, thus, reducing some environmental concerns with regard to e-waste. The objective of this study was to comprehensively evaluate the effect of different interfacial agents, namely polypropylene grafted maleic anhydride (PP-g-MAH) and ϒ-aminopropyltriethoxy silane (ATPS) on the morphology and properties of PVC/NMPCB composites. A PVC/NMPCB composite was prepared by melt compounding with varying amounts of NMPCB ranging between 10, 20 and 30 wt.%. Fourier transform infrared spectroscopy-attenuated total reflectance (FTIR-ATR) analysis revealed the interactions between PVC and NMPCB when using both PP-g-MAH and ATPS interfacial agent. The properties and morphology of PVC/NMPCB composites were significantly dependent on the interfacial agent treated on the NMPCB surface. The phase morphology and mechanical properties of PVC/NMPCB composites (30 wt.% of NMPCB) were improved and the result also indicated that the higher compatibility of composites with ATPS as an interfacial agent led to our obtaining the maximum Young's modulus of 484 MPa. The dynamic mechanical analysis revealed the interaction at the interface, with the T_g shifting to a lower temperature in the presence of PP-g-MAH and strong interfacial adhesion noted with the improved T_g in the presence of the ATPS interfacial agent. Further evidence of the improved interaction was observed with the increment in density in the presence of ATPS when compared with PP-g-MAH in PVC/NMPCB composite. Hence, of the two interfacial agents, ATPS showed itself to be more effective when employed as an interfacial agent for NMPCB in PVC composite for industry.

Recycling Waste Nonmetallic Printed Circuit Boards for Polyvinyl Chloride Composites

To reduce environmental threats, such as land filling, incineration and soil pollution, which are associated with the improper waste management of waste printed circuit boards, the utilization of NMPCBs from waste PCBs as a filler in composites was pursued. Untreated and treated NMPCBs in varying ratios, 10–30 wt.%, were blended with PVC to produce NMPCB/PVC composites, using the melt-mixing method via an internal mixer, in order to solve the remaining NMPCB waste problem after the valuable metals in PCBs were recovered. The incorporation of the NMPCB with PVC resulted in an increase in the tensile modulus and the thermal stability of the resulting composites. Scanning electron microscopy (SEM) results indicated improved interfacial adhesion between the treated NMPCB and the PVC matrix. The FTIR results of the NMPCB treated with 3-glycidyloxypropyltrimethoxysilane (GPTMS) revealed the formation of Si-O-Si bonds. The densities of the composites were found to increase with an increase in the content of the treated NMPCB, and compatibility improved. The tensile properties of the treated NMPCB/PVC composites were higher than those of the untreated NMPCB/PVC composites, suggesting improved compatibility between the treated NMPCB and PVC. The PVC composite with 10 wt.% of the treated NMPCB showed the optimum tensile properties. It was observed that the tensile modulus of the treated NMPCB/PVC composite increased by 47.65% when compared to that of the neat PVC. The maximum thermal degradation temperature was 27 °C higher than that of the neat PVC. Dynamic mechanical analysis results also support the improved interfacial adhesion as a result of the improvement in the storage modulus at the glassy region, and the loss factor (tan δ) peak shifted to a higher temperature range than that of the PVC and the untreated NMPCB/PVC composite. These studies reveal that the NMPCB was successfully modified with 1 wt.% of GPTMS, which promoted the dispersion and interfacial adhesion in the PVC matrix, resulting in better tensile properties and better thermal stability of the PVC composite.

Development of thermoplastic composites based on recycled polypropylene and waste printed circuit boards

In the last several years, the electronic waste, especially printed circuit boards have significantly increased over the world, generating one of the highest rates of solid waste. The recycling process of the printed circuit boards implies mainly the recovery of metals and glass fibers, while the reuse of the polymeric support has remained largely in the phase of research. In this paper, the non-metallic part of printed circuit boards was used as filler (up to 30%), but also to improve the fire resistance of thermoplastic composites based on recycled polypropylene and diene block-copolymers. The synergy between the elastic effect of elastomers and the reinforcing effect of the waste powder into the thermoplastic matrix was studied by mechanical and dynamo-mechanical analysis, X-ray diffraction, optical microscopy, micro-calorimetry and thermo-gravimetrical analysis. Improved mechanical properties, especially impact strength was observed. The compatibization of components considering the interactions between the ethylene-butylene blocks from the hydrogenated and maleinized styrene-butadiene block-copolymer and recycled polypropylene, respectively between the MA groups and the functionalities of the waste powder, evidenced by FTIR, was highlighted by changes in the X-ray pattern and an increased fire resistance and thermal stability.