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Sienkiewicz A, Czub P. A Method of Managing Waste Oak Flour as a Biocomponent for Obtaining Composites Based on Modified Soybean Oil. MATERIALS (BASEL, SWITZERLAND) 2022; 15:ma15217737. [PMID: 36363330 PMCID: PMC9656467 DOI: 10.3390/ma15217737] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/11/2022] [Revised: 10/26/2022] [Accepted: 10/28/2022] [Indexed: 05/14/2023]
Abstract
The aim of the present research was the development of a management method for wood-processing waste that was obtained during the production of parquet flooring. Currently mostly useless, such waste mainly ends up in landfills. The oak waste flour was used as a reinforcement material for epoxy biocomposites based on the polyaddition product of epoxidized soybean oil and bisphenol-A (ESBO_BPA). The biofiller was subjected to mercerization, acetylation, and diisocyanate modification to increase the typically poor compatibility between the highly hydrophilic wood fibers and the hydrophobic polymer matrix. Among the analyzed epoxy biocomposites, which contained about 60% raw materials of natural origin, it was found that the best mechanical properties were recorded for cured samples of the ESBO_BPA composition filled with 5 wt % of oak flour mercerized using a 5% solution of NaOH. It was also proven that a higher concentration of alkali deteriorated the mechanical-strengthening properties of the wood filler. The acetylation of the biofiller independently in the best elimination of hydroxyl groups from its structure also removed irregular strips and smoothed its surface. This resulted in a poorer wettability of the oak flour surface by the polymer and consequently an easier pullout of the filler from the polymer matrix and worse mechanical properties of the wood/epoxy composite. To the best of the authors' knowledge, the present research was the first to examine the possibility of the application of parquet flooring post-production wood flour in biomaterials based on a polyaddition product of epoxidized soybean oil and bisphenol-A.
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Sienkiewicz A, Czub P. Rheological Analysis of the Synthesis of High-Molecular-Weight Epoxy Resins from Modified Soybean Oil and Bisphenol A or BPA-Based Epoxy Resins. MATERIALS (BASEL, SWITZERLAND) 2021; 14:6770. [PMID: 34832171 PMCID: PMC8624956 DOI: 10.3390/ma14226770] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 09/21/2021] [Revised: 11/02/2021] [Accepted: 11/06/2021] [Indexed: 12/21/2022]
Abstract
The research undertaken in this work is one of the examples of the engineering of modern polymer materials. This manuscript presents studies on the gelation process which might occur during the synthesis of epoxy resin using the modified vegetable oil via the epoxy fusion process conducted in bulk. Based on obtained results we determined rheological parameters related to the properties of reacting mixture during the polyaddition process, especially before and after occurring the phenomenon of gelation (via (1) theoretical determination of the gel point using the degree of conversion of reactants before occurring the gelation process of reacting mixture and (2) experimentally-the dynamic mechanical properties such as storage modulus, G'; loss modulus, G″; and loss tangent, tg δ). Theoretical investigations show that for both systems: epoxidized soybean oil and bisphenol A (ESBO_BPA), as well as the hydroxylated soybean oil and low molecular weight epoxy resin (SMEG_EPR), theoretical values of the degree of conversion at the gel point are characterized by similar values (ESBO_BPA: xgel-theoretical = 0.620, xgel-theoretical = 0.620 and SMEG_EPR: xgel-theoretical = 0.614, xgel-experiment = 0.630, respectively), while the one determined based on the initial assumptions are greater than the above-mentioned (ESBO_BPA: xgel-assumed = 0.696 and SMEG_EPR: xgel-assumed = 0.667). Moreover, experimental studies in the viscoelastic fluid stage showed that the SMEG_EPR system is characterized by lower values of G' and G″, which indicates lower elasticity and lower viscosity than the epoxidized derivative. It was found that alike during the conventional polyaddition reaction, both systems initially are homogeneous liquids of increasing viscosity. Wherein gradual increase in viscosity of the reaction mixture is related to the fusion of oligomer molecules and the formation of higher molecular weight products. In the critical stage of the process, known as the gelation point, the reaction mixture converts into the solid form, containing an insoluble cross-linked polymer.
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Affiliation(s)
| | - Piotr Czub
- Department of Chemistry and Technology of Polymers, Cracow University of Technology, Warszawska Str. 24, 31-155 Cracow, Poland;
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Xu Y, Xu Y, Zhu W, Zhang W, Gao Q, Li J. Improve the Performance of Soy Protein-Based Adhesives by a Polyurethane Elastomer. Polymers (Basel) 2018; 10:E1016. [PMID: 30960941 PMCID: PMC6403657 DOI: 10.3390/polym10091016] [Citation(s) in RCA: 18] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/19/2018] [Revised: 09/09/2018] [Accepted: 09/11/2018] [Indexed: 11/16/2022] Open
Abstract
The purpose of this study was to improve the performance of soy protein isolate (SPI) adhesives using a polyurethane elastomer. Triglycidylamine (TGA), SPI, thermoplastic polyurethane elastomer (TPU), and γ-(2,3-epoxypropoxy) propyltrimethoxysilane (KH-560) were used to develop a novel SPI-based adhesive. The residual rate, functional groups, thermal stability, and fracture surface micrographs of the cured adhesives were characterized. Three-ply plywood was fabricated, and the dry/wet shear strength was determined. The experimental results suggested that introducing 2% TGA improved the residual rate of the SPI/TGA adhesive by 4.1% because of the chemical cross-linking reaction between epoxy groups and protein molecules. Incorporating 7% TPU into the SPI/TGA adhesive, the residual rate of the adhesive increased by 5.2% and the dry/wet shear strength of plywood bonded by SPI/TGA/TPU adhesive increased by 10.7%/67.7%, respectively, compared with that of SPI/TGA adhesive. When using KH-560 and TPU together, the residual rate of the adhesive improved by 0.9% compared with that of SPI/TGA/TPU adhesive. The dry and wet shear strength of the plywood bonded by the SPI/TGA/TPU/KG-560 adhesive further increased by 23.2% and 23.6% respectively when compared with that of SPI/TGA/TPU adhesive. TPU physically combined with the SPI/TGA adhesive to form a interpenetration network and KH-560 acted as a bridge to connect TPU and SPI/TGA to form a joined crosslinking network, which improved the thermo stability/toughness of the adhesive and created a uniform ductile fracture section of the adhesive.
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Affiliation(s)
- Yecheng Xu
- Key Laboratory of Wood Material Science and Utilization, Beijing Forestry University, Beijing 100083, China.
- Ministry of Education, Beijing Key Laboratory of Wood Science and Engineering, College of Materials Science and Technology, Beijing Forestry University, Beijing 100083, China.
| | - Yantao Xu
- Key Laboratory of Wood Material Science and Utilization, Beijing Forestry University, Beijing 100083, China.
- Ministry of Education, Beijing Key Laboratory of Wood Science and Engineering, College of Materials Science and Technology, Beijing Forestry University, Beijing 100083, China.
| | - Wenjie Zhu
- Key Laboratory of Wood Material Science and Utilization, Beijing Forestry University, Beijing 100083, China.
- Ministry of Education, Beijing Key Laboratory of Wood Science and Engineering, College of Materials Science and Technology, Beijing Forestry University, Beijing 100083, China.
| | - Wei Zhang
- Key Laboratory of Wood Material Science and Utilization, Beijing Forestry University, Beijing 100083, China.
- Ministry of Education, Beijing Key Laboratory of Wood Science and Engineering, College of Materials Science and Technology, Beijing Forestry University, Beijing 100083, China.
| | - Qiang Gao
- Key Laboratory of Wood Material Science and Utilization, Beijing Forestry University, Beijing 100083, China.
- Ministry of Education, Beijing Key Laboratory of Wood Science and Engineering, College of Materials Science and Technology, Beijing Forestry University, Beijing 100083, China.
| | - Jianzhang Li
- Key Laboratory of Wood Material Science and Utilization, Beijing Forestry University, Beijing 100083, China.
- Ministry of Education, Beijing Key Laboratory of Wood Science and Engineering, College of Materials Science and Technology, Beijing Forestry University, Beijing 100083, China.
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