Polyhedral oligomeric silsesquioxane-supported ionic liquid for designing nanostructured hybrid organic-inorganic networks

Multifunctional Properties of Polyhedral Oligomeric Silsesquioxanes (POSS)-Based Epoxy Nanocomposites

In this study, a tetrafunctional epoxy resin was loaded with 5 wt% of three different types of polyhedral oligomeric silsesquioxane (POSS) compounds, namely, DodecaPhenyl POSS (DPHPOSS), Epoxycyclohexyl POSS (ECPOSS), Glycidyl POSS (GPOSS), and 0.5 wt% of multi-walled carbon nanotubes (CNTs) in order to formulate multifunctional structural nanocomposites tailored for aeronautic and aerospace applications. This work aims to demonstrate how the skillful combination of desired properties, such as good electrical, flame-retardant, mechanical, and thermal properties, is obtainable thanks to the advantages connected with nanoscale incorporations of nanosized CNTs with POSS. The special hydrogen bonding-based intermolecular interactions between the nanofillers have proved to be strategic in imparting multifunctionality to the nanohybrids. All multifunctional formulations are characterized by a Tg centered at values close to 260 °C, fully satisfying structural requirements. Infrared spectroscopy and thermal analysis confirm the presence of a cross-linked structure characterized by a high curing degree of up to 94% and high thermal stability. Tunneling atomic force microscopy (TUNA) allows to detect the map of the electrical pathways at the nanoscale of the multifunctional samples, highlighting a good dispersion of the carbon nanotubes within the epoxy resin. The combined action of POSS with CNTs has allowed to obtain the highest values of self-healing efficiency if compared to those measured for samples containing only POSS in the absence of CNTs.

New Epoxy Thermosets Organic-Inorganic Hybrid Nanomaterials Derived from Imidazolium Ionic Liquid Monomers and POSS®Ph

New epoxy-amine networks issue from epoxydized imidazolium ionic liquid monomers (ILMs) and isophorone diamine (IPD) were modified for the first time by incorporating unmodified trisilanol phenyl POSS^® (POSS^®Ph-triol) and two ionic liquid-modified POSS^®Ph (IL-g-POSS^®Ph) having chloride (Cl⁻) and bis-trifluoromethanesulfonimidate (NTf₂⁻) counter anions. Then, 5 wt.% of unmodified and IL-modified POSS^®Ph were introduced in order to develop new solid electrolytes. First, a homogeneous dispersion of the POSS^®Ph aggregates (diameters from 80 to 400 nm) into epoxy networks was observed. As a consequence, ILM/IPD networks with glass transition temperatures between 45 and 71 °C combined with an enhancement of the thermal stability (>380 °C) were prepared. Moreover, a significant increase of the hydrophobic character and high oil repellency of the network surfaces were obtained by using IL-g-POSS^®Ph (19–20 mJ.m⁻²), opening up promising prospects for surface coating applications. Finally, these new epoxy networks exhibited outstanding high ionic conductivities (from 3.4 × 10⁻⁸ to 6.8 × 10⁻² S.m⁻¹) combined with an increase in permitivity.

Developing an epoxy resin with high toughness for grouting material via co-polymerization method

In order to improve the toughness of epoxy resin for grouting material, the flexible hexamethylene diisocyanate (HDI) was utilized to manufacture a new kind of epoxy resin with high toughness via co-polymerization method. In the procedure of preparing bisphenol A epoxy resin, before the reaction between bisphenol A (BPA) and epichlorohydrin (ECH), HDI was introduced to react with BPA for embedding flexible segments into the chain of epoxy resin, then modified epoxy resin (HDI/EP) was manufactured. The mechanical properties, especially the toughness of the HDI/EP, are significantly increased – the fracture elongation is up to 124%. In addition, the compressed specimens can fully recover to their original shape in a few minutes. Thermal performance and corrosion resistance of the HDI/EP specimen were also investigated, which showed that the specimen can be used under 258°C, and can remain stable in H2SO4, NaOH and NaCl solutions with 10 wt% for 100 h, respectively. The present work provides a convenient avenue pathway to prepare an epoxy resin with high toughness, which may be used in many technologies.