Prototype Development of a Temperature-Sensitive High-Adhesion Medical Tape to Reduce Medical-Adhesive-Related Skin Injury and Improve Quality of Care

Medical adhesives are used to secure wound care dressings and other critical devices to the skin. Without means of safe removal, these stronger adhesives are difficult to painlessly remove from the skin and may cause medical-adhesive-related skin injuries (MARSI), including skin tears and an increased risk of infection. Lower-adhesion medical tapes may be applied to avoid MARSI, leading to device dislodgement and further medical complications. This paper outlines the development of a high-adhesion medical tape designed for low skin trauma upon release. By warming the skin-attached tape for 10-30 s, a significant loss in adhesion was achieved. A C14/C18 copolymer was developed and combined with a selected pressure-sensitive adhesive (PSA) material. The addition of 1% C14/C18 copolymer yielded the largest temperature-responsive drop in surface adhesion. The adhesive film was characterized using AFM, and distinct nanodomains were identified on the exterior surface of the PSA. Our optimized formulation yielded 67% drop in adhesion when warmed to 45 °C, perhaps due to melting nanodomains weakening the adhesive-substrate boundary layer. Pilot clinical testing resulted in a significant decrease in pain when a heat pack was used for removal, giving an average pain reduction of 66%.

Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities

Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing agents. The curing, deoxidizing, thermal, and rheological properties were systematically investigated. For uniform film formation and maximizing deoxidizing curable abilities, a thermoplastic–thermoset mixture containing a phenyl and carboxylic acid-based additive (benzoic acid), and a polycarbonate was chosen as the model adhesive film. Without either a phenyl or an acidic group in the compatibilizing agent, deoxidizing and compatibilizing effects were not achieved. The manufactured hybrid adhesive film can be effectively used, especially for electronic devices that require deoxidization and adhesion.

[Immunomodulating activity of adhesive dental film containing chlorhexidine and ketoprofen in serum of patients with chronic periodontitis]

The study was carried out in series of preclinical tests of new adhesive dental film developed for local treatment of inflammatory periodontal disease and containing chlorhexidine bigluconate and ketoprofen. The aim of the work was to determine film's effect on the activity of blood neutrophils in healthy individuals and in patients with chronic periodontitis using luminol-dependent chemiluminescence method. The investigated dental film showed modulating influence on blood phagocytes methabolism depending on their initial functional state. Immunomodulating activity revealed is associated with the polymer base and is potentiated by ketoprofen in case of hyporeactive inflammation.

Carbon Nanotube-Doped Adhesive Films for Detecting Crack Propagation on Bonded Joints: A Deeper Understanding of Anomalous Behaviors

A novel nanoreinforced adhesive film has been developed to detect adhesive deformation and crack propagation along the bonding line by means of the electrical response of the material. Adhesive films were doped by spraying an aqueous dispersion of carbon nanotubes (CNTs) over the surface. To determine the sensitivity of bonded joints, single lap shear (SLS) and mode-I fracture energy tests have been carried out while their electrical response has been measured. It has been found that CNT-doped adhesive films are able to detect adhesive deformation and final failure for SLS specimens and crack initiation and propagation along the bonding line for mode-I specimens with a high sensitivity. Sudden increases on electrical resistance are correlated to a rapid growing of the crack length due to instability on crack propagation in a tick-slip case, whereas specimens with a more uniform crack propagation are linked to a steadier increase on electrical resistance, and both of them are properly correlated to the mechanical response. By analyzing more in detail the electrical response and comparing with theoretical approaches, the stick-slip behavior is associated with the presence of porosity and lack of adhesives because of possible manufacturing issues such as adhesive overflowing. These statements are also validated by microstructural analysis. Therefore, the potential and applicability of the proposed adhesive films for evaluating the structural integrity has been demonstrated.