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Wen TH, Hung JM, Huang WH, Jhang CJ, Lo YC, Hsu HH, Ke ZE, Chen YC, Chin YH, Su CI, Khwa WS, Lo CC, Liu RS, Hsieh CC, Tang KT, Ho MS, Chou CC, Chih YD, Chang TYJ, Chang MF. Fusion of memristor and digital compute-in-memory processing for energy-efficient edge computing. Science 2024; 384:325-332. [PMID: 38669568 DOI: 10.1126/science.adf5538] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 12/03/2022] [Accepted: 03/19/2024] [Indexed: 04/28/2024]
Abstract
Artificial intelligence (AI) edge devices prefer employing high-capacity nonvolatile compute-in-memory (CIM) to achieve high energy efficiency and rapid wakeup-to-response with sufficient accuracy. Most previous works are based on either memristor-based CIMs, which suffer from accuracy loss and do not support training as a result of limited endurance, or digital static random-access memory (SRAM)-based CIMs, which suffer from large area requirements and volatile storage. We report an AI edge processor that uses a memristor-SRAM CIM-fusion scheme to simultaneously exploit the high accuracy of the digital SRAM CIM and the high energy-efficiency and storage density of the resistive random-access memory memristor CIM. This also enables adaptive local training to accommodate personalized characterization and user environment. The fusion processor achieved high CIM capacity, short wakeup-to-response latency (392 microseconds), high peak energy efficiency (77.64 teraoperations per second per watt), and robust accuracy (<0.5% accuracy loss). This work demonstrates that memristor technology has moved beyond in-lab development stages and now has manufacturability for AI edge processors.
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Affiliation(s)
- Tai-Hao Wen
- Taiwan Semiconductor Manufacturing Company Limited (TSMC), No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300, Taiwan, R.O.C
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Je-Min Hung
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Wei-Hsing Huang
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Chuan-Jia Jhang
- Taiwan Semiconductor Manufacturing Company Limited (TSMC), No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300, Taiwan, R.O.C
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Yun-Chen Lo
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Hung-Hsi Hsu
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Zhao-En Ke
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Yu-Chiao Chen
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Yu-Hsiang Chin
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Chin-I Su
- Taiwan Semiconductor Manufacturing Company Limited (TSMC), No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300, Taiwan, R.O.C
| | - Win-San Khwa
- Taiwan Semiconductor Manufacturing Company Limited (TSMC), No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300, Taiwan, R.O.C
| | - Chung-Chuan Lo
- Department of Life Science, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Ren-Shuo Liu
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Chih-Cheng Hsieh
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Kea-Tiong Tang
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
| | - Mon-Shu Ho
- Department of Physics, National Chung Hsing University (NCHU), No. 145, Xingda Rd., South Dist., Taichung City 402, Taiwan, R.O.C
| | - Chung-Cheng Chou
- Taiwan Semiconductor Manufacturing Company Limited (TSMC), No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300, Taiwan, R.O.C
| | - Yu-Der Chih
- Taiwan Semiconductor Manufacturing Company Limited (TSMC), No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300, Taiwan, R.O.C
| | - Tsung-Yung Jonathan Chang
- Taiwan Semiconductor Manufacturing Company Limited (TSMC), No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300, Taiwan, R.O.C
| | - Meng-Fan Chang
- Taiwan Semiconductor Manufacturing Company Limited (TSMC), No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300, Taiwan, R.O.C
- Department of Electrical Engineering, National Tsing Hua University (NTHU), No. 101, Sec. 2, Guangfu Rd., East Dist., Hsinchu City, Hsinchu 300, Taiwan, R.O.C
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