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Jiang L, Wu B, Wei X, Lv X, Xue H, Lu G, Zeng Y, Xing J, Wu W, Wu J. Flexible lead-free piezoelectric arrays for high-efficiency wireless ultrasonic energy transfer and communication. Mater Horiz 2022; 9:2180-2190. [PMID: 35686946 DOI: 10.1039/d2mh00437b] [Citation(s) in RCA: 7] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Implantable medical electronics (IMEs) are now becoming increasingly prevalent for diagnostic and therapeutic purposes. Despite extensive efforts, a primary challenge for IMEs is reliable wireless power and communication to provide well-controlled, therapeutically relevant effects. Ultrasonic energy transfer and communication (UETC) employing traveling ultrasound waves to transmit energy has emerged as a promising wireless strategy for IMEs. Nevertheless, conventional UETC systems are rigid, bulky, and based on toxic lead-based piezoelectric materials, raising efficiency and safety concerns. Here, we present a novel transcutaneous UETC system based on a two-dimensional flexible lead-free piezoelectric array (f-LFPA) that hybridizes high-performance (piezoelectric coefficient d33 ≈ 503 pC N-1) (K,Na)NbO3-based eco-friendly piezo-units with soft structural components. The newly developed lead-free piezo-unit exhibits submicron ferroelectric domains and superior energy harvesting figures of merit (d33g33 ≈ 20 000 × 10-15 m2 N-1), resulting in the prepared f-LFPA demonstrating a high output voltage of 22.4 V, a power density of 0.145 W cm-2, and a signal-to-noise ratio of more than 30 dB within the FDA safety limits, while maintaining the flexibility for wide-angle receiving. Further ex vivo experiment demonstrates the adequate power supply capabilities of the f-LFPA and its possible application in future implantable eco-friendly bioelectronics for diagnostics, therapy, and real-time monitoring.
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Affiliation(s)
- Laiming Jiang
- College of Materials Science and Engineering, Sichuan University, Chengdu 610064, China.
| | - Bo Wu
- Sichuan Province Key Laboratory of Information Materials, Southwest Minzu University, Chengdu, 610041, P. R. China.
| | - Xiaowei Wei
- College of Materials Science and Engineering, Sichuan University, Chengdu 610064, China.
| | - Xiang Lv
- College of Materials Science and Engineering, Sichuan University, Chengdu 610064, China.
| | - Haoyue Xue
- College of Materials Science and Engineering, Sichuan University, Chengdu 610064, China.
| | - Gengxi Lu
- Department of Biomedical Engineering Viterbi School of Engineering, University of Southern California, Los Angeles, CA 90089, USA
| | - Yushun Zeng
- Department of Biomedical Engineering Viterbi School of Engineering, University of Southern California, Los Angeles, CA 90089, USA
| | - Jie Xing
- College of Materials Science and Engineering, Sichuan University, Chengdu 610064, China.
| | - Wenjuan Wu
- Sichuan Province Key Laboratory of Information Materials and Devices Application, Chengdu University of Information Technology, Chengdu 610225, P. R. China
| | - Jiagang Wu
- College of Materials Science and Engineering, Sichuan University, Chengdu 610064, China.
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