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An B, Zhou H, Cao J, Ming P, Persic J, Yao J, Chang A. A Review of Silver Wire Bonding Techniques. Micromachines (Basel) 2023;14:2129. [PMID: 38004986 PMCID: PMC10673367 DOI: 10.3390/mi14112129] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/02/2023] [Revised: 11/18/2023] [Accepted: 11/18/2023] [Indexed: 11/26/2023]

Abstract

The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed.

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Key Words

bonding parameters
bonding reliability
development trends
manufacturing process
silver wire bonding

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MESH Headings Collapse

Grants

U21A2051 Joint Funds of the National Natural Science Foundation of China
232102221017 Key Science and Technology Program of Henan Province
222102230019 Technology Program of Henan Province
NSFRF210102 Fundamental Research Funds for the Universities of Henan Province
B2015-40 Doctoral Fund of Henan Polytechnic University

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Affiliation(s)

Bin An School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, China; (B.A.); (P.M.); (J.Y.); (A.C.)
Hongliang Zhou School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, China; (B.A.); (P.M.); (J.Y.); (A.C.) Henan International Joint Laboratory of Advanced Electronic Packaging Materials Precision Forming, Henan Polytechnic University, Jiaozuo 454003, China
Jun Cao School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, China; (B.A.); (P.M.); (J.Y.); (A.C.) Henan International Joint Laboratory of Advanced Electronic Packaging Materials Precision Forming, Henan Polytechnic University, Jiaozuo 454003, China
Pingmei Ming School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, China; (B.A.); (P.M.); (J.Y.); (A.C.) Henan International Joint Laboratory of Advanced Electronic Packaging Materials Precision Forming, Henan Polytechnic University, Jiaozuo 454003, China
John Persic Microbonds Inc., 7495 Birchmount Rd., Markham, ON L3R 5G2, Canada;
Jingguang Yao School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, China; (B.A.); (P.M.); (J.Y.); (A.C.)
Andong Chang School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, China; (B.A.); (P.M.); (J.Y.); (A.C.)

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Zhou H, Chang A, Fan J, Cao J, An B, Xia J, Yao J, Cui X, Zhang Y. Copper Wire Bonding: A Review. Micromachines (Basel) 2023;14:1612. [PMID: 37630148 PMCID: PMC10456435 DOI: 10.3390/mi14081612] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/12/2023] [Revised: 08/08/2023] [Accepted: 08/14/2023] [Indexed: 08/27/2023]

Abstract

This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

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Key Words

Cu wire bonding
FAB morphology
applications of simulations
bonding reliability
intermetallic compounds

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MESH Headings Collapse

Grants

U21A2051 Joint Funds of the National Natural Science Foundation of China
232102221017, 222102230019 Key Science and Technology Program of Henan Province
NSFRF210102 The Fundamental Research Funds for the Universities of Henan Province
T2023-7 Innovative Research Team of Henan Polytechnic University
B2015-40 Doctoral Fund of Henan Polytechnic University

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Affiliation(s)

Hongliang Zhou School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China; (A.C.); (B.A.); (J.X.); (J.Y.); (X.C.)
Andong Chang School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China; (A.C.); (B.A.); (J.X.); (J.Y.); (X.C.)
Junling Fan School of Chemical and Environmental Engineering, Jiaozuo University, Jiaozuo 454000, China;
Jun Cao School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China; (A.C.); (B.A.); (J.X.); (J.Y.); (X.C.)
Bin An School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China; (A.C.); (B.A.); (J.X.); (J.Y.); (X.C.)
Jie Xia School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China; (A.C.); (B.A.); (J.X.); (J.Y.); (X.C.)
Jingguang Yao School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China; (A.C.); (B.A.); (J.X.); (J.Y.); (X.C.)
Xiaobin Cui School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China; (A.C.); (B.A.); (J.X.); (J.Y.); (X.C.)
Yingchong Zhang Nanjing High Speed Gear Manufacturing Co., Ltd., Nanjing 211100, China;

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