Surface state of sacrificial copper electrode by electropolishing in hydrophobic ionic liquid 1-butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide

Advantages of Electrochemical Polishing of Metals and Alloys in Ionic Liquids

Electropolishing of metal surfaces is a benign alternative to mechanical treatment. Ionic liquids are considered as green electrolytes for the electropolishing of metals. They demonstrate a number of advantages in comparison with acid aqueous solutions and other methods of producing smooth or mirror-like surfaces that are required by diverse applications (medical instruments, special equipment, implants and prostheses, etc.). A wide window of electrochemical stability, recyclability, stability and tunability are just a few benefits provided by ionic liquids in the title application. An overview of the literature data on electropolishing of such metals as Ti, Ni, Pt, Cu, Al, U, Sn, Ag, Nb, stainless steel and other alloys in ionic liquids is presented.

The Anodic Behaviour of Bulk Copper in Ethaline and 1-Butyl-3-Methylimidazolium Chloride

The anodic dissolution of bulk metallic copper was conducted in ionic liquids (ILs)—a deep eutectic solvent (DES) ((CH3)3NC2H4OH) comprised of a 1:2 molar ratio mixture of choline chloride Cl (ChCl), and ethylene glycol (EG)—and imidazolium-based ILs, such as C4mimCl, using electrochemical techniques, such as cyclic voltammetry, anodic linear sweep voltammetry, and chronopotentiometry.To investigate the electrochemical dissolution mechanism, electrochemical impedance spectroscopy (EIS) was used. In addition to spectroscopic techniques, for instance, UV-visible spectroscopy, microscopic techniques, such as atomic force microscopy (AFM), were used. The significant industrial importance of metallic copper has motivated several research groups to deal with such an invaluable metal. It was confirmed that the speciation of dissolved copper from the bulk phase at the interface region is [CuCl3]− and [CuCl4]2− in such chloride-rich media, and the EG determine the structure of the interfacial region in the electrochemical dissolution process. A super-saturated solution was produced at the electrode/solution interface and CuCl2 was deposited on the metal surface.

Synthesis of ceria based superhydrophobic coating on Ni20Cr substrate via cathodic electrodeposition

In this work, superhydrophobic cerium oxide coating surface (111) with dual scale texture on Ni20Cr substrate is obtained by combination of electropolishing the substrate and subsequent cathodic electrodeposition and long-term UVH surface relaxation. To form hierarchical structures of CeO2 is controllable by varying the substrate roughness, and electropolishing period. The results indicated that at the optimal condition, the surface of the cerium oxide coating showed a superhydrophobicity with a great water contact angle (151.0 ± 1.4°) with Gecko state. An interface model for electropolishing of substrate surface in cerium nitrate medium is proposed. We expect that this facile process can be readily and widely adopted for the design of superhydrophobic coating on engineering materials.