Inkjet printing of copper wire on PET substrate

Metallisation of Textiles and Protection of Conductive Layers: An Overview of Application Techniques

The rapid growth in wearable technology has recently stimulated the development of conductive textiles for broad application purposes, i.e., wearable electronics, heat generators, sensors, electromagnetic interference (EMI) shielding, optoelectronic and photonics. Textile material, which was always considered just as the interface between the wearer and the environment, now plays a more active role in different sectors, such as sport, healthcare, security, entertainment, military, and technical sectors, etc. This expansion in applied development of e-textiles is governed by a vast amount of research work conducted by increasingly interdisciplinary teams and presented systematic review highlights and assesses, in a comprehensive manner, recent research in the field of conductive textiles and their potential application for wearable electronics (so called e-textiles), as well as development of advanced application techniques to obtain conductivity, with emphasis on metal-containing coatings. Furthermore, an overview of protective compounds was provided, which are suitable for the protection of metallized textile surfaces against corrosion, mechanical forces, abrasion, and other external factors, influencing negatively on the adhesion and durability of the conductive layers during textiles' lifetime (wear and care). The challenges, drawbacks and further opportunities in these fields are also discussed critically.

Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic-Sintered Copper Membrane for Printed Flexible Hybrid Electronics

Inkjet-printed electronics using metal particles typically lack electrical conductivity and interfacial adhesion with an underlying substrate. To address the inherent issues of printed materials, this Research Article introduces advanced materials and processing methodologies. Enhanced adhesion of the inkjet-printed copper (Cu) on a flexible polyimide film is achieved by using a new surface modification technique, a nanostructured self-assembled monolayer (SAM) of (3-mercaptopropyl)trimethoxysilane. A standardized adhesion test reveals the superior adhesion strength (1192.27 N/m) of printed Cu on the polymer film, while maintaining extreme mechanical flexibility proven by 100 000 bending cycles. In addition to the increased adhesion, the nanostructured SAM treatment on printed Cu prevents formation of native oxide layers. The combination of the newly synthesized Cu ink and associated sintering technique with an intense pulsed ultraviolet and visible light absorption enables ultrahigh conductivity of printed Cu (2.3 × 10^-6 Ω·cm), which is the highest electrical conductivity reported to date. The comprehensive materials engineering technologies offer highly reliable printing of Cu patterns for immediate use in wearable flexible hybrid electronics. In vivo demonstration of printed, skin-conformal Cu electrodes indicates a very low skin-electrode impedance (<50 kΩ) without a conductive gel and successfully measures three types of biopotentials, including electrocardiograms, electromyograms, and electrooculograms.